1. Using a laser to place known good die at 100 million units/hour
massively-parallel laser die placement
Using a laser to place known good die at 100 million units/hour
July 2017

2. Emerging Electronics Require New Manufacturing Capabilities
Thinner/Flexible
Faster/Cheaper
Internet-of-Things
Wearable Electronics
LED Lighting
Displays
Structural Electronics

3. Today’s Placement Technology is Unusable for Tomorrow’s Products
Emerging Display/Lighting Products Require Placement of Millions of LEDs
With today’s placement technology:
Manufacture time for one unit: months
Minimum LED size: 300 µm (10-50X larger than required)

4. Laser-Enabled Massively Parallel Transfer
Ultra-fast placement (>100 million units/hour)
Known good die selectivity
Wide range of component types and sizes
Large or small display formats

5. Actuation Mechanism: Thermo-Mechanical Laser Transfer
Diced wafer attached to transparent carrier
Laser focused at selected die
Dynamic release layer blisters -> detaches die from carrier -> directs it to substrate
laser pulse
transparent carrier
dynamic release layer
die
10 – 100 µm
substrate
3D confocal image of DRL blisters (blister side up)
DRL blister (post-die release)

6. Laser Actuation Enables Ultra-High Placement Rates
Laser blistering mechanism: 50 µs Places dies >1000x faster than mechanical means
Beam scanning: 8 m/s Places dies in rapid succession
Beam splitting Places multiple dies in parallel

7. Single- and Multi-Beam Modes Used for Known-Good-Die Placement
1. Bad Die Removal single-beam mode
2. Good Die Placement multi-beam mode
3. Fill-In single-beam mode
transfer field
bad dies
Wafer
placed dies
fully- populated substrate
Substrate
(none)
missing dies

8. Modeled Placement Rates
wafer movement
wafer replacement
beam scanning
bad die removal & replacement
today’s pick-and-place rates: – 0.05 M/hr
5.5 Inches
70 Inches
1080p 4K

9. Multi-beam Arrays Most Effective at High Wafer Yields
today’s pick-and-place assembly times: 20 – 100 days
4K Resolution, 70 Inches
4K Resolution, 5.5 Inches

10. Simultaneous 5x5 Array Transfers Demonstrated
view from above looking through glass carrier
5x5 array transfer video
glass carrier
untransferred dies on carrier underside
locations of previously transferred dies
5x5 array to be transferred
die size: 45x45 µm
Mechanical stepper being replaced by electronic scanner 4Q17

11. Uniqarta, Inc. Founded 2013 Cambridge, MA and Fargo, ND
Ultra-thin chip assembly
Founded 2013
Cambridge, MA and Fargo, ND
Six employees (3 PhD’s)
Funded by individual investors and government grants
flexible display driver
Ultra-fast chip assembly
Laser Enabled Advanced Packaging (LEAP)