1. Overview of New Packages, Materials & Processes
Ken Gilleo
ET-Trends
© ET-Trends LLC

2. AGENDA Telecom Overview; Internet & wireless MEMS and MOEMS basics
MEMS and optical packages
Packages; micro, performance
Emerging packaging materials
Conclusions
© ET-Trends LLC

3. Communications Milestones
<1900: telephone, telegraph, simple wireless
1940’s: military boosts technology
1950’s: solid state paradigm shift
1960’s: Telstar, satellite global links
1970’s: cellular phone, fiber optics
1980’s: technology enables portability
1990’s: photonic, new wireless, convergence
200X: World Wide Hub - Telecom Revolution
© ET-Trends LLC

4. Last 50 Years Radio improves Solid State invented/implemented
Fiber optics made practical
Cellular advances
INTERNET – a major event!
© ET-Trends LLC

5. Tomorrow’s Telecom Cellular proliferates and morphs!
Internet becomes the World Wide Hub
Everything becomes portable, even wearable
Every person and business wants connectivity
All of this drives innovation:
Devices
Packaging
Circuitry
Assembly
© ET-Trends LLC

6. RF Wireless; Bluetooth, etc Long-Haul Fiber Backbone
Net Centric
Satellite RF
RF Wireless; Bluetooth, etc
Submarine
Fiber Link
amplifiers
Free Space Photonics
Long-Haul Fiber Backbone
Metro Ring
Loop Access
Regional Ring
gilleo
Submarine
Fiber Link
© ET-Trends LLC
World Wide Hub

7. Exponential Bandwidth but why & how?
Terebits
Internet
Goal: Unlimited Bandwidth?
YEAR
Source: RHK and others
© ET-Trends LLC

8. Communications Links Internet Terrestrial (and submarine)
Electronics
Copper wire
Computer-based Routers
Photonics (channeled)
Fiberoptics used extensively for backbone links
High tech multiplexing is evolving quickly
Wireless - Free-Space
Bluetooth - short range
Cellular (newest have IP)
Satellite; new services
Fiberless Optics - short and medium-range links
© ET-Trends LLC

9. Electromagnetic Spectrum
Not to precise scale
Megahertz (103 Hz)
1016
1014
1012
1010
108
106
104
102
100
1011
103
Today’s Photonics wavelengths
Bluetooth
Visible
UHF
microwave FM UV IR
RADIO
Cosmic
Rays
Gamma
Rays
X-rays
Rays
More Bandwidth
© ET-Trends LLC

10. Conductors Electronics Photonics Optical Fiber - - - - - Single-mode
Copper
Optical
Fiber
Skin Effect: Electrons travel closer to surface as frequency increases; can radiate as RF
8.6 – 9.5 mm
Cladding
125 mm - - - - -
Single-mode
Fiber - - - - -
© ET-Trends LLC

11. Basic Telecom Photonics
Convert e- data or voice to modulated light
Transmit through optical fiber
Convert to electronic
Direct signals using routers
Convert back to photonic
© ET-Trends LLC

12. How do we get more bandwidth?
Increase data rate.
Add more fibers.
Multiplex the signals (colors).
All are being done, but number 3 can give a plus-10,000% bandwidth boost without adding fiber.
DWDM =
Dense Wave
Division Multiplexing
© ET-Trends LLC

13. Optical Backbone WDM = Wave Division Multiplexing Switch- Router DMUX
Long-Haul
Optical Fiber
WDM = Wave Division Multiplexing
ONE FIBER
A single fiber can transmit 100’s of colors and each acts as a separate high-speed channel
Many colors.
Multiplexing mimics multiple fibers
Optical Backbone
Switch-
Router
DMUX
MUX
Multiplexer Combines
individual signals.
Demultiplexer
(separates into
individual signals.
© ET-Trends LLC

14. Today’s Interconversion
photons
O-O
MEMS
switches
Detectors, sensors
Sources; Lasers
O-E-O switches
electronics
© ET-Trends LLC

15. The Switch Glitch Internet Back-Bone uses photons
Switching is double conversion
Need to all-optical switching, but how?
Can we use optical MEMS?
What’s optical MEMS (MOEMS). e l
Switch l
Switch
© ET-Trends LLC

16. Enter the MEMS World Optics Where all technologies converge
The convergence point of electronics, mechanics, physics, chemistry and biology, etc.
Electronics
Mechanics
MEMS
MOEMS OE OM
Optics
Where all technologies converge
© ET-Trends LLC

17. Micro-Opto-Electro-Mechanical System
MEMS/ (MOEMS)
Micro-Opto-Electro-Mechanical System
Semiconductor processes are used.
Merges mechanical motion, light & electronics
High Versatility
sensing
computing
motion
Control including light
© ET-Trends LLC

18. MEMS Structures
IBM MEMS DNA Detector
© ET-Trends LLC

19. MEMS “Engines” Electrostatic; very efficient*
Thermal; easy to implement
Electromagnetic
Pneumatic
Hydraulic
Photoelectric
*Surface area is relatively high, mass is very low; surface effects are important
© ET-Trends LLC

20. MEMS Concerns Some devices are fragile Most are shock-sensitive
Most devices can stick; “stiction”
New packages are needed
Special assembly for some
Optics adds assembly complexity
Stuck
© ET-Trends LLC

