1. GEM-TPC Status Report GEM-Trackers see MEC session (14:00 hrs)

2. GEM-TPC@PANDA/FOPI Collaboration Meeting
Outline
General issues
Material research
Field Cage
Media-Flange Assembly (Supplies)
Amplification-Flange Assembly (GEM Stack)
Electronic-Flange Assembly (Pad Plane)
Front-End Boards
Cooling Structure
Electrical Supplies
Summary Overview
Collaboration Meeting
March 3rd 2009

3. GEM-TPC@PANDA/FOPI Collaboration Meeting
General Issues Status
Legend:
Successfully finished
Neutral, with no influence on timeline
Ongoing work, waiting for completion
Critical, on hold, stalled
Detector & Setup General:
Actual CAD models put to the WebDAV (V14 of the FOPI GEM-TPC assembly)
First part- & material list available (e.g. for simulations, still preliminary)
Still no input on required precision and tolerances
Collaboration Meeting
March 3rd 2009

4. Material investigations Outgasing & Aging
Test Results:
Negative - Severe damage!
Detailed investigations in progress
Status:
Outgasing equipment severely damaged needs to be re-built & improved
New detector fabrication started (+8w)
New base-material purchase started (+4w, 4k€)
Still >14 on-stock materials to be investigated (+2w/measurement)
Outlook:
New results not before May 2009
Collaboration Meeting
March 3rd 2009

5. Field cage Problems / Solutions
Rohazell® with Kapton®/Al shield
Kapton® reinforcement
Material research:
HV-stability tests negative, Surface discharges
Status:
Changes in layer stacking & composition µm Kapton insulation layers foreseen
Routing of HV & Gas to/trough FC to be rendered more precisely
New type of Rohazell® foam improved features (cell diameter, surface structure, humidity, etc.) under test (+2w) material ordered (+4w, 2k€)
Storage- & handling-tools + infrastructure under construction (+12w, 15k€)
No off-the-shelf product
Time line:
Planned completion > June 2009
Voltage divider(s): SMD Resistor on Flexible PCB
Staggered Stripline on Kapton®
backside shifted by ½
(not visible)
Collaboration Meeting
March 3rd 2009

6. Field cage Staggered Strips
‘Best’ layout: 1 mm Strip / Gap
Large-Inhomogeneity problems solved
Design work ongoing (+4w)
Various offers ‘en route’ (+4w)
Purchase pending (+8w, 3k€)
Resistor chain
Former problems with supplier solved purchase ongoing (6w, +2k€)
Split chains in parallel (1..5 W) to cope with paired tolerances
Cooling advisable but not feasible to be realized
FEM simulations (E,FT,p)
Balanced field configuration with equal material thicknesses FCi/FCo
Residual field inhomogeneities O(cm) near the ‘edges’
Shows supremacy of a resistive-foil setup
Fine-Strip Copper-on-Kapton layout as fall-back solution (n x100µm ‘thick’!)
3 mm
Collaboration Meeting
March 3rd 2009

7. Field cage Resistive-foil
Restarted design, material tests, market research
Crucial design parameters
Heat density & -dissipation
Thickness & Resistivity-Homogeneity (solutions attacked, more questions emerging)
Heating simulations look promising (5 W)
Status
Material R&D and purchase
Still ongoing (may take months, distributed only in USA, alternatives will be addressed soon)
Costs of ≈6..10 k€ not covered so far
Tooling
Construction & market research ongoing
Costs of ≈15 k€ not covered so far
Collaboration Meeting
March 3rd 2009

8. Flanges / Structure Assembly
Status:
Optimization on the structure complete (mass & shielding, gas- & supplies routing)
Clamping fixture functional
Back plane & Isolation cover under construction (+4w, 1k€)
Monitoring developments stalled
Material purchase ongoing (+4w, 2k€)
Aging test outstanding (+8w)
Time line:
Planned completion > May 2009
Beam into the plane
Collaboration Meeting
March 3rd 2009

9. GEM structures & support Assembly
Status:
Foils (2C) delivered recently … But: partially faulty
Final flange to be produced (+4w)
HV-Distribution PCB under construction (+4w) Isolation issues addressed
Infrastructure:
Tools in production (+2w)
Local infrastructure ordered (+ 6w)
Quality assurance:
Lab tests pending (+6w)
Full-scale QA stalled
Costs not covered so far:
8 k€ GEMs k€ Structure, Tooling…-Material k€ Infrastructure
Time line:
Planned completion > May 2009
Support flange
HV Distribution PCB
GEM stages
Clamping fixture
Exploded view
Partial assembly
Collaboration Meeting
March 3rd 2009

10. PadPlane & Support Assembly
Status:
PadPlane:
Various modular designs developed options discussed intensively ready since months
Pin-out on SAMTEC connector slightly changed
Various offers available (11/14 suppliers disapproved)
Ordering done (-8w, 5..6k€)
Delivery pending (R&D-type, +6..8w)
Heat screening required, under construction (+4w) (Rohazell/GRP sandwich)
Flange & Assembly:
Final flange to be produced (+4w, 1k€)
Material purchase ongoing (+4w, 2k€)
Aging test outstanding (+8w)
Time line:
Possible availability May 2009
Collaboration Meeting
March 3rd 2009

