1. Electronic Assembly Quality and Standards

2. Simplified Comparison of Thru Hole and SMT PCB Assembly Process
Component
Procure
Setup
Substrate
(Fab)
Fabrication
Fab, Comp
Prep
Bake, Clean
Simplified Comparison of Thru Hole and SMT PCB Assembly Process
Thru Hole
Mechanical
Hand
Operations
SMT
Auto
Component
Insertion
Screen
Solder Paste
Wave Solder
Auto
Component
Placement
Vision System Inspection
Lead
Trim
Reflow
Solder
(Oven)
Stresses and Test Processes
Vision/Xray System Inspection

3. Typical SMT Complex Circuit Board Assembly Processes
Setup
Screen Print
SMT Placement
Reflow
Hand Assembly
Wave Solder
Final Assembly
Wash
In Circuit Test
Stress Screen
Functional Test
Pack / Ship
Typical SMT Complex Circuit Board Assembly Processes

4. Solder Geometry Variability in SMT and THT

5. IPC = Institute of Printed Circuits, WWW. IPC
IPC = Institute of Printed Circuits, Association Connecting Electronics Industries
IPC-A-610 Acceptability of Electronic Assemblies
IPC-6011 Series of Board PCB Performance Standards
IPC/EIA J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
IPC-7095 Design and Assembly Process Implementation for BGAs
IPC-2221 Generic Std for Printed Board Design
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
Quality!

6. IPC Electronic Assembly Classifications
High Reliability Electronic Products:
Continued performance, performance on demand, and extended life is critical and equipment downtime cannot be tolerated. Equipment must function when required with a high level of reliability assurance.
End-use environment is harsh
Includes equipment for commercial, military products, and for such applications as life support or missile systems.
Dedicated Service Electronic Products:
Continued performance, extended life and uninterrupted service is desired but not critical.
Typically the end-use environment would not cause failures
Includes communications equipment, sophisticated business machines, instruments and military equipment
General Electronic Products:
Function of the completed assembly is the major requirement
Cosmetic imperfections are not important
Includes consumer, some computer, peripherals, general military HW
Aerospace, Military
10 Yr Stresses
# of Bds, # of solder joints
# of Mechanical Cycles
4# of Power Cycles
# of Therm Cycles, Excursion
PROCESS CONTROL – PROCESS QUALITY
Ref: IPC-A-610, IPC-JSTD-001, IPC-7095
Telecom & Certain Medical