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SPring-8 FADC Module Compiled by Wen-Chen Chang Updated: 07/12/2002
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Requirement of TPC Electronics
Good energy resolution: measuring dE/dx from the charge readout of either wires or pads for the particle identification for K/p separation at low momentum. Requirement of spatial resolution: x,y < 300 m. z < 1 mm. Position information: x(t),y(t): x from fired sense wires; y from interpolation of signals on pads(t). z(t) from time bin of FADC time slice. Timing information: fitting of pulse peak in FADC. On-board zero-suppression to ensure fast data transfer and short system dead time.
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Digitizer in TPC Electronic: FADC
Large data size: High sampling rate: 40 MHz = 25 nsec. Read-out bit (Nbit): 10 bits. # of Time bins per event: ~600 time bins. (Max drift time/clock = 14 sec/25 nsec = 560 bins.) 1000 channels. Trigger latency: 1 sec . On-board zero-suppression. Need of a large buffer size to store 4-5 events on board for one single VME readout.(16*600*5=48K per channel, w/o a zero suppression factor.) High channel density.
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SPring-8 FADC Module Use TEXONO FADC and IHEP BES version as the starting point. 40 MHz; 10-bit FADC: ADC input 0-2 V range. Shift register inside FPGA: max length = 100 time bin. On-board FPGA for threshold suppression. Buffer FIFO: dual port memory. CPLD: controlling VME actions. Free clock running. VME 9U; 32 channels/module; 8 attached cards/module; 4 channel/card.
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Main Electronic Components
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SPring-8 FADC Module (4 channels, 10 bits, 40 MHz)
FIFO FADC OPA FPGA
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Mixed signal AD Converter Adapter Board
40 MHz sampling rate. 10 bits resolution with 2Vp-p dynamic range. Clock distribution with Phase Lock Loop circuit. On Board digital signal delay and Real-Time ZERO-Suppression. High capacity First In First Out Memory. Easy to use with high density connector.
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FADC Mother Board Driver CPLD Clock Driver VME Connector
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32 Channels, high sampling rate Flash AD converter.
VMEBus slave controller, with high performance BLTransfer Mode. FPGA, digital signal control chip. First In First Out memory. Differential AD Converter (40 MHz) 16 channels differential signal input connector. 32 Channels, high sampling rate Flash AD converter. Spring /03
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Prototype 2
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Prototype 2 : FADC card
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Prototype 2: LED Power Download Trigger VME READ
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Prototype 2: LEMO Input Clock Trigger Reset Busy
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Prototype 2: Lab Test
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Prototype 2: Lab test
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Analog Input to ADC
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1-channel FPGA Block
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FPGA Block
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Data Format CS: Checksum bit Lowest Bit ND: Not defined. Header 1
16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 * FADC Module number (6 bits) is set by two blue dip-switches on the lower part of VME 9U FADC. Left one for the highest 2 bits and right one for the lowest 4 bits. Header 1 CS 1 ND *FADC Module Number (1-64) Channel Number (1-32) Header 2 CS 1 ND Suppression Level (0-255) Evt Num (1-8) ADC CS 1 ND ADC (0-1024) Time CS 1 ND Time (0-1024) Trailer CS 1 ND Number of ADC data bins (0-1024)
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CSR Format Lowest Bit VME address: 0x010000
16 15 14 13 12 11 10 09 08 07 06 05 04 03 02 01 Reset: counters, FIFO, BUSY. 1 Number of Events stored in FIFO before issuing IRQ 1 Num of Evts (0-31)
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FADC VME Action List (A24/D16)
0x0i0000: CSR address to write; bit 9 for resetting FIFO and clear busy, bit 1-4, 10 for setting IRQ event numbers (Address modifier: 0x3D). 0x0i0100: address to read the all-merged 32 FIFOs’ content in BLT mode for FADC i. (Address modifier: 0x3B, 0x3F). Check up the last 16 bits of package after each read. If value = 0xFFFF, end of FIFO is reached and BLT read should be stopped. 0x0i0100+j*0x02: address to read the single FIFO content in AO mode for channel j. (Address modifier: 0x3D) (channel 0, 0x0i0100, channel 1, 0x0i0102 ,…. channel 31, 0x0i013C, channel 32, 0x0i013E) 0x0i0100+j*0x02: address to write for setting the zero-suppression threshold for channel j. (Address modifier: 0x3D) i: module number for VME address definition set by the dip-switch on the upper right side of each VME 9U board.
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CPLD FADC Trigger Clock 100MHz
The Control Flow of FADC For each channel DAQ Start Trigger , Conversion Master Yes NIM < 5 events Preamplifier Module VME CPU No Trigger Count *Veto Send IRQ to VME CPU Trigger signal DAQ READ FIFO CPLD FADC Trigger Clock 100MHz FADC Module DAQ send Reset Trigger Clock FADC clear BUSY FADC Reset Clear trigger Veto BUSY Slave
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Observation Window of Signals
Shift Register Length ( max 100*25ns = 2.5 s) Trigger Conversion Strobe Sampling Counts ( max 1024*25ns=25s)
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DAQ Test Trigger Logic SPring-8 32-channel FADC TEXONO MAMP LeCroy222
LTDS1 Rst LTD0 Strb SCLK HTD0 Evnt H VT L VT LeCroy222 START OR BLANK STOP NIM DEL TTL BUSY 1.0 10 100 LATCH Full scale width FBSY INT READ CLK Busy Reset +5V +12V -12V -5.2V SPring-8 32-channel FADC Trigger Voltage Reference Clock Generator
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TEXONO Online Event Display (400 KHz sine wave)
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TEXONO Online Event Display (1 MHz sine wave)
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ROOT Offline Event Display for 2 SPring-8 FADC (64 channels)
Module 1 Module 2
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Events 02/09/2001: Prof. Imai and Ahn visited AS. Collaborating plan was discussed and finalized. 03/31/2001: Wen-Chen and Henry visited IHEP, Beijing and explored the R&D plan in IHEP. 05/31/2001: IHEP was not able to perform the R&D plan. 08/01/2001: Da-Shun visited IHEP for 3 weeks to learn the conceptual design. 02/01/2002: Prototype 1 boards made. 02/28/2002: Wen-Chen and Da-Shun tested prototype-1 boards with TPC at SPring-8. 04/25/2002: Finished up 64 channels of prototype-1 and deliver them to SPring-8.
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Events 06/03/2002: Issue out prototype-2 (quasi-final) fabrication and SMT order. 06/24/2002: Deliver prototype-2 (64 channels) to SPring-8. 06/25/2002: System test with a complete electronic chain (Pre-amp, shaper, and FADC) with TPC at SPring-8. 07/02/2002: ordering of CPLD, PROM and other inexpensive components. 07/06/2002: Successful reading and decoding of pulser data by VME SPARC and UNIDAQ. 07/10/2002: Return prototype-2 (64 channels) to Taipei for fixing up the pedestals.
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Plan to be finished: 07/25/2002: Return prototype-2 (64 channels) to SPring-8 for testing with TPC and Solenoid magnet. 08/15/2002: Finalize design and issue out the final production fabrication order (1440 channels). 09/01/2002: Send production boards for stuffing. 09/08/2002 – 09/25/2002: Test production boards in Taipei. 09/25/2002 – 10/15/2002: Delivery of production board, installation, system test and DAQ. 10/15/2002: Commission run with photon beams.
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