1. LHCb Upgrade Chris Parkes Stefano de Capua May 17, 2013

2. Pixel Prototype
Make a mechanical prototype of a pixel module0 for testing mechanical stability/stiffness + cooling properties with a dummy sensor, dummy chips and a resistor.
May 17, 2013
Stefano de Capua

3. silicon/silicon bonding
Components
The substrate is made of carbon foam encapsulated in carbon fibre.
200 mm thick silicon for both the sensor and the chips.
Kapton/Copper heaters from Tony.
Carbon foam (allcomp)
5 mm
Tc = 70 Wm-1K-1 (isotropic)
Carbon Fiber
150 mm
Tc = (297, 140, 1.29) Wm-1K-1
Silicon sensors
44.0 x 14.6 x 0.2 mm3
Silicon chips
16.1 x 14.1 x 0.2 mm3
Epolite FH-5313 Epoxy
silicon/silicon bonding
Tc = 0.28 Wm-1K-1
DowCorning SE4445 CV
silicon/CF bonding
Tc = 1.34 Wm-1K-1
Hysol EA9396
C fibre/foam bonding
Tc = 0.21 Wm-1K-1
Epoxy
glue for PT sensors
Tc = 0.84 Wm-1K-1
25 chips (1x)
May 17, 2013
Stefano de Capua

4. Scheme sensor epolite fh5313 heater epolite fh5313 chip chip chip
dowcorning se4445
carbon fibre
hysol ea9396
carbon foam
hysol ea9396
carbon fibre
May 17, 2013
Stefano de Capua

5. May 17, 2013
Stefano de Capua

6. FPGA Processing
Simon is working on data processing for pixel sensors in FPGAs
Work completed so far – compile EPFL prototype and show fits in proposed FPGA
Next steps: develop API, implements time-descrambling of packets
Partner on VELO algorithms is AGH-Krakow
May 17, 2013
Stefano de Capua

7. FPGA Processing
Simon is working on data processing for pixel sensors in FPGAs
Work completed so far – compile EPFL prototype and show fits in proposed FPGA
Next steps: develop API, implements time-descrambling of packets
Partner on VELO algorithms is AGH-Krakow
May 17, 2013
Stefano de Capua

8. Software
Tom Bird (student) has optimised pixel layout