1. Process map NVA VA VA VA VA NVA VA NVA NVA NVA NVA NVA VA NVA NVA NVAf
Transportation
DPU
Cycle Time
Paste Printing
Component Placement
Checking
Reflow Soldering
Visual inspection
Repairing
Cutting
Testing 1
Testing 2
Testing 3 p
p: passed the test
f: failed the test
NVA VA VA VA VA
NVA VA
NVA
NVA
NVA
NVA
NVA VA
NVA
NVA
NVA

2. Details of process map (I.)
Xs:
C Conveyor Speed
C Conveyor Width
C Conveyor Height
S PCB Side (0-1-2)
N Operator
S PCB Size
Ys:
PCB loading
PCB Jamming
PCB Fall Down
PCB Break
Transportation
Cycle Time
DPU

3. Details of process map (II.)
C F Force
C F Balance
C F Speed
C R Force
C R Balance
C R Speed
C Detent
C Snap Off
C Knead On
C Kn. Frequency
C Wiper On
C Wip. Frequency
C In Speed
C Solvent
C Solv. Frequency
C Wipe After Knead
C Vacuum
C Vac. Frequency
C Vac. Speed
C FP Mode
C Stretch On
C Max X
C Max Y
C Snuggers
C Print Vac.
C Slow Snap
C Distance
C Slow Snap Speed
C Review Errors
C Inspect 2D
S Squeegee Shape
C Sque. Angle
S Sque. Matter
C Sque. Pressure
C Paste Temperature
N P. Evaporation
N P. Contamination
N Flux Activity
N P. Viscosity
S Utilization Time
C P. Storage State
C P. Homogeneity
N PCB Cleanness
N PCB Dimension
N Cleaning Material
C Paste type
N Operator
C Stencil thickness
Ys:
Paste Amount (Height)
Paste Sag
Covering
Alignment
Printing “Cleanness”
Paste Printing
Cycle time
DPU
Xs:

4. Details of process map (III.)
Xs:
C Head Speed
C Table Speed
C Setting of Component Recognize
C Lighting
C Vacuum
N PCB Marking Sign
C Paste
N Operator
N Component Dimension
C Component Value
N Component Shape
N Component Legs
N Component Polarity
N Component Side
Component Placement
Cycle Time
DPU
Ys:
Component Alignment
Mounted Components
Damaged PCB
Component Mech. Damage
Missing Component
Part on Backside
Wrong Value
Component Shift
Damaged Component
Wrong Polarity
Twisted Placement
Pin Bent
C Pick Up Height
C Placement Height
C Mounting Tool
C Maintenance
C Feeder conditions
C Nozzle conditions

5. Details of process map (IV.)
Xs:
C Zone temperatures
C Conveyor Speed
C Conveyor Location
C Cooling
C Wet
C Printed & Mounted PCB
N Operator
C Paste type
Reflow Soldering
Cycle Time
DPU
Ys:
Cold Soldering
Solder Bridge
Solder Balls
Pin in Air
PCB Fall Down
Component Overheated
Missing Soldering
Component Damage
Bad Wetting
Missing Component
Excess Solder
Hole In Soldering
Tombstoning
Flux Residue
Component Shift

6. Details of process map (V.)
Xs:
S Mounted, Soldered Boards
S Magnifying
S Microscope
N Operator
Ys:
Cold Soldering
Solder Bridge
Solder Balls
Pin in Air
Dirty PCB
Wrong Label
PCB Damage
Missing Soldering
Component Damage
Bad Wetting
Missing Component
Wrong Component
Excess Solder
Hole In Soldering
Tombstoning
Flux Residue
Component Shift
Missing Label
Visual Inspection
Cycle Time
DPU

7. Details of process map (VI.)
Xs:
S Mounted, Soldered Boards
N Operator
C Soldering Bit
S Failure Mode
S Tin, Flux
C Components
Ys:
Cold Soldering
Solder Bridge
Solder Balls
Pin in Air
Dirty PCB
Wrong Label
PCB Damage
Missing Soldering
Component Damage
Bad Wetting
Missing Component
Wrong Component
Excess Solder
Hole In Soldering
Solder Flag
Flux Residue
Component Shift
Missing Label
Wrong Polarity
Repairing
Cycle Time
DPU

8. Pareto analysis for SMT failures

9. Pareto chart for SMT failures of D200