Download presentation
Presentation is loading. Please wait.
1
Meeting at CERN March 2011
2
Goals of AMchip04 Increase number of buses, 8 input buses with 15bits
Change output bus from 18 bits to 15bits Add pattern disable feature For yield management Add 3 Don’t Care bits / layer Optimized for density, speed, cost Density expected: ~8K patterns/12mm^2 speed: > 80MHz MHz Core power: expected 1W /100K IO power (?):
3
Global simulations (top down)
Global level simulation (change freq)… available to every group C++ level functional simulation Schematics/verilog functional level simulation with timing info at cell level, but zero delay for nets Netlist level simulation with layout info, with delay info of nets more realistic Includes full-custom models (critical)
4
Simulations (bottom up)
3 full-custom blocks in the core logic CAM layer Majority logic Readout logic (fisher tree, address and bitmap encoder) End of March: Simulation of each piece by itself (done for CAM layer) Manual simulations to verify functionality, timing, power consumption End of March: first boundary scan code End of March: CAM block simulation (in progress) 64 pairs of layers, + dummy layer, current bias Simulation time several hours End of March: Integrate these pieces together End of April: Integrated simulation with limited area 4 patterns + dummy layers Majority Readout logic End of April: Integration with global standard cell logic End of May: Prepare digital model(s) of full custom pieces or full custom block End of May: Verification of models (critical for success) Will require a workshop to gather designers in the same place Combine global logic with digital models global simulation Timing reports
5
Schedule/milestones (from feb 23rd)
end of March: a first version of the boundary scan is available preliminary layout of the majority logic cell available first version of the CAM-block available starting beginning of April work on a first integration of the chip end of April: after simulation and debugging… a final version of the boundary scan is available a complete layout of the majority logic cell final design for the CAM-block available starting beginning of May work on the final integration of the chip end of May: successful integration of all pieces during May test and simulation of the integrated design. during June based on simulation decide what adjustments are needed end of June: completed all simulations of the chip the final and integrated chip should be completely simulated and approved. early July submission
Similar presentations
© 2024 SlidePlayer.com. Inc.
All rights reserved.