1. Swagelok confidential. For internal use only.
Swagelok Company, 2004

2. NeSSI Generation II Systems Rick Ales, Bill Menz and Dave Simko
Sensor Bus Hunting
Rick Ales, Bill Menz and Dave Simko
Swagelok Company
IFPACSM2004
Arlington, Virginia
January 12-15, 2003

3. New Sampling/Sensor Initiative
What is NeSSI Generation II?
- A logical expansion of miniature modular
technology
- Adds intelligent devices to the system
- Defines the need for an open architecture
protocol that will allow the smart devices to
communicate with each other
- Intrinsic safety is an important issue
- “Generation” is a misnomer, implying that it
replaces what was before

4. Discussion Points Update on the DeviceNet/ODVA effort
Stakeholders meeting with ODVA
Workshop at NIST headquarters
- Sensor bus issues
- Microanalytical devices
4. IEEE Study Group
A Profibus/Fieldbus/HART option
DeviceNet revisited

5. The DeviceNet/ODVA Effort
Develop an intrinsically safe version of DeviceNet
Defined a suitable approach with ODVA
- Establish an SIG made up of vendors
- Possibly add an advisory group made up
of end users
Established a rough cost estimate
Execute stakeholders meetings
- July 29 at Rockwell in Cleveland
- July 30 at NIST headquarters in
Gaithersburg

6. Stakeholders Meeting with ODVA
Summary
- 19 attendees, all day meeting
- Briefed on NeSSI, I, II, ODVA, and basics of
DeviceNet
- Open discussion of intrinsic safety
- Technical panel discussion, followed by Q&A
on IS and DeviceNet
- Prepared a “go forward” plan with ODVA
- Complete minutes on CPAC web, NeSSI

7. Workshop at NIST Summary - 21 attendees, all day meeting
- Briefed on NeSSI, I, II, and the need for an IS
sensor bus
- IEEE 1451 presented – Kang Lee, NIST, MEL
- CAN Open and CAN in Automation (CiA)
presented
- Microanaytics Workshop – microreactors,
microsensors, microfluidics
- Complete minutes on CPAC web, NeSSI

8. A Fieldbus/Profibus/HART Option
Head-mounted
Temperature
Transmitters
courtesy ABB
Profibus PA
Foundation
Fieldbus
HART
Small Diameter, typically 1-3/4” – 2-1/4”, close
to the 1-1/2” ANSI/ISA requirement
Intrinsically safe
Softing AG supplies the chipsets for many
manufacturers of these devices
Softing feels they can miniaturize the electronics
for smart NeSSI components

9. $ $ $ $ $ $ $ $ $ $ $ $ $ $ Digital Network
Foundation
Fieldbus
RS-485
IEEE 1451
DeviceNet
CANOpen
Profibus
Digital Network
Open, multi-vendor infrastructure.
Multivariable, configurable,
self diagnostics, plug-n-play
Temperature Range
125℃
Miniature
5” x1⅟₂” diameter
Intrinsically Safe
Class 1 Div 1
Protocol Simplicity
Process Industry acceptance
Cost $ $ $ $ $ $ $ $ $ $ $ $ $ $

10. Show Stoppers
RS-485
No standard multi-vendor device definition or profiles.
Requires device specific programming.
Profibus & Foundation Fieldbus
Controller chips do not meet temperature requirement.
Multi-chip solution, not likely to meet size constraints.
Cost per node is 3x to 5x as high as a CAN based device.

11. Challenges DeviceNet & CAN Open
Develop IS specification and products by either:
Convince vendors there is sufficient market opportunity for them to commit resources, or…
Provide funding to finance IS project.
Promote industry acceptance of “yet another bus.”
IEEE-1451
Nomimal vendor base.
Promote acceptance of “yet another bus.”

12. Status of the Hunt All we need are the project resources!
DeviceNet & ODVA
ODVA has proposed an intrinsically safe DeviceNet initiative “Go Forward Plan.”
CAN Open, CiA and IEEE
An industry study group will propose a CAN Open and IEEE 1451 device profile harmonization standard that includes an intrinsically safe CAN option.
All we need are the project resources!