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Development electronics SIPM-MU2e

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Presentation on theme: "Development electronics SIPM-MU2e"— Presentation transcript:

1 Development electronics SIPM-MU2e
INFN-LNF G. Corradi 11/06/2016

2 Calorimeter routing Detector Solenoid DAQ room ~7-8 m Floating LV
overall cross section ~180 cm2 Floating LV +28V / negative Floating positive HV 230 V (MPPC) ground ~60-80 m overall cross section ~210 cm2 LV HV isolation OVP filter Safety Ground Detector Ground Floating Structures

3 Architecture front-end
Optimization of space Cables and connectors

4 Preamp-Regulator scheme

5 Electric preamplifier scheme
Preamplifier_SIPM Preamplifier Shaper filter Select Gain Select Pulse Test Differential Driver Linear Regulation Electric preamplifier scheme

6 Simulation before end after filter

7 Simulation bandwidth Preamplifier

8 Simulation bandwidth after filter

9 Preliminary Specifications Preamplifier
Gain Vout/Vin 2 step remote control Dynamic differential /-1V Bandwidth Mhz Rise time ns Output impedance Ω Stability with source capacity max nf Coupling output end source AC Noise, with source capacity 1pf Power dissipation mW Power supply V Semi-gaussian shaping filter pole Injection test pulse charging, fixed amplitude mV Input protection mJ

10 Linear_ Regulator Electric linear regulator scheme Linear Driver
Decoder ADC 16bit Linear low Voltage section I2C line DAC 16bit Electric linear regulator scheme

11 Preliminary Specifications regulator
Vin max V Current limit 2mA Dynamic regulation 5V to 200V Settling time us Ramp-up programmable 1ms to 100ms Ripple estimated 3mVpp Stability Δt 10 °C better 50 ppm Power dissipation with out load min 50 mW Power dissipation max load, worst case max 350 mW Temperature measurement to 50°C Monitor current detector 50uA to 2mA Remote control I2C GND insulated from earth Ceq max 5pf

12 PCB Layer TOP Preamplifier
Dimention card 58mm x 30mm

13 PCB Layer Bottom Regulator
4 holes for heat transfer on the mechanics

14 Final Assemblay Thermal conducting Power to dissipate max 350mW Board
Thermal Contact By Bridge resistor Thermal conducting Power to dissipate max 350mW Board Temperature Sensor Case (Cu) Output Connector

15 Costs COSTS in EURO ON DETECTOR Electronics = FEE
V4.0 by G.Corradi (SEA), LNF 27/05/16 History : from APD to SIPM. New Granularity. New SIPM array. 1) Engineering Evaluation based from extrapolation on the prototype system. For LYSO and CsI+MPPC 12x12 mm**2. 2) Granularity of LV-HV controller .. Now called MB (Mezzanine Board) is 20 channels. 3) Differential output to be sent to the WD board 4) ARM controller included in MB. DC-DC converter common with WD It includes all electronics close to the SIPM: The amp-HV chips, the MB controller & the cables from ARM3 to APD and from APD to digitizer It includes the HV system outside the DS bulkhead, IFB (Instrumente Feedthrough Bulkhead) It does not include the LV system outside the IFB. This goes to WD cost. It includes all cables from SIPM to MB. It includes all cables from HV to IFB and IFB to MB. Feedthroughs are on Muon Beam Line. Calculation of cabling is done following latest Integration work done by I.Sarra It assumes no VAT. Production will be done to be sent in USA. SVILUPPO FEE FINALE 2016 Prototype Module 0 version 0 3 boards 3000 Version channels 8000 Production 6 MB version 1 Proto LV supply 1 amp . 3 schede Proto HV supply 250 V. 3 schede Total Cost SVILUPPO 20000 AMP-HV chips Num Crystals 1348 Num FEE = Num Crystals x 2 2696 NUM AMPHV Chips (LNF) ( % spare) 3235,2 COSTS in EURO Total/chip 55 It includes the following additional FEE components: 1 chip for T monitoring. I-readout. 2 amplification values. 1 pulse test. 2 independent Vbias/array Total Cost AMP-HV chips 177936

16 Number of LV [+/-](4 cavi BT/sens per crate)
Costs (2) MB CONTROLLER Num channel/board 20 Num MB-boards 161 Cost for MB-board (mezzanine board vs WF) 200 It takes into account the option to have a signal pulse for testing FEE, current and temperature reading. Add 20 Differential drivers/board Total Cost MB Boards 32200 Regolatore 8 Volt 1 amp per MB Total Cost 8 V regulators 3220 CABLES from AMP-HV to MB LV, HV da SIPM to MB Num Signal cable 3000 Signal Cable Length (cm) - 5 coppie 50-100 connettori inclusi TOTAL Cost FEE CABLES 25000 EXTERNAL POWER SUPPLY FOR FEE (LV/HV) Num Power Supply/crate 1 Num crates/disk 11 Num Crates (15% spares) 25 Cost per LV supply 600 TOTAL Cost LV Supply 15000 Linear LV supply, 28 V, 15 amp va su WFD Cost per HV supply (Max 250 V, 320 mA) 320 TOTAL cost HV supply 8000 CABLES FROM PIT TO DS Number of LV/HV cables/crate 4 Number of LV [+/-](4 cavi BT/sens per crate) 100 Each LV cable power up 4 boards (Left,Right) Feedthrough on DS are on USA side. LV cables are the same for MB and WFD Number of HV [+/-](4 cavi HV + 4 sense per crate) 96 For HV, we are assuming to do the same , 4 HV cables per crate Distance from Supply to final FEE (m) 80 70 metri fuori+10 dentro DS Total Cable length LV 7680 Total Cable length HV Cost of composite cable LV (Halogen Free, + 10%)E/m 0,75 connectors included Cost of composite cable HV (Halogen Free, + 10%)E/m 2 Total cost PIT-to-DS CABLES 21120 Total cost QA for produzione TOTAL FEE 295476 SENZA LV! TOTAL FEE + CONTINGENCY (10%) 325023,6

17 Status and perspectives
Preamp-regulator, project completed Test, first week of june Firmware development working progress Definition of the cables and interface connectors between preamplifier and controller Project progress, primary regulator prototype 250V 40mA ( with known magnetic field problems) Project progress, primary regulator prototype 8V 1A (same problems as mentioned earlier) Project and development controller ARM


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