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Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1): doi: / Figure Legend: Schematic of liquefier used for FDM
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Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1): doi: / Figure Legend: Execution of main ACL commands
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Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1): doi: / Figure Legend: Two-dimensional deposition (a) fused deposition of non-eutectic Sn–Bi solder lines, (b) design of circuit pattern, (c) fused deposition of non-eutectic Sn–Bi circuit pattern, (d) pattern built using eutectic Sn–Bi, and (e) pattern built using non-eutectic Sn–Bi
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Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1): doi: / Figure Legend: Multilayer deposition of Sn–Bi (a) multilayer line and (b) 360× optical image of stacked layers that were polished and etched (interface is highlighted with arrows)
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Date of download: 1/2/2018 Copyright © ASME. All rights reserved. From: Development of a Fused Deposition Modeling System for Low Melting Temperature Metal Alloys J. Electron. Packag. 2013;135(1): doi: / Figure Legend: Deposition of Sn–Bi via FDMm into 3D vias
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