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KemiPalTM PAD-6 Technical Data Sheet
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Contents Effect of plating time Effect of bath temperature
Effect of pH Effect of Pd concentration Effect of PAD-6-M concentration Effect of PAD-6-R concentration Effect of Ni contamination Effect of Cu contamination Effect of Fe contamination
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2. Effect of bath temperature
1. Effect of plating time Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Plating time 2. Effect of bath temperature Conditions Pd : 0.6 g/L pH : 7.2 Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Bath temp.
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4. Effect of Pd concentration
3. Effect of pH Conditions Pd : 0.6 g/L Bath temp. : 51℃ Plating time : 10 min PAD-M : 100 ml/L PAD-S1 : 250 ml/L PAD-R : 5 ml/L variable : pH 4. Effect of Pd concentration Conditions pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Pd conc.
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5. Effect of PAD-6-M concentration
Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : PAD-6-M conc. 6. Effect of PAD-6-R concentration Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating Time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L variable : PAD-6-R conc.
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7. Effect of Ni contamination
Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Ni conc. 8. Effect of Cu contamination Conditions Pd : 0.6 g/L pH : 7.2 Bath temp : 51℃ Plating Time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Cu conc.
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9. Effect of Fe contamination
Conditions Pd : 0.6 g/L pH : 7.2 Bath temp. : 51℃ Plating time : 10 min PAD-6-M : 100 ml/L PAD-6-S1 : 250 ml/L PAD-6-R : 5 ml/L variable : Fe conc.
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