11. Electronic-Flange & Cooling Assembly
Design:
46 slots for FEBs foreseen
Integrated passive liquid cooling, thermal screening, LV distribution
Dedicated sealing of inner FC
Sensors foreseen (flowi,o, pi,o, Tn, HVn)
Supply & distribution at outer periphery
Overpressure valves (not shown)
Status:
Final parts delivered
Customized sealing structures fabricated
Needs refinement in details and testing
Assembly pending
Time Line:
Planned completion > April 2009
Cooling pots
LV-connectors (70A)
Stabilizers & Media bridge
Collaboration Meeting
March 3rd 2009

12. Front-End Electronic (FEBs)
Status:
nXYTER based 2 chip board delivered & set-up
Lab-test revealed higher power consumption than originally quoted  improvement under investigation mid-term redesign required & attacked
Signals from 90Sr seen
Readout-Concept:
In-beam: not attacked
Lab readout: triggerable board addressed (‘EXPLODER’MBS)
In-beam test pending
Time Line:
Future tests and use not foreseeable
Collaboration Meeting
March 3rd 2009

13. General Overview Working Places
Material tests (Aging, Geometry)
Resistors:
Concept Availability, Delivery QA & Selection
GEM: (2C)
Outgasing/Aging (GRP support) Purchase & Delivery
Structure: GR-PBT
Tooling & Manufacturing (Timescale)
Sensors:
Read out concept Slow-Control Integration
EC:
Design (Calibration equipment)
FEE:
Basic concept Supply Setup / Tests
Cooling:
Operation conditions Heat dissipation Temperature Stability
FC: Kapton®/Rohazell® sandwich structure
Layout Concept (homogeniety) SAP (costs) Tooling / Manufacturing HV-/Heat stability
PP: Kapton®/Rohazell®
Mech.Stability HeatTransfer/-Shielding Purchase & Delivery
Operation:
Heat-Shielding/-FlowDetection
Collaboration Meeting
March 3rd 2009

14. GEM-TPC crew members & tasks
Andreas Heinz PadPlane, GEMs
Jörg Hehner Aging tests
Markus Henske Material tests, Sensors, Infrastructure, Purchase
Volker Kleipa Front-end
Jochen Kunkel Mechanics, drawings, simulations, assembly
Christian Schmidt Front-end
Sandra Schwab Part Production, Tooling
Daniel Soyk Simulations
Bernd Voss ‚All & nothing‘, ideas & concepts, project & logistics
Jan Voss General mechanics, Material tests
Joachim Weinert Part Production, Tooling

15. Backup Slides

16. Status Overview WorkPackages
Milestone/Feature Status Next step Open questions / steps
Support structure finished
Material research ongoing delivery, aging tests Aging
Overall Fabrication ongoing input & discussion Geometrical tolerances
Field Cage ongoing delivery, tooling, test, … Kapton XC
GEM ongoing test & assembly Quality assurance
PadPlane ongoing delivery
FEB ongoing in-beam test
ReadOut Plane & ROC final finished
Integration tasks
Gas ongoing delivery
HV ongoing integration
LV ongoing integration
Cooling ongoing integration
DCS
Controller system ongoing input & discussion
Cabling ongoing integration Detailed cabling list required
Sensors & Actuators
Pressure ongoing assembly
Over-Pressure ongoing assembly
Temperature ongoing assembly
Flow-Liquid ongoing assembly
Flow-Gaseous ongoing assembly
Oxygen under investigation purchase
Water under investigation purchase
Test beam-time Bonn
Sensors ready freshly calibrated still needed
FEBs ongoing see above successful ‘baptism of fire’ during
ROC (SysCore/EXPLODER) ongoing test show some problems CBM beam time 09 / 2008
Collaboration Meeting
March 3rd 2009

17. GEM-TPC@PANDA/FOPI Collaboration Meeting
General Issues Status
Personnel/staff:
Andreas Heinz former staff on fixed-term contract, now on free-lancing
Volker Kleipa new member of the crew (electronic engineer)
Rahul Arora will join end of March (PhD Student, MC-Pad Marie Curie)
Funding:
GSI DL-budget problematic & no PANDA money till today
QA-procedure & Testing:
On-site GEM-QA
Full-scale test rig postponed (no budget, low-profile man power)
Minimum setup in discussion
On-site detector test-setup stalled, may be addressed in May (no budget, low profile manpower)
Collaboration Meeting
March 3rd 2009

18. Readout-End plate structures Cooling
Open questions:
Operational conditions  Simulations
Feasibility  Tests
Media Bridge ‚slap‘ option (others under investigation)
Collaboration Meeting
March 3rd 2009