1. Date of download: 11/6/2017
Copyright © ASME. All rights reserved.
From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. 2013;135(2): doi: /
Figure Legend:
(a) Actual specimen design (top) and schematic drawing (bottom) of the SS specimen. (b) Actual specimen design (top) and a schematic drawing (bottom) of the LS specimen. Dimensions are in mm.

2. Date of download: 11/6/2017
Copyright © ASME. All rights reserved.
From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. 2013;135(2): doi: /
Figure Legend:
SEM backscattered electron images illustrating the microstructure of Sn-3.5Ag/Cu solder joints of the SS2 specimen (25 μm-thick) fabricated at different temperatures for various soldering times

3. Date of download: 11/6/2017
Copyright © ASME. All rights reserved.
From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. 2013;135(2): doi: /
Figure Legend:
SEM backscattered electron images illustrating the microstructure of Sn-3.5Ag/Cu solder joints of the LS specimen (450 μm-thick) fabricated at different temperatures for various times

4. Date of download: 11/6/2017
Copyright © ASME. All rights reserved.
From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. 2013;135(2): doi: /
Figure Legend:
EDX analysis indicating the presence of (a) Cu3Sn (b) Cu6Sn5, and (c) Ag3Sn IMCs in the Sn-3.5Ag/Cu solder joints

5. Date of download: 11/6/2017
Copyright © ASME. All rights reserved.
From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. 2013;135(2): doi: /
Figure Legend:
Comparison of the IMC growth behavior in different specimen sizes at different soldering temperatures

6. Date of download: 11/6/2017
Copyright © ASME. All rights reserved.
From: Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
J. Electron. Packag. 2013;135(2): doi: /
Figure Legend:
Log-log plot of the growth rate constant versus the reciprocal of temperature: (a) for the Cu6Sn5 IMC layer and (b) for the Cu3Sn IMC layer in different specimen sizes