1. Sector 002 Assembly status report
Module loading task force meeting
25 May 2004

2. Contents Sectors Glue 3-D Survey Other sector 2 Results Tool Upgrade
Procedure Upgrades
C6F14 Cooling

3. Sector
Sector 001 (FE_I1, prototype) had been assembled in 2003 with most of the final tooling, but not final glue procedures. It was never fully characterized.
Sector 002 is our pre-production sector (FE-I2.1). It has been loaded with 3 module so far using “production” tooling and glue.
Some revisions to the tooling and the procedure are now being implemented, reacting from the experience of loading the first side. Side 2 will be loaded when all the upgrades are in place.
These are incremental small changes. We are not going off in any new direction.

4. Glue
Implemented CPPM standards with a few adaptations specific to sector
Our dispenser is calibrated to 16 drops/ minute
Had some problems getting fresh glue- long lead time. Now have too much fresh glue.
Implemented new storage method
when new tubes are opened, take out each component and mix well
Transfer immediately to individual, very cheap, 3cc syringes for storage (store 2cc in each syringe)
when mixing, empty each syringe out completely into cup. This gives 1-1 by volume. Do this on scale to control that it matches 1-1 by weight, which it does for fresh glue to good accuracy.

5. Glue (cont.) Implemented glue drop mask which works very well.
Dispensing takes 10min. /module, which is acceptable
Quantity dispensed is 4 drops in outer hole + 3 drops in inner hole (16 drops/minute with CPPM syringe and needle)
80% chip area coverage (gap is 75um set by fishing line).

6. 3-D Survey A 3-D survey program has been implemented.
It only works on side 1 of a sector due to interference with the cooling pipes.
Sectors 1 and 2 have been measured (see next slide)
Both sectors show out-of-plane modules with a small systematic tilt and with some modules bowed.
We suspect the tilt is an imperfection of the tool head- deviations in the steel pins for example.
The bow as well as some random tilts are due to lack of degrees of freedom in the pickup chuck to deal with module-to-module changes in how the module “hangs” from the flex.

7. 3-D Survey (cont.)

8. Other Sector 2 Results 3 modules have been loaded so far (1 side)
2 modules are within 20 microns of nominal (all alignment marks)
1 module has 2 alignment marks off in x-y by 100um (x+y in quadrature)
The cause is understood to be (1) operator error and (2) lack of procedure to prevent such an error.
New assembly checklist now safeguards against this error.
Quick electrical test shows no digital problems in 3 modules loaded
No cooling test until 6 module loaded.

9. Tool Upgrade
Extreme case of tilt in module placement shown by glue pattern on chips
Adding +/- 200um of independent vertical adjustment to each vacuum cup

10. Procedure Upgrades
New step-by-step checklist. Check each item off for each module loading operation.
Vacuum chuck planarity calibration procedure using glass slide on deposition site (need adjustable cups first for this).

11. C6F14 Cooling
Closed circuit C6F14 loop operation demonstrated with dummy sector with heaters.
0.2m2 heat exchange area to chiller bath implemented with coil.

12. C6F14 Cooling (cont.)