1. Date of download: 11/3/2017
Copyright © ASME. All rights reserved.
From: Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
J. Electron. Packag. 2011;133(2): doi: /
Figure Legend:
SEM image of mirror-finished 304SS without etching

2. Date of download: 11/3/2017
Copyright © ASME. All rights reserved.
From: Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
J. Electron. Packag. 2011;133(2): doi: /
Figure Legend:
XRD pattern of 304SS

3. Date of download: 11/3/2017
Copyright © ASME. All rights reserved.
From: Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
J. Electron. Packag. 2011;133(2): doi: /
Figure Legend:
Cross section SEM images of a 304SS/Ni/Ag sample with thick, 50 μm, Ag layer electroplated, (a) at low magnification (2000×), showing the entire Ag layer, (b) at medium magnification (10000×), displaying SS/Ni/Ag assembly at a closer view, (c) at high magnification (20000×), showing that Ni/Ag bonds well to SS substrate

4. Date of download: 11/3/2017
Copyright © ASME. All rights reserved.
From: Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
J. Electron. Packag. 2011;133(2): doi: /
Figure Legend:
Cross section SEM images of a 304SS/Ni/Cu sample with thick, 50 μm, Cu layer electroplated, (a) at low magnification (2000×), showing the entire Cu layer, (b) at medium magnification (10000×), displaying SS/Ni/Cu assembly at a closer view, (c) at high magnification (20000×), showing that Ni/Cu bonds well to SS substrate

5. Date of download: 11/3/2017
Copyright © ASME. All rights reserved.
From: Microstructure and Surface Treatment of 304 Stainless Steel for Electronic Packaging
J. Electron. Packag. 2011;133(2): doi: /
Figure Legend:
Cross section SEM images of a 304SS/Ni/Au sample with thick, 70 μm, Au layer electroplated, (a) at low magnification (2000×), showing the entire Au layer, (b) at medium magnification (5000×), displaying SS/Ni/Au assembly at a closer view, (c) at high magnification (10000×), showing that Ni/Au bonds well to SS substrate