1. Lab3: GaAs Process And Devices
Day 1
30um
10um
60um
45um
40um
50um
130um
Lab3: GaAs Process And Devices

2. Theme Day 1- Background Preparation
Maxwell Equations-Physical Interpretation & Application
Interconnects- Design, Mismatch, & Insertion Losses
GaAs Process- Pseudomorphic HEMTs, Inductors & MIM Capacitors
Process Introduction
Day 2- Power Amplifier, MMIC Design Example
DC Characterization- Biasing Decoupling, Biasing Techniques, Thermal Stability
Small Signal Characterization- Matching & Stability
Large Signal Characterization- Single Tone Analysis, Matching across Power
Load Pull
Day 3- Design Refining, Layout & Design Post Processing
Modulated Signal- QAM16 Input, Ptolemy & Circuit Co-simulations
Linearity- Two Tone Analysis, IP3, ACPR, & EVM
On-chip Power Combiners & Dividers
Layout & Tiling

3. Direct Vs Indirect Semiconductor
Examples: GaAs, InGaAs, AlGaAs, InP
Energy Band Vs Wave Number for Indirect Bandgap Semiconductor Material
Energy Band Vs Wave Number for Direct Bandgap Semiconductor Material
Examples: Si, SiGe, Ge

4. Velocity Overshoot
Velocity Overshoot due to Reduced Carrier-Carrier Interaction

5. Strained Semiconductor

6. Quantum Well at Hetero-junction
P-type
N-type
Unbiased PN-junction
Critically biased PN-junction
Quantum Well

7. Typical PHEMT Device Structure
GaAs
InGaAs
AlGaAs
Ohmic metal (CO)
T-shaped Al Gate
Silicon Nitride Passivation
TiPtAu (N1 Metal)
Silicon Nitride Dielectric
Gold Plated Metal (EL)

8. UMS PHEMT Device Models in ADS
ADS Setup to Simulate DC Characteristics of PHEMT Device

9. Small Signal Characteristics of PHEMT Device

10. Process Details for EM Simulations

11. Substrate Definition for UMS Dual Metal Process

12. On-Chip Spiral Inductors
30um
10um
60um
45um
40um
50um
130um

13. SPICE Model for On-Chip Inductors

14. On-Chip MIM Capacitor

15. SPICE Model for On-Chip Capacitors

16. Lab3: GaAs Process And Devices
Start Lab Exercise!