1. Particles and Fields Package Monthly Status Review (MSR)
December 15, 2010
Dave Curtis, PFP PM

2. SSL Contracting Status
Phase B/C/D Contract in place.
An updated spending plan (phasing) has been submitted

3. Schedule Status No improvement in pre-CDR schedule
A few layouts lagging
SWIA preamp/MCP board on critical path to CDR
SWIA/STATIC mechanical still behind but making slow progress
Due to personnel conflicts with RBSP
RBSP environments complete!
See next chart
Result is the EM system testing completes right about the time of the CDR.
EM Test completion current showing July 11, after ICDR.
Will reorganize test schedule to prioritize retiring risk early (Before ICDR)
Package I&T before SWIA/STATIC Calibrations

4. Manpower Concern with competition with RBSP-EFW for some key people
Power converter design team
Reorganized team to streamline priority tasks
Significant progress this month – most converter layouts complete, some boards being loaded
SWIA/STATIC/LPW boom mechanical engineers
SWIA/STATIC EM mechanical parts still behind but catching up
No longer on the critical path to CDR
FSW lead
Has fallen behind due to other priorities, still ahead of the other subsystems
Additional parts engineer added to QA team
Looking at adding additional electrical test engineer, software test engineer

5. Accomplishments Almost all EM EEE parts at SSL PWBs are in layout
3 part types (zener diodes) late – looking at work-arounds
First preliminary parts SEL test preliminary results look good
Analysis of transistor usage complete to determine which if any need TID testing
PWBs are in layout
>65% layouts complete, boards being loaded, some in test
see below
DCB loaded, in test
Most EM Mechanical parts are in fab
Some part-level design work still in progress on SWIA/STATIC
PFDPU simulator GSE being delivered to GSFC, LASP this week
More in instrument sections…

6. Ongoing Work Supporting Project planning process
Supporting EMC, Payload, SDT working groups
Completing EM layouts, board loading
Continue EM board testing
Completing EM mechanical part drawings, getting parts fabricated
Preparing for STATIC TOF system acoustic test next month

7. EM Status Summary SSL EM & GSE Layouts (23)
16 layouts complete (15 boards fabricated, 6 boards loaded)
3 layouts in final review 4 in progress (hope to complete this month)
LM Interface Test preparations (3/25/2011):
DCB board loaded, in test
GSE & FSW ready to start testing
Current schedule shows ready by 2/10/2011 for the LM test
3/2/2011 with power converter
EM EEE Parts
Almost all EM Actives at SSL
3 problem parts, not holding anything up yet
Connectors on order, mostly delivered
Passives being ordered
EM detectors on order (MCP, SSD, foils, magnets)
SWIA MCP, STATIC foils, SEP magnets delivered
EM Mechanical parts:
SWEA, SEP, LPW Boom (not sensor), STATIC TOF in fab
Remaining SWIA, STATIC parts into fab soon
SEP EM mechanical in assembly

8. PFP RFA Status

9. Trades, Issues SWEA Surface Treatment selected – Black Nickel
Passed testing
CESR found NO European vendor
Looking at how to use US vendor (potential import/export issues)
HV801 issue still open
Two options: Amptek HV801, Micropac 66353
Amptek delivered some EM HV801s
Have parts for EM
Working on an analysis to decide if the PFDPU mechanical design needs to be augmented to support the PWBs to avoid excessive displacements in vibe
MAG EM PWB has option for a center support, others do not

10. Top Risks P10 (Operational Heaters) Retired; need heater power
P16 (Launch Loads) Retired (Atlas 5 loads acceptable)

11. Risks List

12. PFP Mass
No significant change

13. Mass Tracking Chart

14. PFP Power
Added Operational heaters for SWEA, SWIA, STATIC, SEP (No change since last month)
Will need to submit a CCR to increase NTE by ~15W orbit average to get back to 15% margin [CCR 243 submitted]
Survival & Peak power also increase
LM looking at impacts

