1. Different Types Of Thermal Conductive Sealant

2. Thermal Greases Thermal Greases
Though these are messy thermal interface solution, these have thermal compounds with typical thermal resistance of Kcm^2/W: 0.2 – 1.0.
Thermal Greases

3. With silicone or hydrocarbon greases, loaded with thermally conductive filler materials, this provides low thermal resistance.

4. Thermal Pads
These are used to fill air gaps caused by imperfectly flat or smooth surfaces which should be in thermal contact. These are pre-cured thermally conductive elastomeric pads which are easy to apply.
Thermal Pads

5. Due to their thickness, these are low in thermal resistance of Kcm^2/W: 1.0 – 3.0. Typically require high pressure clamping to achieve reasonable thermal.
Relatively firm at room temperature, it becomes soft to fill gaps at higher temperatures.

6. Phase Change Materials
With thermal resistance of Kcm^2/W: 0.3 – 0.7, these are solid materials that melt between 50-80C.
These are the combination of pad convenience and grease thermal performance. These avails some adhesion and are not rework able like greases and thermal pads.

7. Thermal Tapes
Thermally conductive tapes are similar to thermal pads but provide more substantial adhesion across the interface. Being a Thermal conductive sealant, its thermal resistance is Kcm^2/W: 1.0 – 4.0

8. Gels
With typical thermal resistance of Kcm^2/W: 0.4 – 0.8, these partially cure to reduce mess which is comparable to grease.

9. Thermally Conductive Adhesives
Solder
With traditional heat transfer method, it requires high heat, electrically conductive but these days most other options are electrically insulating. Rework not able and not suitable for large bond areas. These are available with thermal resistance of Kcm^2/W: 0.05
Thermally Conductive Adhesives
Through heat dissipation, thermally conductive adhesives help to protect the electronic circuitry. Thermosetting polymers provide substantial long-term strength across the bond interface, and 2nd to only soldering in ultimate heat transfer capabilities. With typical thermal resistance of Kcm^2/W: 0.15 – 1.0, it requires a robust manufacturing process. The adhesives provide highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices and also, manages heat while solving other application issues.

10. The amount of heat transmission through any combination of materials can be calculated. Technologically advanced formulations designed to meet the performance requirements of many high tech industries includes Telecommunications, Motor control, Aerospace, Military, Medical, Electro-optical, Electronic and Robotic.
You can calculate the exact amount of heat loss while manufacturing the thermal sealant by understanding the technical terms and the factors involved in the process. 

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