1. Impregnable Brand Protection For Non-Electronic Products
ICTK Co., Ltd.
3/5 fl, Vforum Building, 323 Pangyo-ro, Bundang,
Gyunggi-do, Korea 13488
TEL : FAX :
Impregnable Brand Protection
For Non-Electronic Products
Based on VIA PUF

2. Counterfeit Industry

3. Conventional Anti-Counterfeit Technologies
Hologram
ALL CLONED
Smartcard chip
Poor Security
Nano Ink

4. What is new Technology? VIA PUF + NFC or RFID Security Function
Physical Unclonable Function
Connectivity Function
To link non-electronic products
to electronic world

5. What’s PUF? Physical Unclonable Function
Utilize micro tolerance of semiconductor process
Same process & same design, but unique pattern on every chip
Unclonable finger print on the chip
“Fingerprint on IC”

6. Conventional Security
Vulnerability in conventional security solution
Solution based on SW and memory
Store KEY & Cipher data <encrypted data> in memory
Attackers steal the KEY & Cipher data from NVM
Storing KEY safely never perfect
Attacking technology advancing
Plain data
Cipher data
KEY
Cipher Data
Non
Volatile
Memory
Cryptography

7. Attacking Technology Advancing
Shorter hacking time as reverse engineering technology advancing
Hacking time getting shorter
Steal the KEY from Infineon TPM memory
6months for device analysis,
6hours to steal the KEY
3months for device analysis
Reverse engineering technique advanced
Black Hat 2010
Black Hat 2015
2020?

8. PUF Security = ROOT of TRUST
New Paradigm of Security
Solution based on PUF/HW and memory
Store only Cipher data<encrypted data> in memory
KEY generated from physical status & goes back to physical status after use
Attackers can steal only Cipher data
Without KEY, never decrypt
Plain data
Cipher data
KEY
Cipher Data
Non
Volatile
Memory
Cryptography
PUF
Cipher data encrypted by
PUF KEY is
perfectly SAFE

9. What is VIA PUF? Utilize VIA holes between metal layers
Certain hole size gives “open or short” randomly by recipe not by design
The combination of this “open and short” generates VIA PUF

10. VIA PUF Hole Formation Via size A Via size B Via size C
Via Hole Size: XM
Metal 1
Metal 2
Value 1
Via size A
Via size B
Via size C

11. VIA PUF Hole Formation Multi-size holes used
Via Hole Size: XM
Metal 1
Metal 2
Value 1
Via size A
Via size B
Via size C
Multi-size holes used
Combine multi holes to a bit of VIA PUF
Ensure high randomness

12. The 1st volume production in the world Produced multi-millions pieces
Advantages of VIA PUF
Excellent repeatability
Complies JEDEC standard for reliability test
High Quality of Randomness
Satisfies “ NIST SP800-90B” test suit
No Error Correction Circuit required
Smaller real estate
The 1st volume production in the world
Since July, 2016 – Giant IL005
Produced multi-millions pieces

13. What is new Technology? VIA PUF + NFC or RFID Security Function
Physical Unclonable Function
Connectivity Function
To link non-electronic products
to electronic world

14. Giant 2 Small Semiconductor = VIA PUF + NFC
All Keys and Data protected by VIA PUF is safe from any type of attacks
Unclonable
NFC
Memory
SHA2
VIA PUF
Control Logic
ISO A ISO7816 part4 ISO (type A) MHz

15. Giant Security Module Integrate Giant 2 + NFC antenna
Size can be as small as button
Sticker, PET mould, water proof, etc...

16. Concept of Operation Each product has VIA security module Display
authenticate
authenticate
Server
Smartphone
Giant Security Module
Display
pass or fail result
Each product has VIA security module
Authenticate through consumer’s smartphone
Server centric authentication
Collect consumer data

17. Advantages Perfect brand protection Higher customer satisfaction
Collect big data of customers
Direct Promotion to customers
Better customer relationship management

18. Thank you.
TEL : FAX :