1. LOI Backup Document: R&D
Feb Stave Mtg 2012

2. Topics
Overview of systems needs for R&D: The R&D needed for the tracker falls into a number of broad categories, detailed below.
Mechanical: The basic element of the tracker is a stave, built up from a thermo-mechanical stave core. The stave core is composed of various carbon based materials, adhesives, and cooling structures. These materials and their fabrication and assembly is an R&D topic. The staves are mounted on light carbon fiber barrels, also a topic of R&D.
Sensors: This covers the design of prototyping of silicon strip sensors.
Cooling: This covers the basic cooling system, cooling plant, and requirement.
Electrical: This covers the FEE, hybrids, modules, and data transmission within the stave.
Powering: This covers the alternative powering schemes, serial and DC-DC, and their control, monitoring, and power protection aspects. This also covers the HV distribution and monitoring within the stave.
Services: This covers all the off-stave services, in particular optical vs copper, cable plant and cable use/re-use scenarios, and coolant distribution.
Assembly: This covers the processes for manufacturing during production including hybrids, modules, cores, flex, staves, and module mounting.
Alignment: This covers mechanical alignment and monitoring with is not part of the assembly process.
Trigger: This covers the application of the stave tracker to a Level 1 track trigger.

3. Ongoing Status Reports
Stave Core Fabrication: Tim Jones and David Lynn
Petal Core Fabrication: Carlos Lacasta
Mechanical Bus Co-Cure: Georg Viehhauser and Carl Haber
Supermodule Mechanics: Frank Cadoux DECLINED
P-type Sensor Development: Nobu Unno, Hartmut Sadrozinski
Cooling Studies: Georg Viehhauser
Development of the ABC-next 130 nm Chip: Francis Anghinolfi
Development of the Hybrid Controller Chip: Mitch Newcomer DONE
Development of the SPP Serial Powering Chip: Mitch Newcomer
Development of the DC-DC Conversion ASIC and PCB Package: Georges Blanchot
Hybrid: Ashley Greenall
Module: Tony Affolder
Stavelet Test Program: Peter Phillips
Petal Electrical Program: Ingrid Gregor
Supermodule Electrical Test Program: Didier Ferrere DECLINED
Digital Data Transmission on the Stave and the BCC Chip: Carl Haber DONE
Power Protection and Serial Powering: David Lynn and Mitch Newcomer DONE
Cabling and Services Survey and Analysis: Sergio Diez Cornell
Hybrid Assembly Process: Ashley Greenall
Module Assembly Process: Tony Affolder
Stave Mounting Process: Martin Gibson DONE
Low Mass Tape Development: Tony Weidberg DONE
HSIO Data Acquisition System: David Nelson and Carl Haber
Alignment R&D: Richard Nickerson
Level-1 Track Trigger R&D ROI based: NEED Author
Level-1 Track Trigger R&D Self Seeded: Maurice Garcia-Sciveres

4. Pending R&D Needs HV Multiplexing: David Lynn DONE
Additional Cabling Studies: Sergio Diez-Cornell
Optical Data Transmission to the Stave: Tony Weidberg
The Petlet Program: Ingrid Gregor
Application of the RCE system to stave DAQ Su Dong