1. Thermosonic Bonding Ball bonding process A2 Group Members :
What is Thermosonic Bonding?
A process which involves the use of force, time, ultrasonic and heat to join two materials
The wire is pressed against the hot surface at low force and vibrated for a limited period of time to achieve the bond.
This process uses gold wire and a gold bond surface and it was also originally associated with Ball Bonding because the first time ultrasonic was used as a bonding parameter it was done with ball bonding
This bonding method is a combination of ultrasonic and thermocompression welding that optimizes the best qualities of each for microelectronics usage.
Ball bonding process
Process Development
Die design
Substrate design
Thermosonic Assembly
Process and reability study
Result
Advantages
Metallurgical joining is more reliable than conductive particles and adhesive joining.
Process cycle time can be reduced from several minutes to less than 10 seconds.
Lower manufacturing cost per unit.
The gold bumps
This resulted in approximately spherical bump of 75 and 50 m m in diameter and height, respectively. This wire bumping method is ideal for getting bumps onto individual chips. Once the wafer is diced it becomes difficult to bump by any other process.
Die design
Conclusion
A thermosonic flip-chip bonding process using conventional equipment has been successfully developed:
Gold wire bonder to form pull-off bump on silicon die with gold wire bondable aluminum pads.
Thick or thin film ceramic substrate.
Conventional flip-chip bonder with optional ultrasonic tool to provide alignment, heated stage, thermocompression loading, ultrasonic power and controllable duration to perform the flip-chip thermosonic flip-chip assembly.
A2 Group Members :
MOHD KASSIM BIN ZAKARIA
HALIMAH BINTI REDUAN
ANIS SYARAFINA BT APANDI
IZZUL AZRI B ILIAS
AHMAD FAIZ B MOHD LOTPI