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Phase 2 Outer Tracker Module analysis

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Presentation on theme: "Phase 2 Outer Tracker Module analysis"— Presentation transcript:

1 Phase 2 Outer Tracker Module analysis
and some wirebonding Susanne Kyre UC Santa Barbara Tracker upgrade workshop June 3, 2009 Susanne Kyre

2 TK OB module for thermal analysis
Module geometry based on slides from April Tracker week Tracker upgrade workshop June 3, 2009 Susanne Kyre

3 Dimensions and Materials
Part Material Area [mm2] Thickness [microns] thermal conductivity [W/mK] Power [mW] Sensor Silicon 100 x 100 200 148 100 Chip 7 x 7 500 125 DCU 3 x3 1000 DC-DC 5 x 5 150 Pitch adapter Kapton 116 x 15 0.3 Hybrid substrate TPG 800 1500 in plane; 20 across thickness Module support rail 200 x 10 Epoxy thermally conductive epoxy all glue joints 50 1.5 Cooling Block Beryllium Oxide 2 x 20 2000 248 Alternate hybrid PC-board Fiberglass & copper 0.62 (fiberglass) 385 (copper) Tracker upgrade workshop June 3, 2009 Susanne Kyre

4 FEA Model Tracker upgrade workshop June 3, 2009 Susanne Kyre

5 Result of steady state thermal analysis with PCB hybrid
Hybrid: fiberglass with two 0.5oz layers of copper (17.7 micron thick) Max temperature: deg C, location: second hybrid at DC-DC Tracker upgrade workshop June 3, 2009 Susanne Kyre

6 Sensor temperature distribution with PCB hybrid
Max sensor temperature: deg C Tracker upgrade workshop June 3, 2009 Susanne Kyre

7 2 Hybrids per Sensor Max temperature: deg C, location: 4th hybrid Max sensor temperature: deg C Tracker upgrade workshop June 3, 2009 Susanne Kyre

8 TPG graphite hybrid Max Temperature: -26.2 deg C
Tracker upgrade workshop June 3, 2009 Susanne Kyre

9 This is a first, very basic thermal model!
Information needed: Geometry Materials Power of components Cooling system, fluid, pipe diameter etc. Tracker upgrade workshop June 3, 2009 Susanne Kyre

10 Pitch Adapter? Can we get away without a PA?
Try wirebonding directly from the chip to the sensor Max. offset between a 50micron pitch chip and a 100 micron pitch sensor: 3.25mm Problem area is the “kink” between the bondfoot (aligned with the bondpad) and the bondwire; expect low pullstrength Could the bondpads be angled to match the angle of the wire? UCSB can do some bonding tests Tracker upgrade workshop June 3, 2009 Susanne Kyre

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