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3.3.13 Wicking: Requirements
IPC-600H, Acceptable Class 3 Wicking does not exceed 80 μm [3,150 μin] Acceptable Class 2 Wicking does not exceed 100 μm [3,937 μin] Acceptable Class 1 Wicking does not exceed 125 μm [4,921 μin] IPC-6012C, paragraph 3.6.2 IPC-6013B, paragraph
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Note: Wicking is measured from the laminate edge excluding the plating
No wicking present (Target) 80 μm [ in] maximum allowed (Class 3) Figure 3313a Target Condition Figure 3313b Acceptable Class 3 Note: Wicking is measured from the laminate edge excluding the plating
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Note: Wicking is measured from the laminate edge excluding the plating
100 μm [ in] maximum allowed (Class 2) 125 μm [ in] maximum allowed (Class 1) Figure 3313b Acceptable Classes 1 & 2 Note: Wicking is measured from the laminate edge excluding the plating
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Nonconforming all Classes
Wicking Defects either do not meet or exceed above criteria Wicking measures µm [ in] Figure 3313c Nonconforming all Classes
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3.3.13.1 Wicking/Clearance Holes: Requirements
IPC-600H, Acceptable All Classes Wicking does not reduce conductor spacing less than specified minimum Acceptable Class 3 Wicking does not exceed 80 μm [3,150 μin] Acceptable Class 2 Wicking does not exceed 100 μm [3,937 μin] Acceptable Class 1 Wicking does not exceed 125 μm [4,921 μin] IPC-6012C, paragraph 3.6.2 IPC-6013B, paragraph
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3.3.13.1 Wicking/Clearance Holes
No wicking of conductive material into base material or along the reinforcement material A: Surface Pad B: Dielectric Material C: Adjacent Noncommon Conductors D: Surface Plating Figure 33131a Target Condition
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3.3.13.1 Wicking/Clearance Holes
Acceptable for Class 3 (A) < 80 μm [3150 μin] (B) does not reduce conductor spacing below minimum requirements Acceptable for Class 2 (A) < 100 μm [3937μin] Acceptable for Class 1 (A) < 125 μm [4921μin] Figure 33131b Acceptable all Classes
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3.3.13.1 Wicking/Clearance Holes
Nonconforming all Classes (A) exceeds 125 μm [ in] (B) reduces conductor spacing below minimum specified requirements Figure 33131c Nonconforming all Classes
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