1. Pixel panels and CMOS Read-out electronics
Jan Timmermans - NIKHEF
25-26 Feb 2008
LP-TPC subsystems meeting

2. LP-TPC subsystems meeting
A 5 cm3 TPC (two electron tracks from 90Sr source)
25-26 Feb 2008
LP-TPC subsystems meeting

3. LP-TPC subsystems meeting
Pixel systems sofar….
Timepix (+ Medipix2) with triple-GEMs (Freiburg, Bonn)
Timepix (+ Medipix2) with single Micromegas (NIKHEF, Saclay)
Now:
Timepix + amorphous Si (highly resistive) + integrated grid (Ingrid) (NIKHEF), soon also Saclay
larger drift lengths, up to 100 mm
25-26 Feb 2008
LP-TPC subsystems meeting

4. LP-TPC subsystems meeting
Sofar single-chip systems used
Soon (Eudet deliverable) small multi-chip systems:
Bonn: two 4-chip boards  on endplate module
Saclay: one 8-chip board  on endplate module
NIKHEF: 4-chip board, fitting single-chip detector mechanics and drifter (could become endplate module)
Later (~3/2009): aim for a 64-chip system (NIKHEF; may be too ambitious; bottleneck could be production of sufficient # Ingrids)
25-26 Feb 2008
LP-TPC subsystems meeting

5. Current readout Timepix
Two interface types:
Muros 2.1: rather “bulky”
maximum rate ~20-40 Hz for one chip
currently no further stock! (NIKHEF has 3)
USB1.2 (Prague):
can now handle Timepix
rather slow: few Hz for one chip
(USB-2 is under development at Prague; available this summer?)
25-26 Feb 2008
LP-TPC subsystems meeting

6. LP-TPC subsystems meeting
25-26 Feb 2008
LP-TPC subsystems meeting

7. LP-TPC subsystems meeting
NIKHEF setup (> 22 Aug. 2007)
Next-3
Next-1,2
“old”
25-26 Feb 2008
LP-TPC subsystems meeting

8. LP-TPC subsystems meeting
1 connector + External Ultra SCSI cable (68 pins) for each ‘group’ of Timepix chips
(has magnetic connector shielding!)
cable length <~ 1m
National Instruments DIO-653X card
cable length 1-2 m Muros  PC
have not yet checked these connectors
DAQ on Windows PC with Pixelman software; Bonn/Freiburg working on triggering PC.
Muros is externally triggered
25-26 Feb 2008
LP-TPC subsystems meeting

9. Possible fast readout larger systems
25-26 Feb 2008
LP-TPC subsystems meeting

10. RELAXD Quad Board Project
Overview
By: Bas van der Heijden
Thanks to: Jan Visschers
Lukas Tomasek
Hans Verkooijen
John Hug
25-26 Feb 2008
LP-TPC subsystems meeting 10 10

11. LP-TPC subsystems meeting
Within the RELAXD project:
Development of through-Si via connections to backside of chip
(in collaboration with IMEC Leuven)
Fast “5Gb” readout:
Development of quad carrier board
Development of slave board
For LP-TPC need active cooling: ~1W/chip
25-26 Feb 2008
LP-TPC subsystems meeting

12. LP-TPC subsystems meeting
Quad carrier board
Relaxd Slaveboard
25-26 Feb 2008
LP-TPC subsystems meeting 12 12

13. Slaveboard layout and dimensions
Lattice SC15 FPGA
Dimensions:
3cm x 8.3cm
100p Side entry connector
Medipix
Power supply’s
OSCILLATOR:
156.25MHz for 3Gig 8b10b
125MHz for GbEthernet
JTAG + Test pins
RJ45 2x LVDS + power
25-26 Feb 2008
LP-TPC subsystems meeting 13

14. Additional Slaveboard hardware
8 Mbit Flash memory
VDD & VDDA Current measurement (2ch of the ADC)
VDD & VDDA voltage measurement (2ch of the ADC)
VDD & BIAS voltage adjust (2ch of the DAC)
Quadboard temperature sensor
FPGA core temperature sensor
10 Test pins & 4 led's
25-26 Feb 2008
LP-TPC subsystems meeting 14 14

15. LP-TPC subsystems meeting
25-26 Feb 2008
LP-TPC subsystems meeting 15

16. LP-TPC subsystems meeting
Communication scheme 1
Primary 3 Gb LVDS direct link
PCI express card (lattice development board)
9 x
Lattice SC15
MPIX 1
3Gb/s 8b10b
LVDS
MPIX 2
MPIX 3
MPIX 4
25-26 Feb 2008
LP-TPC subsystems meeting 16 16

17. LP-TPC subsystems meeting
Communication scheme 2
Secondary Gigabit Ethernet (UDP)
Using Ethernet PHY (Marvell)
MPIX 1
Lattice SC15 FPGA
MPIX 2
MPIX 3
MPIX 4
Gigabit Ethernet PHY
(Marvell)
GMII
1.25GHz
Ethernet
1GHz
GbE
core
25-26 Feb 2008
LP-TPC subsystems meeting 17 17

18. LP-TPC subsystems meeting
Summary
Timepix pixel system can operate simultaneously with Micromegas panel(s)
Several small scale 4-8 chip systems in preparation; should be available within ~2 months
Larger (~64 chips, 128 cm2) system, late spring 2009; needs active cooling!
Ambitious extension.
25-26 Feb 2008
LP-TPC subsystems meeting