15. PFP Power Trend

16. PFP Data Rate
Per allocations from Bruce

17. Requirements Verification Status
Nothing new to report.

18. MAVEN Magnetometer Status Dec 14, 2010
Connerney, Sheppard, Schnurr, Oliversen, Espley, etc. 18

19. GSFC/MAG - Accomplishments Last Month(s)
All MAG-related RFA’s are closed (IPDR, Mission PDR).
MAG a/c heater (prototype) circuit board fabricated; heater controller assembled and operational. Bench testing of heater controller in progress.
Procurement status of long-lead and limited availability items:
Received Mil spec CMOS quad bilateral switches (4066’s).
Received flight LTC1604 ADCs (availability).
Received PWM 5032 parts from Aeroflex (new heater design).
Received EM sensor assembly parts (base, bobbins, small parts).
EM electronics board layout completed (held until Nov 15 pending revision E MICD from UCB). Parts kitting in progress.
Magnetics piece parts for EM (transformers, inductors) wound & tested.
EM sensor assembly bobbins wound & awaiting sensor assembly.
Revised MICD with LM at GSFC (Nov 30) and approved version #2.
Fit checked EM PWB with frame received from UCB (Dec 14): PWB fabricated to rev E UCB board MICD did not fit (but it appears that frame is obsolete, rev D).
Identified additional personnel (FPGA programming) and secured commitment. 19

20. Near Term Plans & Open Issues
Fit check MAG EM PWB as soon as Rev E frame arrives (now in transit).
Release EM PWB for assembly.
Revise MAG schedule to re-align with UCB schedule.
Assemble EM sensor.
Support GSE delivery and training Dec 16.
Finalize the baseline instrument command list and telemetry packet contents.
Continued specification of the magnetometer as documented in the Specification and User's Manual.
Complete FPGA functional blocks and interface definition.
Work software requirements with UCB (software specification for PFDPU). 20

21. Jasper Halekas, SWIA Lead
MAVEN PFP SWIA Status
December 2010
Jasper Halekas, SWIA Lead 21

22. SWIA Progress Electrical Progress Mechanical Progress
Anode PWB complete, loading/testing in progress
Digital PWB complete, out for loading
LVPS PWB complete, waiting for loading
Sweep prototype in re-layout, STATIC/SWIA coordinated
Preamp/MCP board in layout (routing nearly complete)
Mechanical Progress
MEs finally done with RBSP!
HV connector design nearly complete
MCP parts out for fab
Pin-puller and attenuator design now progressing again
Analyzer detailed design progressing again
Detector Progress
Microchannel plates arrived, waiting for chamber refurbishment and mechanical parts for testing
A121 preamps first round of testing complete, second round with flight resistors coming soon

23. SWIA Issues
Staffing
Board layout/testing and mechanical design/fabrication behind
ME staffing problem should be over
RBSP testing complete
Dalton and Johnson finally full time for SWIA/STATIC
Layout queue remains tight, but the end is in sight
Next tight point is kitting/loading boards

24. First Boards Back
Anode
Top
Anode
Bottom
Digital
Boards

25. Dave Mitchell, SWEA Lead
MAVEN PFP SWEA Status
December 2010
Dave Mitchell, SWEA Lead 25

26. EM sensor in vacuum chamber
SWEA Status, EM - CESR
Mechanical
EM sensor assembled, functional tests complete, results under review
Starting fab of FM electronics housing
Fab of FM sensor pending review of EM functional tests
Black nickel chosen to coat deflectors, toroidal grids, and external surfaces; now selecting blackening (Cu2S or CuO) for top cap and interior of hemispheres
Front-end Electronics (MCP, HVPS)
Transformers fab & test complete.
EM sensor in vacuum chamber

27. SWEA Status, EM - SSL Pedestal Mechanical LVPC Digital
Fabrication complete, in house.
LVPC
PWB fab complete, in house.
Digicom to kit.
Digital
Digicom to kit and load.
FPGA implementation to be done Dec - early Jan
SWEA Pedestal
SWEA Digital PWB 27

28. MAVEN PFP STATIC Status December 2010
Jim McFadden, STATIC Lead 28

29. STATIC Accomplishments
MCP PHD test electronics purchased and tested
Carbon foil inspection test setup purchased (camera/microscope)
Final batch of EM unit carbon foil carrier frames delivered, inspected, trimmed, documented.
Preamp board out for quote
HV Sweep board stability testing complete – feedback caps determined.
MCP HV multiplier stack-stick board out for fabrication.
Digital board PCB delivered – gathering parts for assembly.
MCP mounting parts drawings complete, MCP parts ordered
Electronics box, TOF housing and cover for acoustic test close out drawings complete – out for quote.
Mechanical drawings of electronics boards updated and HV connector detailed design completed.
Calibration chamber vendor selected and cal-chamber support structure design complete, material quotes received.
Helmholz coil bids solicited. 29

30. STATIC Open Issues
Carbon foil decontamination procedures being developed – (bake at 200oC in air destroys foils, in vacuum it appear to wrinkle foils)
Carbon foil mounting procedures still being optimized (water temperature, surfactant amount, mechanical equipment, storage)
Cleanroom build continuing – HEPA buildout completed
TDC layout still in process.
HV Sweep board layout needs mods for new parts & shield walls
15kV-MCP board needs to be kitted - MCP HV multiplier from VMI delayed - stack-stick alternate developed, waiting on HV connectors.
STATIC FPGA still in development
LVPS needs BOM and needs to be kitted, built and tested (Berg).
Analyzer and mechanical attenuator still in development
New vacuum calibration chamber not be ready for MCP testing so an older chamber will be readied and another chamber refurbished – equipment purchase in process.

