1. SVD Ladder assembly at IPMU
Yoshiyuki Onuki University of Tokyo, Kavli IPMU
Higuchi Takeo, Kavli IPMU

2. Activities at IPMU L6 Ladder assembly procedure(Ref. previous my talk)
Wire-bonding parameter optimization
Mechanical QA and misalignment parameters measurement with coordinate measuring machine. Talked by Shimizu(U-Tokyo)
TIFR L4 Ladder assembly at IPMU

3. Optimization of wire-bonding for PA1 on Si-Detector
All testing was performed at the IPMU.
Optimization of wire-bonding for PA1 on Si-Detector
Dong-Ha Kah, Kuk-Hyun Kang, Chang-Woo Joo
Toru Tsuboyama
Kyoungpook National University
Seoul National University
KEK
Test data sharing rink

4. Test Set-up Bonding Pulling Change bonding parameters
Measurement of force per bonding

5. Sample
PA1 on the CMS silicon detector
CMS silicon detector
PA1
Au-Cu

6. Parameter 1 Parameter (next page) Bonding target Bonding condition
Power
Force
Time
Bonding target
PA1 to Detector
Detector to Detector
Bonding condition
1st target
(PA1 pad)
2nd target
(bias-ring)
1700 um
2nd target
(bias-ring)
1200 um
1st target
(AC pad)
<PA1 to Detector test>
<Detector to Detector test>
PA1 to Detector
Detector to Detector
Wire length
1200 μm
1700 μm
Wire height
500 μm
Bonding wires 20
Bonding speed
50000 μm/sec

7. Parameter 2 Step1 : PA1 to Detector Step2 : Detector to Detector test
Power
60,70 70
Force 20 26
Time
10,20 30
Step2 : Detector to Detector test
Detector to Detector
Power
50,60,70
Force
20,26
Time
20,30
Final : PA1 to Detector
PA1
Detector
Power
60,70 60
Force 20
Time

8. Detector to Detector Bonding
Optimization process
STEP 1
Final
PA1 to Detector Bonding
Fixing Detector Parameters
(Power 70, Force 26, Time 30)
PA1 to Detector Bonding
Fixing optimized Detector Parameters
PA1
Power 60 or 70
Force 20,
Time 20
Detector to Detector Bonding
To optimize detector parameters
STEP 2
Detector
Power 60,
Force 20,
Time 20

9. Pulling Test Pulling force for PA1 to Detector Break Type
PA1 (P70,F20,T20)
Detector (P60, F20, T20)
PA1 (P60,F20,T20)
PA broken neck 75%
Detector broken neck 25%
Detector lift-off 35%
Detector broken neck 30%
PA lift-off 15%
PA broken neck 15%
Wire broken 5%

10. Summary REBO-7 (wire-bonding machine) is available to make 10 g.
In PA1 case, parameters are recommended
PA1 (Power 60, Force 60,Time 20(ms))
Detector (Power 60, Force 60,Time 20(ms))
Foot-prints
PA1 (P60, F20, T20)
Detector (P60, F20, T20)

11. Summary
Wire-bonding parameter optimization for PA was performed by Korean group.
The test with Si-detector and PA had been studied from 7th Jan. to 31th Jan.
The result shows over 10gf bonding force in average.
We are preparing TIFR assembly work at IPMU.

12. New space for TIFR at IPMU
Construction: 21th(Tur) Feb. – 27th(Wed) Feb.

13. Status We are preparing the MoU between TIFR and Kavli IPMU.
New clean room space will be allocated for TIFR L4 assembly.
Our(Japan, Korea, TIFR) office room will be allocated in the Kashiwa Research Complex 2 building.
Wire bonder shipment work has started.
The bonder, Delvotec 6400, will be delivered by 20th March.

14. Back-up slides

15. Pulling
Pulling force for PA1 to Detector

16. Pulling
Pulling force for Detector to Detector

17. Bonding Foot-prints (don’t measured each width) Sensor (P50, F20, T20)