1. C.Clerc ILD session, ALCPG 2011 22/03/2010
ILD integration
ETD & Inner region
C.Clerc, M.Jore, H.Videau
With contributions from :
D.Moya IFCA
J.Baudot IPHC
C.Clerc ILD session, ALCPG /03/2010

2. C.Clerc ILD session, ALCPG 2011 22/03/2010
ETD, mechanical design
Vertex : cabling-cooling
FTD 1-2: integration
FTD : FTD 3 to 7 mechanical design, integration
C.Clerc ILD session, ALCPG /03/2010

3. (1) ETD ETD actual baseline :
3-layers XUV of single sided micro-strips
Fixed to Ecal endcap
Octogonal shape to fit to Calo design
Rout : less than Ecal Rin ( 1843)
Discussions between 2 or 3 layers : ( in the hands of simulation)
2 seems to be chosen/enough (XY) ?
Each layers is 15mm thick
Total thickness 45mm>30 mm
ETD layers for the XY solution (from P. Ghislain – LPNHE)
LPNHE will restart the mechanical integration
C.Clerc ILD session, ALCPG /03/2010

4. C.Clerc ILD session, ALCPG 2011 22/03/2010
(1) ETD
Work ongoing (LPNHE) :
Modify the layers with the needed dimension
Outer radius about 1800 according to sensor size
Integrate the fixation elements
Estimate the number of cables
Check the cooling
Could be one thin aluminium foil with on cooling pipe outside
Possibilty to merge with the Ecal EC one
Carbon/Foam/Carbon 5mm thick
15mm
CFC sensor support
Cables
Sensor
C.Clerc ILD session, ALCPG /03/2010

5. C.Clerc ILD session, ALCPG 2011 22/03/2010
(2) VXD : cables inside the cryostat
Cabling inside the cryostat :
Flat kapton cables ( 50µm-1.5cm) running from each ladder to Cryostat at level of the beam pipe
5 cables running at 10° along the beam pipe
60 cables crossing acceptance between °
Size of the patch panel / Radius of beam pipe ( 24 mm)
Incidence on Faraday cage ?
Conductor in the kapton Cu or Al? position patch panel , actually th  140µm ...
C.Clerc ILD session, ALCPG /03/2010

6. C.Clerc ILD session, ALCPG 2011 22/03/2010
(2) VXD cables outside the cryostat
Power distribution :
Dimensioning of the cables under discussion according to :
the total instantaneous power needed
300 to 600 W (300 Mpixels with 1 to 2 μW/pixel) cover all technologies and geometry (3 double or 5 single layers)
Position of the patch panel and DC/DC convertor (  close to TPC endplate)
Allowed voltage drop ( 0,1V under 3V)
Control signals
~15 lines with ~15 Amps total per side
Datas
15 ( ?) optical fibers per side ?
X0% around the beam pipe .....
C.Clerc ILD session, ALCPG /03/2010

7. (3) FTD 1-2 Alternative integration of FTD 1&2
FTD1&2 use Pixel sensors
Might need a cryostat and a faraday cage as the Vertex
Discussion ongoing to review their integration :
Integrated in the same cryostat than the VTX
Position and dimensions would be modified
Integration procedure too
C.Clerc ILD session, ALCPG /03/2010

8. C.Clerc ILD session, ALCPG 2011 22/03/2010
(4) FTD 3-7
FTD 3->7
Mechanical design under study by D. Moya
Current design :
Each FTD in 2 halves botled and fixed to the support tube
Impact on the mounting scenario under study
In red : mechanical support of petals
4 sensors per petal: 2 per side
Support of strip ( petal)
C.Clerc ILD session, ALCPG /03/2010

9. C.Clerc ILD session, ALCPG 2011 22/03/2010
(4) FTD 3-7
Cables/electronics :
Will be estimated and integrated in a near future
Cables will run along the beam pipe
Calculations ongoing to design the inner support tube (D. Moya)
Tube of 1mm thick , composite material + + additional rings at FTD positions
Displacement < 120µm
Stress behaviour
C.Clerc ILD session, ALCPG /03/2010

10. Conclusion : A lot in progress....
But Still lot of work needed for a better understanding
Some results in April/May ? :
Integration scenario of the inner part
First estimation of the volume of cables ( X0) running along the beam pipe ( case of VXD)
Questions :
Nber of layers of ETD ?
SIT ?
Next meeting in Orsay will have a dedicated session to the inner detectors integration
C.Clerc ILD session, ALCPG /03/2010