31. STATIC EM Fab

32. MAVEN PFP SEP Status
December, 2010
Davin Larson, SEP Lead 32

33. SEP Accomplishments DFE board stuffed with (most) parts
FLEX circuit designed, layed out, and Fabbed (see picture above)
Slightly thicker than expected but should be ok. - not critical
DAP board sent for quote (received 3 quotes back)
Fixing a few last minute layout problems before sending for fab.
FPGA still in design by Jianxen Chen
Minor design changes in layout are incorporated in DAP layout
Expect mid Dec completion
Mechanical parts starting to arrive.
Critical parts (for detector stack) have arrived and kitted for detector assembly
Problems with carbon blacking (low quality) may be acceptable for EM but will have to change method for flight

34. SEP Open issues Mechanical parts still in production
Holiday / AGU meeting slowdown typical of this time of year.

35. MAVEN PFP DCB, Power Converter & GSE Status
December 2010
Dorothy Gordon
Rick Sterling
Timothy Quinn
Peter Berg 35

36. DCB Status Population Completed for DCB-ETU#1
Delivered along with FLASH Daughter Board #1
(shown with Prototype PROM socket, and without Daughter board)
Inspection and testing of both boards is in progress

37. GSE Hardware/Firmware Status
MISG FPGA Development
Instrument Mode development has been started
PFDPU Mode has been released for initial delivery
MISG Production Status
Digicom has delivered 10 populated boards (bringing the total to 12) along with chassis harnessing
Five of the delivered boards have passed acceptance tests
Two chassis have been assembled (to be delivered to the MAG and LASP teams).

38. GSE Hardware/Firmware Status

39. GSE Hardware/Firmware Status
MISG and Test Harnesses
The system and instrument GSE/Testing harnessing has been specified
First set of harnesses prepared for the LASP and MAG teams, along with the initial set of PC104 extender boards

40. GSE Software Status
First generation of GSEOS configuration files built for LPW and MAG. These include:
Command and Telemetry definitions (CTM)
Telemetry decoders
Telemetry displays
Instrument initialization scripts

41. Power Converter Status (1)
STATIC MCP Supply
Designed small voltage multiplier board (in lieu of VMI delivering a prototype)
Status: in fabrication
BOMS were drawn for the following boards:
STATIC LVPS
SWIA LVPS
SWEA LVPS
STATIC ACC+MCP
REG

42. Power Converter Status (2)

43. Concerns Connector delivery dates may impinge on schedule
PC104 and HDLP types (both on order from Hypertronics)
Population of the FPGA CGA package (flight part)
Need to identify an Assembly Facility that is capable and approved for MAVEN Flight Board Manufacturing

44. MAVEN PFP Flight Software Status
December
Peter Harvey 44

45. Status Interface Documents FSW Development Test Status
Proposed FSW Fault Protection to monitor processes and status
Reviewed Fault protection w/ spacecraft provider and project
SC-PFDPU ICD changes being discussed
Awaiting clarification of the SC-PFDPU interface
Reviewed new DFB specification
Reviewed new MAG specification
Reviewed new DCB specification
New A/D document (SYS_027) overlapping with DCB (DCB_001G)
EUV door status moving from EUV message to PFDPU direct sampling
FSW Development
Analysis of Multiple Command Streams caused us to convert from 16 to 32-bit command definition. (Remove state-dependencies)
Updated the Command/Telemetry document, including test cases
Rewrote the Command input software to conform to the new 32-bit specification
Revising the IO module to meet revised DCB specification
Test Status
DCB ETU assembled
DCB FPGA to be programmed this week
DCB ETU will begin board-level hardware test
DCB ETU to Hyperterminal needs test software to be converted
No GSE/GSEOS ready to communicate

46. Metrics Chart
Progress Points=Telecons with GSFC. 1 pt for each telecon, 0 if the telecon did not happen.
Management Effort. Expected 10% or less, but has required phase A requirements and plans to be written in phase B.

47. Margin Chart

48. Fever Chart Boot Requirements changes in the works
Boot Specification (Fault protection) changes in the works
Boot Development halted
DCB ETU board unavailable for test of Boot FSW.