1. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Physical model

2. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Numerical and experimental melting front positions

3. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Temporal variation in maximal temperature, Tmax, and the melt fraction, f; Ra1=1.19×109, Ra2=2.55×109, and Ra3=5.10×109

4. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Substrate temperature profile; Ra1=1.19×109, Ra2=2.55×109, Ra3=5.10×109, x=Xs/2, and t=4320 s

5. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Isotherms for Rayleigh numbers, Ra1=1.19×109 and Ra2=5.10×109

6. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Streamlines for Rayleigh numbers, Ra1=1.19×109 and Ra2=5.10×109

7. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Local heat flux density at the left hot wall/PCM interface, Ra=1.19×109

8. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Effect of the position, Lh, on temperature profile within the substrate; Ra=5.10×109 and t=4320 s

9. Date of download: 10/25/2017
Copyright © ASME. All rights reserved.
From: Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage
J. Electron. Packag. 2009;131(2): doi: /
Figure Legend:
Effect of the position, Lh, on the maximal temperature, Tmax, and on the liquid fraction, f; Ra=5.10×109