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Microfluidic devices for thermal management

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Presentation on theme: "Microfluidic devices for thermal management"— Presentation transcript:

1 Microfluidic devices for thermal management
Timothée Frei Neuchâtel, 6 June 2017

2 outline Intro to CERN, HEP, silicon detectors and their thermal management. NA62 microfluidic cooling Closed loop cooling with Micro-engineered enhanced interconnection.. My thesis To get started silicon microchannels with RTDs for CO2 tests We still need connectors This is how we did Could we do it better? CSEM – soldered option 3D printing Neuchâtel, 6 June 2017

3 NA62 Silicon Microchannel Cooling
1. LASER welding 1/16” SS capillaries to KOVAR connectors 3. NICROBRAZ brazing 1/16” SS capillaries to SS manifolds 4. Au-plating KOVAR connectors 5. Vacuum brazing KOVAR connectors do Si 2. Bending of the capillaries 1/16” SS capillaries with 0.1 mm wall thickness 3 detector modules Liquid C6F14 Top below -10ºC Power dissipation 25W-48W over 6x4cm2 Kovar, Cu-plated -> Au-100nm, Ni-350nm, Ti-200nm + SnPb wire (dia 0.5mm) A. Mapelli et al JINST 7 C01111 P. Petagna et al., Microelec. Journal 44 (2013) 612–618 G. Romagnoli et al., Microelec. Eng. 145 (2015) Neuchâtel, 6 June 2017

4 Cooling System Schematic
ON-DETECTOR COOLING SYSTEM Microchannels Single or two-phases flows Heat transferred to external cooler Fluidic lines come near the detector Neuchâtel, 6 June 2017

5 Thermal Management in HEP and Space Applications
Dissipate heat generated by electronics Extend service-life of components Vacuum + Radiation Silicon embedded microchannel cooling (e.g. NA62 GTK) Cooling Plant Connection to main cooling circuit is challenging

6 Envisioned Cooling System Schematic
ON-DETECTOR COOLING SYSTEM Two cooling circuits Primary circuits transfer heat from detector to the secondary cooling circuit Secondary circuit transfer the heat to external cooler Micro-engineered enhanced interconnection Transfer heat from primary circuit’s condenser to secondary circuit evaporator Re-workability Activation Control system Additional heat if required What we want to implement in the future Neuchâtel, 6 June 2017

7 Primary circuits Monolithic oscillating heat pipe (OHP), also known as pulsating heat pipe (PHP) for high energy physic and space applications Non-linear stochastic phenomena Few CFD analyses and models Transfer several kW to distances of the order of 1 m Sensible to orientation with respect to gravity (depending on the diameter) Made of Si, wickless Heater in Activation Control System is used to start oscillations of vapor 𝑔 Si detector Bump bond iramis.cea.fr Read-out chips Thermal interface PHP Neuchâtel, 6 June 2017

8 Micro-engineered enhanced interconnection
Transfer heat from primary circuit’s condenser to secondary circuit evaporator Re-workability Secondary cooling system stays closed / No intervention on the refrigerant Neuchâtel, 6 June 2017

9 Open issues Neuchâtel, 6 June 2017

10 Vacuum flask with refrigerant
Filling procedure Back-filling process OHP/PHP Valve 2 Valve 1 H. Ma, Oscillating Heat Pipes, 2015 Vacuum Sensor Mass balance Valve 3 Vacuum Pump Valve 4 Cold Trap Vacuum flask with refrigerant Quick-filling process Vacuum Sensor Valve 1 Valve 2 Vacuum Pump Valve 3 Ruler OHP/PHP Refrigerant Neuchâtel, 6 June 2017

11 Test Test performance in different positions
𝜃 𝜙 Test performance in different positions Test performance with different filing ratio Test performance with different power inputs, refrigerants, and refrigerant temperatures Thermal performances using RTDs or IR imagery Flow visualization using high speed camera Filing ratio of ~30% (left) and ~60% (right) Neuchâtel, 6 June 2017

12 ALICE ITS Microfluidic Interconnect
3D printed interconnector (3D Systems printer/Accura 25) Connects two silicon frames Liquid C4F10 Replace out-of-plane connection for in-plane connection T. Morais, 2016 Neuchâtel, 6 June 2017

13 ALICE ITS Microfluidics Connectors
3D printed connector glued to silicon frame (3D Systems printer/ Accura 25) Connects Ø1.2mm tubing to Ø0.6mm inlet Liquid C4F10 A. Toros, 2015 Neuchâtel, 6 June 2017


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