1. Solder Paste Task Group (5-24b) APEX 2016 March 16, Karen Tellefsen, Alpha, Chair Bev Christian, Blackberry, Vice Chair

2. Solder Paste Task Group (5-24b)
This task group is responsible for J-STD-005A, Requirements for Soldering Pastes.  The TG is presently reviewing test methods used by J-STD-005A, including R&R evaluation.
Introductions a. Chair : Karen Tellefsen, Alpha b. Vice-Chair : Beverly Christian, Blackberry
c. Attendees
Housekeeping -- Copies of these documents are available for those unfamiliar with them.
Antitrust Statement
Principles of Standardization
IPC’s ANSI Patent Policy
Apex 2016 Workshop

3. IPC Anti Trust Statement
No commercial topics should be acted upon or even considered at an IPC meeting
Should not discuss
Price or any element of price or pricing policies
Sales or production quotas, territories , allocations, boycotts or market shares
Identified company statistics, inventories or merchandising methods
Particular competitors or customers
Commercial liabilities, warranties, guarantees, or particular terms or conditions of sales, including credit, shipping and transportation arrangements.
Anything dealing with arm-twisting, trade abuses or excluding/controlling competition

4. Principles of Standardization
Standards Should
Show relationship to DfM & DfE
Minimize time to market
Contain simple (simplified) language
Just include spec information
Focus on end product performance
Include a feed back system on use and problems in future development
Standards Should Not
Inhibit innovation
Increase time-to-market
Keep people out
Increase cycle time
Tell you how to make something
Contain anything that cannot be defended with data

5. IPC’s ANSI Patent Policy
Notice - When IPC receives from a patent holder the assurance set forth in and the standard shall include a note as follows:
Note: The user's attention is called to the possibility that compliance with this standard may require use of an invention covered by patent rights. By publication of this standard, no position is taken with respect to the validity of this claim or of any patent rights in connection therewith. The patent holder has, however, filed a statement of willingness to grant a license under these rights on reasonable and nondiscriminatory terms and conditions to applicants desiring to obtain such a license. Details may be obtained from the standards developer.
Responsibility for Identifying Patents
IPC shall not be responsible for identifying all patents for which a license may be required by IPC Standards or for conducting

6. Agenda
Minutes of SMTAI meeting, four general 5-24A and three PP Rheology TM web meetings are available in KAVI. Do attendees wish to review them?
History of existing test method revisions to date.
TM status. All Working Drafts are in KAVI.
Overview of changes.
Powder size discrepancy between J-STD-005 and TM as discovered by Stefan Moser/Bosch.
Ingo Lomp / Balverzinn TM slight dewetting at edge of printed circle with L0 paste.
Review of new TM:
Parallel plate rheology measurements
New business
Apex 2016 Workshop

7. TM Revision – Powder size
All TM’s have draft revisions available in KAVI
Powder Size:
RR testing was done for powder size, we need to find the data.
If we can’t find the data, we will need to repeat this.
Apex 2016 Workshop

8. Powder size table
Powder size discrepancy between J-STD-005 and TM (1995) as discovered by Stefan Moser/Bosch.
From the March 2014 draft of A
Apex 2016 Workshop

9. TM Revision 2.2.20A -- Solder Paste Metal Content by Weight
Working draft revised May 2014
Very simple test, do we need RR test? Take vote.
– Solder Paste – Slump
A RR test was done before 2013, BUT
Kyle Loomis / Kester found IPC’s gerber files did not correspond to the tables given in the test method. The gerber files have been revised to match the tables.
There is a working draft revised June 2015
It’s too long in my opinion.
I need to rewrite this method with Kyle.
Do we need another RR test? Take vote.
Solder Paste—Solder Ball Test
Working draft revised May 2015, lots of pictures!
We need another RR test.
Apex 2016 Workshop

10. TM Revision 2.4.44A – Solder Paste – Tack
Working Draft July 2014
Discussed tack on substrates other than glass slides
Brook Sandy-Smith may have data
We need RR test.
2.4.45A – Solder Paste – Wetting
Working Draft October 2014
Cleaning procedure submitted by Cynthia Gomez / Continental
Ingo Lomp / Balverzinn thinks that most L0 pastes don’t meet the requirement of wetting out to the edge of the print, and he’d like a slightly softer requirement. See following slide.
What does the task group think?
Apex 2016 Workshop

11. Apex 2016 Workshop

12. TM Revision – Viscosity
2.4.34A – Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipoise)
Working draft January 2016
Need RR testing? Ask group.
– Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 centipoise)
Need RR testing? Ask group.
– Solder Paste Viscosity—Spiral Pump Method (Applicable for 50,000 to 1,600,000 centipoise)
Combined with
Need RR testing
Apex 2016 Workshop

13. RR testing is a pain in the neck.
RR testing of TM’s
RR testing is a pain in the neck.
Have a test plan for three TM’s:
Wetting test (TM A)
Solder Ball Test (TM )
Tack Test. (TM A)
Should we revise this to include:
Slump? Group vote.
Viscosity? Group vote.
Where is the powder data?
Apex 2016 Workshop

14. Parallel Plate Rheometer
NEW TM:
Parallel plate rheology measurements
Merged Alpha and Inventech internal methods.
Final draft March 2016.
If time permits, the group will quickly review the document at this meeting.
Apex 2016 Workshop

15. Solder Paste Task Group (5-24b)
New Business?
Next web meeting:
Early April???
Next Face to Face
SMTAI Rosemont IL,
Wednesday September 28th 8-10 am
Apex 2016 Workshop