1. Hans Krüger, University of Bonn
DHP 0.1 Submission
Hans Krüger, University of Bonn

2. Overview
~4000 µm
~2000 µm
H. Krüger, March 3, 2010

3. DHP 0.1 chip submission – done!
Implementation
90 nm IBM CMOS ($ MPW + $ C4 bumps)
32 inputs, 2 mm x 4 mm chip size (half of final chip)
C4 solder bumps, 200 µm pitch (+ wire bonds)
Features
max. number of pixel rows: 1024 (256 Switcher channels)
raw memory storage: two frames (2048 rows)
common mode and static or dynamic (max. 16 frames average) pedestal correction
offset compensation memory for DCD
simple sequencer for Switcher control (no strobe gate support)
two independent PLL blocks (fVCO = 900 MHz – 2.3 GHz):
digital core + DCD/Switcher timing (nom. 1.6 GHz, div by [4,8,16] outputs)
data serializer + Gbit link
Gbit CML data output driver, AURORA 8B/10B link layer protocol
DAC, ADC, band gap reference (U Barcelona) test circuits
H. Krüger, March 3, 2010

4. Interconnect Issues
Wire-bond IOs + area pads for C4 connected in parallel
however layouts are required to have either WB passivation openings or C4 openings (although on different layers)
we decided to submit layout with bump bond support
Test setup preparation
Bump bond adapter (including DCD footprint)
Adapter PCB
FPGA board (ML505 evaluation board) supporting RocketIO for DHP data output
Flex kapton cable with repeater (optional)
Documentation
H. Krüger, March 3, 2010

5. DHP Test / Prototype Hardware
Stand-alone DHP test
wire bond DHP (packaged?)
debug I/O connectors on PCB
 not possible, no WB version available
Combined DCD-DHP test + small matrix r/o
different matrices + bump bond adapter
Large matrix r/o
place DHP instead of DCD-RO chip
small number of LVDS lines + some LVCMOS on flat ribbon cable
SATA + or custom flex for gigabit data output (CML)
DHP
wire bond PCB
ML-505 board SW
128 x 8(16)
matrix V5
FPGA
USB
DCD
DHP
bump bond adapter
adapter PCB
PCIe
need RocketIO for DHP r/o (AURORA support: at least V4FX or V5) SW SW SW SW
768 x 160 (120, 180)
matrix
DCD
DHP
DCD
DHP
DCD
DHP
adapter PCB
H. Krüger, March 3, 2010