1. ATLAS Upgrade Phase I & II Overview, IBL & R&D Tracker
Roma, March 31th, 2008
G. Darbo - INFN / Genova
Agenda Page:

2. OVERVIEW

3. LHC  SLHC: Current Understanding
SLHC will come in two steps: SLHC Phase I & II
Phase I will happen one year late in 2014 (official L. Evans words), Phase II probably also late by one year (no official statement) will start in 2018.
Phase I will reach: 3x1034 peak luminosity (75 ev/bc) and 700 fb-1 integrated.
Phase II will reach: 1035 peak luminosity (400 ev/bc, 50 ns) and fb-1.
ATLAS, CMS and LHC discussing luminosity plots at the LHCC:
Four LHCC upgrade sessions/reviews since July 2008http://indico.cern.ch/categoryDisplay.py?categId=1949

4. SLHC Phase I: Pixels Pixel detector need upgrade:
B-Layer will not survive till end of Phase I (radiation damage) – designed for 1x1015 neq/cm2 fluence and expected > 3x1015 – front-end chips (FE-I3) will be inefficient at 3x1034 luminosity
B-Layer cannot be substituted in a long shutdown: time, activation, dismount large part of pixel package
A new layer inserted into the existing detector  new technology, new (smaller) beam-pipe
Solution: Insertable Pixel B-Layer (IBL  see slides)

5. SLHC Phase I: Muon
Muon detector has large uncertainty (factor 5) on cavern background:
Possible performance degradation in the very forward region 2.0<h <2.7 (CSC region)
Original Muon Spectrometer Design with 2 layers of CSC (8 precision measurements) but currently only one layer installed.
Study the possibility to reinforce the CSC region by inserting a thin (50 mm) detectors to provide more measuring points and possibly pad read-out
Current Options:
TGC (Italian Group Interested in the electronics)
MicroMegas (Italian Group Interested)
ThinTubes MDT (Italian groups interested )

6. Small Wheel: CSC
CSC

7. SLHC Phase I: TDAQ Trigger/DAQ:
Several detectors have limited event volume; L1A rate at 3x1034 will be limited to 50-60kHz at 100% traffic levels
Some detector inefficiencies as latency approaches 2.5 µs
To reduce trigger rate  topological upgrade (still need to prove that this is useful)

8. ATLAS Phase II Upgrades: ID
The Inner Detector will be completely replaced:
Currently all silicon layout – options include gaseous detectors, trigger detectors
Occupancy (400 ev, more pixels?) & material budget are critical issues  Layout Task Force (L. Rossi) appointed 2/2009 (AUW)
Assemble whole ID at surface – install 7 m object
Many services reused – new optical fibers (5 Gb/s vs. 40 Mb/s), CO2 cooling pipes
Pixel (4 layers)
Short strips (3 layers)
Long strips (2 layers)
Strips/Pixel disks
SLHC ID Layout (2008 version)

9. Phase II Upgrade: Calorimetry
LAr (see M. Citterio talk today):
Most remains, new R/O (not rad-hard enough, better triggering)
New PS (suit new R/O and current will be obsolete)
LAr FCAL
Several possible problems under study - ion build up between electrodes, heating causing boiling…
Two solution considered: add mini-FCAL – replace FCAL (major work in the pit)
Tile Calorimeters
Scintillators, fibres, PM all OK
New R/O – all data to USA15 – follow LAr for better trigger granularity
New PS – current will be obsolete – match new FE electronics

10. Counting rates @ 1034 No safety factors
CSC

11. ATLAS Phase II Upgrades: Muon
Need to upgrade the forward region
Need to sharpen the trigger thresholds
Need to revise all the front and back-end electronics
New small wheels
Detector options
TGC With trigger capabilities
MicroMegas With trigger capabilities
Small Tubes MDT
Reinforcement of the inner part of the Big Wheels

12. Single Muon Triggers ATLAS Muon trigger: How improve single µ-trigger:
Single µ-rate to high
No control of rate above ~20 GeV
Physics rate still OK (~Event Filter) at >20GeV
How improve single µ-trigger:
Use the Small Wheel in the trigger decision (presently only Big Wheel is used)
Adding in selected regions of the inner layer of the barrel new triggering detectors (remove effect of IP z-spread)
TDAQ need a strategy:
10x bandwidth at current trigger rates
Throw away 90 % of current – good – events
Considering a combination of several options like:
Higher LVL1 rate (<~ 2x) - Longer LVL1 latency (<~ 2x): do some of LVL2 task at LVL1, e.g. combining objects
Fast reject “LVL1.5” - Fast track trigger (FTK, associative memory) feeding LVL2 with tracks
Calorimeter performance - Muon possibilities
Is an Inner Track Trigger at LVL1 possible, needed, the best way to go??
ATLAS
Ref.: T. Kawamoto
Muon Week - 28/10/2008