21. (air bag sensor example)
Stiction Problem
(air bag sensor example)
Stuck
Analog Devices Chip
Sensing Mechanism (Analog Devices)
High surface area = high attraction =
“STICTION”
Result of rough
handling = “dead” component
© ET-Trends LLC

22. “New” Packaging Materials
Getters
Moisture
Particle
Active gas
Coatings
Vapors
Parylene; fluorintated; Nova NT
© ET-Trends LLC

23. Traditional Packaging
Few Standards
High Cost!
© ET-Trends LLC

24. Cronos (JDS-Uniphase)
Optical MEMS or
MOEMS
Fiber Alignor
Cronos (JDS-Uniphase)
Micro-Mirror
Lenses Array
Rotating Mirror-UCLA
Pop-Up Lens
© ET-Trends LLC
Micro-Mirror Array - TI
Shutter - Sandia
Cross-switch mirror

25. TI MOEMS: Micro-Mirrorson
off on
World’s most complex machine! on on on
off on
© ET-Trends LLC
Ref. “Digital Light Processing TM for High-Brightness, High-Resolution Applications” Larry J. Hornbeck, Ti.com

26. Other Optical Switches
4 x 4 switch
Other Optical Switches l1
Binary Mirror; on/off
2-Axis Mirror 3D, point anywhere
MARS Mech. Anti-Reflective Switch (Lucent)
Bubble (Agilent)
Optical Transistor ???
WaveStar Lucent
Agilent patent drawing
© ET-Trends LLC

27. MEOMS Packaging Types Traditional hermetic; metal or ceramic
New Cap-on-Chip
wafer-level
device-level
Near- and non-hermetic
Selective packaging for accessibility
© ET-Trends LLC

28. TI’s MOEMS Package WINDOW HEAT SINK HERMETIC Getter Weld or seal
Ceramic
HEAT SINK
HERMETIC
250,000 mirrors
MEMS Digital Mirrors
one section
© ET-Trends LLC

29. New Cap-on-Chip Overmolding
MEMS Chip
Cap
Vacuum
Seal
1. Apply cap to device or wafer;
solder, weld, bond.
2. Attach & bond device
3. Conventional overmolding followed by solder ball attach.
© ET-Trends LLC

30. MOEMS Window Cap Optical Encapsulant Transparent Cap MOEMS AMKOR’s
Vision Pack?
© ET-Trends LLC

31. Other Optical Packages Intrasia Glass Substrate
Wafer Level Packaging:
Intrasia Glass Substrate
A Cavity Type CSP
Glass
MOEMS
ShellCase
© ET-Trends LLC

32. Advanced Packaging Trends
10 December 1996
Time
TO Can
DIP
Density/efficiency
PQFP FC
BGA
Notes:
CSP
Electronic Packages
© ET-Trends LLC
Some drawings from Joe Fjelstad 3 3

33. Packaging Change Drivers
Miniaturization
Area
Height
Weight
Performance
High lead count
High frequency; processors, RF
MEMS/MOEMS; a new technology cluster
Reduction
Boost
© ET-Trends LLC

34. Advanced Packaging Types
Advanced BGAs
Flex-Based
MultiChip
Array Molded
CSP
Wafer-Level CSP and FC
© ET-Trends LLC

35. Packaging Miniaturization
Flip Chip
FCOB (on board)
FCIP (in package)
CSP
MultiChip Package
Single plane
Stacked
© ET-Trends LLC

36. Chip Scale Packaging Flex-based doing well Wafer-level; strong trend
Area molding reduces cost
© ET-Trends LLC

37. CSPs © ET-Trends LLC µBGA is a registered trademark of Tessera, Inc.
Shellcase NS
µBGA is a registered trademark of Tessera, Inc.
© ET-Trends LLC

38. Flip Chip BGA
© ET-Trends LLC

39. Flip Chip Trends About 80% is FCIP
Virtually all high I/O chips are FCIP
New underfills
Molded (FCIP)
No Flow (FCOB)
Cost reduction continues
Bumping
Integral underfill
US 6,194,788
Issues Feb. 27, 2001
© ET-Trends LLC

40. Flex-BGA TapeArray™ BGA Singulated edge Mold Compound Die Attach
Polyimide Tape
Wire Bond
TapeArray™ BGA
Singulated edge
© ET-Trends LLC

41. MultiChip Packages Single-Plane Stacked © ET-Trends LLC
Drawings from Pacific Consultants, LLC

42. Molded in strip format
© ET-Trends LLC

43. Wafer Scale CSP & FC Lower Cost CSP All processing on the wafer
Fan-in structure
Wafer Level Packaging:
Shellcase
© ET-Trends LLC

44. Bluetooth Short-range inter-device wireless
Shared frequency; GHz (ISM) band
Uses ceramic CBGA module
Clean room assembly?
Tighter board & assembly tolerances
When will Bluetooth really take off?
© ET-Trends LLC

45. Modern Wireless
© ET-Trends LLC

46. Conclusions Telecom is driving packaging & assembly
Performance drives up density
Packages getting smaller; 202s, FC, CSP
New telecom packages
New packaging materials
Biggest are still opportunities ahead
© ET-Trends LLC