2. Technology advancement in computer architecture
The advancement in computer architecture focus on achieving high processing power, low power consumption, high scalability and time to market with competitive cost.
The above improvement is achieved with focus on individual element in Computer Architecture such as internal and external buses, networking topologies, micro architecture and even extended to development process.
It is the ability of a computer application or product (hardware or software) to continue to function well as it (or its context) is changed in size or volume in order to meet a user need.

3. Advancement in Microarchitecture: fig represents semiconductor technology growth trend from 2004 to 2016 it is evident that performance is increasing considerably with increase in micro technology
Year
2004
2007
2013
2016
Technology generation (nm) 90 65 32 22
Wafer size(mm)
300
450
Defect density(per m^2)
1356
1116
Mircoprocessor die size(mm^2)
310
Chip frequency(M Hz) 4
6.7
19.4 29
MaxPwr(W) High performance
160
190
251
290
Technology generation defined by:
 Feature size: Size of the smallest features on an IC, usually the length of the transistor channel.
Current feature size: 180 nm 
A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated.

4. In electronics, a wafer (also called a slice or substrate[1]) is a thin slice of semiconductor material, such as a silicon crystal, used in the fabrication of integrated circuits and other micro devices.
The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.

5. 1-inch (25 mm)
2-inch (51 mm). Thickness 275 µm.
3-inch (76 mm). Thickness 375 µm.
4-inch (100 mm). Thickness 525 µm.
5-inch (130 mm) or 125 mm (4.9 inch). Thickness 625 µm.
150 mm (5.9 inch, usually referred to as "6 inch"). Thickness 675 µm.
200 mm (7.9 inch, usually referred to as "8 inch"). Thickness 725 µm.
300 mm (11.8 inch, usually referred to as "12 inch"). Thickness 775 µm.
450 mm (17.7 inch, usually referred to as "18 inch"). Thickness 925 µm (expected).

6. 2-inch (51 mm), 4-inch (100 mm), 6-inch (150 mm), and 8-inch (200 mm) wafers

7. System design evolution or Key Driving Force in IC Technology
Figure shows how minimum microprocessor feature size has tracked Moore’s Law since the introduction of the Intel 4004, which used 10-micron (10,000-nm) lithography.
The figure also incorporates ITRS (International Technology Roadmap for Semiconductor) projections to the year 2020, when the minimum feature size is expected to be an incredibly tiny 16nm.
Each reduction in feature size produces a corresponding increase in the number of transistors that will fit on a chip. 

8. Evolution of feature size over the last 50 years

10. This lifecycle perspective can be used as a guide as the industry makes transitions to larger wafers.
By the year 2000, the first processing on 300mm (12 inch) wafers is anticipated. 300mm wafers will accommodate roughly twice as many dice per wafer as 200mm wafers.
Driving forces for all wafer size transitions include the factors of ever increasing die size and increasing numbers of integrated functions per chip.
market conditions are influencing the rapidity with which 300mm silicon wafers will become manufacturing worthy and cost effective.

11. Trends indicate that wafer size transitions industry-wide have typically enabled a 4 percent per year productivity improvement, and the transition to 300mm should provide between 2 and 4 percent per year lower IC cost/cm2

12. Microarchitecture
Resources inside microprocessor or microcontroller such as registers, CPU core, internal memory , input – outputs are interconnected through primary and secondary buses is defined as microarchitecture.
Understanding microarchitecture helps in optimizing a hardware or software design. This helps to get high performance to cost of design elements.
Performance can be improved by understanding the pipeline architecture, branch predictions and instruction code and cycle time for each operation.

13. Multicore processors
Multicore processor is a processor where more than one core CPU is attached to enhance the performance.
Multicore processors are especially used where more graphics and gaming application required.
MCP is challenging in terms of resource sharing, coherence prorocol and inter communication between cores.
1. Dual cores – 2 cores in a processor
2. Quad cores – 4 cores in a processor
3. Hexa cores – 6 cores in a processor

14. Examples of Dual core Processor are AMD Phenom II X2, Intel Dual core etc.
Quad cores are AMD Phenom X4 , Intel Quad cores
Intel core i5 and i7 extreme processor is an example of a hexa core.