13. LoI – TP
A Letter of Intention (LoI) for mid of next year followed by a Technical Proposal (TP) in 2012÷13

14. IBL
Organization, INFN interests, money.
IBL

15. Beam-pipe - Layout Beam-pipe radius can be reduced by at least 4mm
On-site survey has shown that cavern floor is stable (~1mm respect 9.8mm foreseen)
See LEB (LHC Experimental Beam-pipes) WG – 5/3/2009:
Smaller beam-pipe  Layout options
Better physics performance obtained with “reverse turbine” layout -sensor facing beam-pipe – cooling redundancy (two cooling pipes) for beam-pipe bake-out
1 mm

16. X0 - Ti cooling pipe option X0 - CF cooling pipe option
Material Budget
Physics performance  low material budget
Strategy for reducing X0: carbon foam, carbon fiber (CF) cooling pipe, CO2 cooling,…
X0 - Ti cooling pipe option
X0 - CF cooling pipe option
Omega
Carbon foam
Epoxy
Sensor
R/O chips
Flex
Cooling pipe (Al)
Cooling fluid (C3F8)
General total
Total structure
Structure+cool. Fluid
Omega
Carbon foam
Epoxy
Sensor
R/O chips
Flex
Cooling pipe (CF)
Cooling fluid
General total
Total structure
Structure + cool. Fluid

17. IBL Organization
Project Leader (IBL-PL) endorsed by ATLAS CB: G. Darbo
IBL Technical Coordinator (IBL-TC): H. Pernegger
Project organization in discussion these days
IBL TDR – Early 2010
reduce options for TDR – 2 sensor options will stay: 3D and n-in-n
Cost and funding
Cost evaluation (include new beam-pipe, installation, prototype work) in advance evaluation phase
Part of the cost (~50%) covered by M&O-B (4.4 MCH are in the RRB tables inside Pixel M&O-B 2009÷12) – remaining on new groups and M&O-A
MoU prepared together with TDR – “interim MoU” drafted by June time scale and more final by October AUW (ATLAS Upgrade Week)

18. INFN Possible Interests - I
FE-I4
New front-end chip. 50x250µm2 pixels, 26.9k pixels, 160 Mb/s R/O.
5 labs: Bonn, CPPM, Genova, LBNL, Nikhef
Sensors
3D & Planar (n-in-n) sensors are the options: 3D more charge after life dose (>3x1015 n/cm2) but scale production needs demonstration. Planar known technology but high Vbias (>800÷1000V) is a system issue.
Genova (with IRST in 3D) & Udine (3D & Planar) in ATLAS. IRST-FBK, TN & TS in IGRV (3D sensors)
Stave mechanics
Milano actively involved in the pipe R&D and in the stave design.

19. INFN Possible Interests - II
Stave Flex Hybrid
Genova interested in the development of the “Stave” Flex Hybrid. Nice complement of the stave design in Milano to which the component is tightly connected.
Module/Stave Loading & QC
Genova interested in a role (to be better defined) in the module testing/stave loading & qualification process.
PP2
Milano interested in the PP2 deliverable. They will provide it, if design need minimum changes (no redesign of the board).
Other deliverables / activities
Under investigation possible contribution on other parts and from new ATLAS groups.

20. R&D Tracker

21. Frontend Chip - FE-I4 FE-I4 Status
Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements, irradiation
Design review (3/2009): “Design Technical Issues” on full scale design
Foreseen complete design review in June and chip submission after Summer.
New FE-I4
Pixel size = 250 x 50 µm2
Pixels = 80 x 336
Technology = 0.13µm
Power = 0.5 W/cm2
FE-I3
active
16.8mm
20.2mm
~2mm
~200μm
FE-I4
~89%
Chartered reticule (24 x 32)
IBM reticule
~19 mm
7.6mm
8mm
active
2.8mm
FE-I3
74%

