1. Activities Status and Plan for the week
D. Giugni / INFN Milano
Monday Meeting
D. Giugni

2. Harnesses Stacking Set 0 left UN-USED Set 1 Set 2 Set 3
Decided so far to grab from the set only spares (if required). Considered not “for production”
Set 1
General
Set has been assigned to C34 (X0)
One Harnesses non conformal  one taken from Set 2
Status
All the Harnesses “Prepared” and tested
IPS, IHV-NTC, OIH-NTC are Stacked and tested
OPS stacking planned today
Open Issues
Need to repair the swapped harness
Set 2
Set has NOT been assigned to nSQP
Decided to put in hold: too many faults.
Only 2 Harnesses “Prepared” and tested
Need repairs
Set 3
General
Set assigned to C12
Status
All IHV-NTC and OHV-NTC “Prepared”
IHV-NTC, OHV-NTC Redy to stack (Today)
Open Issues
None
D. Giugni
Monday Meeting

3. Soldering Agreed sequence IF PP0 OSP boards are not released:
ISP C34 (X0) started
ISP C12 (X1?) will start next Monday (new soldering team)
ISP C56 (X2?) will start ~Feb 20th with the 3rd soldering team
ISP C78 (X3?) will start when ISP C12 is done (< Feb 20th)
D. Giugni
Monday Meeting

4. Post Soldering Assembly (General)
This activities is referring, at the moment, only to the Trail C34 (X-1)
Main operations:
Bond ER bundle organizers at PP0
Bond E_boards peek pins
Bond type0 cable stabilizer (only for ISP)
Bond PP1 Flanges
Bend harnesses at the dogleg
Testing
Load ER bundles (on the OSP bottom a/o ISP)
and mount some ancillary parts
Load the E-Boards (on the OSP bottom a/o ISP)
Functionality test
Secure the E-boards
D. Giugni
Monday Meeting

5. Post Soldering Assembly (Status)
OSP C4 (X-1)
Completed. Panel is not functional due to the extensive wire cut required to put it together
OSP C3(1) (X-1)
Not done yet. Panel has been just released from the Soldering
ISP C4 (X-1)
Completed. Panel is functional.
ISP C3 (X-1)
Bond ER bundle organizers at PP0
Bond E_boards peek pins
Bond type0 cable stabilizer (only for ISP)
Bond PP1 Flanges
Bend harnesses at the dogleg
Testing
Load ER bundles (on the OSP bottom a/o ISP) and mount some ancillary parts
Load the E-Boards (on the OSP bottom a/o ISP)
Functionality test
Secure the E-boards
D. Giugni
Monday Meeting

6. Final Assembly Referring only to the trial (X-1). Main operations:
Set up the backbone
Load the cooling pipes
Load OSP L and R
Load the ER_Bundles on the OSP’s Top
Load the E_Board on the OSP’s Top
Flip the assembly up side down
Dress up the ER_Bundles at PP1 and on the Flowers
Functionality Test
Load the ENV sensors
Flip the nSQP
Secure the Top E_Boards
Dress up the bundles at the PP1 can
D. Giugni
Monday Meeting

7. Schedule for this week
Schedule presented last week has been significantly reshuffled due to same missing parts. Mainly:
OSP PP0 boards, some ISP Cx and all A side boards.
PP0 stiffeners
The original nSQP assembly sequence:
has been changed to:
C34 ISP  C12 ISP  ISP C56  ISP C78 …
D. Giugni
Monday Meeting

8. Schedule for this week (2)
Corrugated panel bonding:
Delay in SLA parts. 2 panels done for the C34. Restart the production as soon as parts a delivered (this week?) .
PP0 boards stiffening and Alu Block bonding
Received C2, C5, C7 ISP board loaded.
Received ISP stiffeners
 Laminate and test the boards within this week ISP C12 (really needed by Fri!)
Soldering
Keep going with the ISP C34 (X0) HV-NTC (Main Team)
Prepare the second Team by next Mo for the ISP C12.
Post Soldering Assembly
On ISP C3 (X-1): Bond cable stabilizer Bend Harness, Test, Load ER-Bundles and dummy
E-Board
On OSP C4 (X-1): Start the full procedure.
Final Assembly Trial (X-1)
Work out better flipping tool
Load pipes in C3
Sort out ENV sensor location
Be prepared to receive the ISP C3 and ISP C3