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cooling and supports of the forward endcap EMC
Henk Smit, Michel Lindemulder, Rick Veenstra (mech. engineering), Annelie Kluttig (research engineer), Myroslav Kavatsyuk, Herbert Löhner, KVI Groningen new light frame integration of electronics integration of supports 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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Fw Endcap frame refinements
DiscDIRC adaptations 200 kg Al frame 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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FwEndcap EMC + DiscDIRC
required distances observed; adaptation for DiscDIRC foreseen 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
light frame space gained for accessible electronics frames easy fabrication: small screwed parts 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
side cooling cooled side-parts: close to crystals, max. space for DIRC, easy fabrication 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
cooling pipes and taps insulation 30 mm thick lower part: mirror symmetric inner 46 mm 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
SADC module under construction by Pawel Marciniewski 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
digitizer boards 165x100 mm2 single set of 44 optical link 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
digitizer boards 165x100 mm2 double set of 44 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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H. Löhner - PANDA-FwEndcapEMC
Summary new light FW Endcap frame design with accessible space for digitizer electronics many components designed in detail cooling simulations for a full ¼ model max. crystal temp. gradient 1.9 oC surface shield temperature 22 oC at 35 oC environment 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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time schedule Forw. Endcap EMC
Mechanics 1. inside cold area: - inserts + mounting plates for APD-readout < 2. isolation: - test of vacuum panels, isolation, feed-throughs with Proto192 < outside cold area: define & design space for SADC electronics, power supplies < - design cable routing and connectors < - concept of installation frame and insertion operation < - design options for including TOF layer < - construct support for * shaper, SADCs, cooling distribution, HV, LV cables, * mechanical support frame Cooling 4. test of cooling and isolation: proto < 5. concept of cooling with liquid + air flow < 6. planning / design heat exchanger, cooling circuit, regulation? 7. planning for cooling plant 5.9.11 H. Löhner - PANDA-FwEndcapEMC
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