1. Date of download: 1/1/2018
Copyright © ASME. All rights reserved.
From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
J. Electron. Packag. 2008;130(1): doi: /
Figure Legend:
The dimension and schematic of a chip model on WLCSP

2. Date of download: 1/1/2018
Copyright © ASME. All rights reserved.
From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
J. Electron. Packag. 2008;130(1): doi: /
Figure Legend:
Analytic setting of 16 different temperature cyclic loadings for the L16-orthogonal arrays

3. Date of download: 1/1/2018
Copyright © ASME. All rights reserved.
From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
J. Electron. Packag. 2008;130(1): doi: /
Figure Legend:
Temperature cyclic loading for the verification of models

4. Date of download: 1/1/2018
Copyright © ASME. All rights reserved.
From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
J. Electron. Packag. 2008;130(1): doi: /
Figure Legend:
Elapsed CPU time and shear creep strain range of various simplified models

5. Date of download: 1/1/2018
Copyright © ASME. All rights reserved.
From: The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
J. Electron. Packag. 2008;130(1): doi: /
Figure Legend:
S∕N response chart for five factors in the creep, plastic, and plastic-creep analyses, respectively