22. FE-I4 Review FE-I4 – “Design Technical Issue” Review
March 2nd , Review agenda page:

23. Sensors Planar & 3D Pixel Sensors R&D INFN R&D Activities:
3D: CNM Barcellona, Bonn, CERN, Freiburg, Genova, Glasgow, Hawaii, LBNL, Manchester, Oslo, SINTEF Oslo, Prague, MBC/Stanford, IRST Trento,  Udine) Valencia
Prague, LAL Orsay ( Pisa-G.Calderini), Bonn, HU Berlin, TU Dortmund, MPP Munich, MPI Munich, Udine, Liverpool, UNM Albuquerque, UCSC Santa Cruz.
IBL uses short time scale developments from both R&D’s
INFN R&D Activities:
GE: bump-bonding 3D sensors, testing with FE-I3, design collaboration with IRST, contribute to a batch of sensors (cost under “Convenzione INFN/Prov.TN)
PI: work on planar sensors (also 3D), design & test slim edge sensors (critical for IBL where sensors are not shingled in Z – no space)
UD: simulation of 3D sensor structures (Synopsys Dessis), test devices, test beam.
IRST – FBK & TN: INFN Gruppo V
Money see referee

24. Stave Homogeneous Stave – advantages R&D (Milano) Money  see referee
Low density carbon foam structure with titanium or carbon fiber (CF) pipe option. CF pipe advantages: low X0, thermal matching with carbon foam support, non corrosion issues.
Good progress in CF pipes: tested at 150 atm, no leakage (<10-7 atm•cc/s). New technology: need qualification for micro-crack development, develop fittings, find second source for production
R&D (Milano)
Study micro-cracks of irradiated CF pipes
Study CF fittings for the pipes
Qualification of a second source vendor for pipes
Study of number of staves/CF pipes to evaluate yields.
Money  see referee
Homogeneous Stave

25. FTK - Architecture Exploit CDF track trigger to ATLAS
See Paola Giannetti’s talk at Sestri Levante:
Aims of a FTK in ATLAS:
Tau & b-jet trigger at 1034 and Phase I – use as LVL1.5 trigger
Possible LVL1 extension for Phase II
Use Pixel and SCT
R&D Scope
Evaluate feasibility
Evaluate costs
Compare alternative (beefed up HLT especially LVL2)

26. FBK – R&D R&D presented to ATLAS Status of the R&D:
Chicago, LNF (A. Annovi, M. Beretta, P. Laurelli), Harvard, Illinois, Pisa (V. Cavasinni, F. Crescioli, M. Dell’Orso, T. Del Prete, A. Dotti, P. Giannetti, G. Punzi, C. Roda, F. Sarri, I. Vivarelli, G. Volpi), Roma1 (M. Rescigno)
ATLAS Upgrade Steering Group approved to develop a system appropriate to ATLAS.
Status of the R&D:
FTKsim is almost complete, but still un-friendly. Monitoring plots have been added. Insertion into Athena still in progress
Hardware architecture choice: in progress this is the most complex part at the moment.
Tau-jet and b-jet tagging performances at 10 **34 near to be ready
Firmware/hardware development in progress: minimum needed for a reliable timing evaluation.
No money requested now

27. BACKUP SLIDES

28. LHC: Luminosity Plot Peak Luminosity Plot – Before LHC Accident
SLHC II
New injectors
+ IR upgrade
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2024
2025
2026
SLHC I
New Triplet
IBL Installed
L= 3 x 1034 cm-2s-1
Shifted by one year
Ref. F. Zimmermann - AUW
SLHC Phase I delayed by one year 2014
Ref.: M. Nessi (AUW) from L. Evans
Luminosity Plot
Ref. R. Garoby – LHCC 1/7/2008 –

29. R&D  Systems
November Total of 34 proposals or expression-of-interest submitted since ~210 Institutes participating (multiple times), 7% of INFN
Three new EoIs:
TDAQ upgrade (Norman Gee) – see mail archive (
LV1 track trigger (Richard Brenner) – see:
Mini-FCAL
R&Ds working groups as backbone of LoI
mapped into LoI sections.

30. Inner Tracker R&D EoI, Proposal presented to USG
Approved by Executive Board
Status – November 2008
Inner Detector
Strips
Pixel

31. Calorimeter, Muon & Other R&D
EoI, Proposal presented to USG
Approved by Executive Board
Status – November 2008
Trigger, Elec, …
Calorimeter
Muon