1. Date of download: 11/4/2017
Copyright © ASME. All rights reserved.
From: Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin
J. Appl. Mech. 2017;84(11): doi: /
Figure Legend:
(a) An EED consisting of temperature sensors and heaters on a skin in a twisting motion (Reproduced with permission from Webb et al. [2]. Copyright 2013 by Nature Publishing Group.) and (b) schematic diagram of the cross-sectional structure for the EED/skin system.

2. Date of download: 11/4/2017
Copyright © ASME. All rights reserved.
From: Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin
J. Appl. Mech. 2017;84(11): doi: /
Figure Legend:
(a) The distribution of the temperature increase along the radial direction at the EED/skin interface and (b) the distribution of the temperature increase along the thickness direction with r = 0

3. Date of download: 11/4/2017
Copyright © ASME. All rights reserved.
From: Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin
J. Appl. Mech. 2017;84(11): doi: /
Figure Legend:
The distribution of the maximum principle stress at the EED/skin interface along the radial direction

4. Date of download: 11/4/2017
Copyright © ASME. All rights reserved.
From: Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin
J. Appl. Mech. 2017;84(11): doi: /
Figure Legend:
(a) The influences of the thermal conductivity and thickness of the substrate on the maximum principle stress σmax at the EED/skin interface and (b) the influences of the Young’s modulus and thermal expansion coefficient of the substrate on the maximum principle stress σmax at the EED/skin interface

5. Date of download: 11/4/2017
Copyright © ASME. All rights reserved.
From: Thermomechanical Analysis of Epidermal Electronic Devices Integrated With Human Skin
J. Appl. Mech. 2017;84(11): doi: /
Figure Legend:
(a) The maximum temperature increase and (b) the maximum principle stress σmax at the EED/skin interface varies with the size of heating component and the substrate thickness