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EMT362: Microelectronic Fabrication Multi Level Interconnect

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Presentation on theme: "EMT362: Microelectronic Fabrication Multi Level Interconnect"— Presentation transcript:

1 EMT362: Microelectronic Fabrication Multi Level Interconnect
Ramzan Mat Ayub; SATF 2005 EMT362: Microelectronic Fabrication Multi Level Interconnect Technology Ramzan Mat Ayub School of Microelectronic Engineering

2 Ramzan Mat Ayub; SATF 2005 Lecture Objectives Able to identify the main components in Aluminum and Copper metalization. Able to describe Aluminum metalization process Able to describe Copper metalization process

3 TERMINOLOGY PASSIVATION METAL-2 VIA-1 METAL-1 PMD IMD OR ILD-1 CONTACT
Ramzan Mat Ayub; SATF 2005 TERMINOLOGY PASSIVATION METAL-2 VIA-1 METAL-1 PMD IMD OR ILD-1 CONTACT

4 REQUIREMENTS OF INTERCONNECT MATERIALS
Ramzan Mat Ayub; SATF 2005 REQUIREMENTS OF INTERCONNECT MATERIALS LOW RESISTIVITY RESISTANCE TO ELECTROMIGRATION COMPATIBLE WITH CVD OXIDE STABLE AND CORROSION RESISTANCE DEPOSITABLE TO A CONTROLLED THICKNESS AND UNIFORMITY EASY TO ETCH CONTROLLABLE REFLECTIVITY

5 Aluminum Metalization
Ramzan Mat Ayub; SATF 2005 Aluminum Metalization

6 Ramzan Mat Ayub; SATF 2005

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19 Ramzan Mat Ayub; SATF 2005 TIN- ARC AL TIN - BARRIER TI - SILICIDE

20 TI – WETTING / GLUE LAYER
Ramzan Mat Ayub; SATF 2005 TIN - ARC ALUMINUM TI – WETTING / GLUE LAYER TUNGSTEN

21 Ramzan Mat Ayub; SATF 2005

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