1. HB RM prototype component status
Ianos Schmidt
July 6, 2017

2. HB Phase 1 prototype RM mechanics status
HB phase 1 RM prototype pieces (Iowa):
Number per Number status
ITEM: Max Dimensions mm [in.] module total
QIE card cooling plates 142 x 89 x 10 [5.591" x 3.504" x 0.394"] 4 24 Completed
Cardpack end plate 178 x 92 x 10 [7.008" x 3.622" x 0.394"] 1 6 Completed
Cardpack control card cooling plate x 92 x10 [7.008" x 3.622" x 0.394"] 1 6 Completed
Cardpack top plate 142 x 93 x 2 [5.591" x 3.661" x 0.08"] 1 6 Completed
RM bottom plate 288 x 93 x 2 [11.339"x 3.661" x 0.08"] 1 6 Completed
Cold piece, front 70 x 60 x 10.5 [2.756" x 2.362" x 0.413"] 1 6 Completed
Cold piece, back 70 x 60 x 11 [2.756" x 2.362" x .433"] 1 6 Not started
Thermal housing, back 118 x 93? x 56.2 [4.646" x 3.661" x2.213" 1 6 Most complicated part. In progress
DC-DC heatsinks 90 x 42 x 7 [3.543" x 1.654" x .276"] 2 12 In progress
Cover brace 95 x 24.5 x 6.6 [3.74" x 0.965" x .260"] Not started
Total:
Back thermal housing most likely will not have features for clamping/extraction hardware
Hardware in hand
4 Peltiers ordered by Sergey, an additional 4 in hand at Iowa
Thermal pad and spring finger stock in the mail

3. Additional needed items for RM’s:
LV bridge boards (6 DC-DC HE type)
DC-DC converters
MTP-LC Fiber octopuses (Same type as HE RM’s)
MTP-MTP adapter
Peltier power transistors
JTAG daisy chain adapters (Same type as HE RM’s)
JTAG jumper cables. Looks like HE ones will be too short. Can live without for the short term
QIE boards
Control and control mezzanine boards
SiPM mounting boards
Flex cables (signal and control types)
ODU sub-assemblies (cookie, patch panel, pp-adapters, front thermal housing, side wall, and bulkhead wall)
Stepped alignment pins to allow opposite polarity SiPM’s
Mixers, thin and thick.
RM/ODU cover (sheet metal): Notre Dame did not want to make this item.
Looking into doing it at Iowa.
Looking into alternative design.
Fermilab or spares from HE?
Fermilab
Notre Dame ?