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Published byLambert Fisher Modified over 6 years ago
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Date of download: 11/1/2017 Copyright © ASME. All rights reserved. From: Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders J. Electron. Packag. 2009;131(2): doi: / Figure Legend: Schematic of the diode laser soldering system
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Date of download: 11/1/2017 Copyright © ASME. All rights reserved. From: Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders J. Electron. Packag. 2009;131(2): doi: / Figure Legend: Tensile test of QFP microjoints soldered with two different kinds of methods
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Date of download: 11/1/2017 Copyright © ASME. All rights reserved. From: Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders J. Electron. Packag. 2009;131(2): doi: / Figure Legend: Fracture microstructures of QFP microjoints soldered with Sn–Pb solder: (a) IR reflow soldering and (b) laser soldering
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Date of download: 11/1/2017 Copyright © ASME. All rights reserved. From: Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders J. Electron. Packag. 2009;131(2): doi: / Figure Legend: Fracture microstructures of QFP microjoints soldered with Sn–Ag–Cu lead-free solder: (a) IR reflow soldering and (b) laser soldering
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Date of download: 11/1/2017 Copyright © ASME. All rights reserved. From: Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders J. Electron. Packag. 2009;131(2): doi: / Figure Legend: Tensile test of QFP microjoints soldered with two kinds of methods: (a) Sn–Ag–Cu–Ce microjoints and (b) Sn–Cu–Ni–Ce microjoints
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