1. Module building: plans & inventory
Admittedly not much progress the last fortnight. Grand plans nonetheless:
Assemble first glass module very soon
Populate remaining hybrids on panel with blank glass ASICs
Exercise wirebonding on Liverpool training module
Item
Count
Remarks
glass populated hybrids 3
1x60µ, 2x80µ glue heights
unpopulated hybrids 4
Note: 1 reject on panel
dummy ASIC/mech sensor module 1
brown TM hybrids. not wirebonded
blank glass ASICs 58
glass sensors 5
ATLAS12 mechanicals
2+49
ATLAS12 sensors 95
4 rejects
tra-duct bipak
23+7
UBD Feb 2014, 9/2/2015
epolite 12
unknown UBD
18/6/2015
Bart Hommels - University of Cambridge

2. Hybrid 4 panel 1: metrology
Despite the £££ CMM, micrometer probably is the most accurate & reliable
Reconstructed touchprobe heights overestimate glue layer thickness by 10µm
Camera grabs through glass agree best with micrometer
however this method cannot be used with real ASICs
Lack of large gold surfaces outside ASICs make double touch method unreliable: touchdown on solder resist etc. etc.
Unsurprisingly, the glue dot expansion ratio measurement is not reliable
18/6/2015
Bart Hommels - University of Cambridge