1. Electronics requirements for special diagnostics for the XFEL
A. Winter, for the FLASH/XFEL optical synchronization team

2. Overview Layout of the optical synchronization system
Electronics requirements
“Wishlist”
Conclusion and Outlook

3. Synchronization system – FLASH –
Laser building
EO, HHG and ORS
Photocathode Laser
L2L
Seed
L2L
THz
Laser
ACC 1
BC2
CDR
ACC 23
BC3
ACC 456
L2L
ISR
Undulators
ORS
TEO
Diag.
BPM
RF gun
L2RF
DWC
BPM
CDR
LOLA
Diag.
ISR
BAM
L2RF
DWC
BAM
BAM
BAM
PP-laser
BAM
L2L
BAM
Beam arrival monitor
Laser to laser synchronization
Direct laser seeding
High precision down converter
Laser to RF conversion MO
Opt-Cross..
L2L
MLO
Seed
Distribution
L2RF
DWC
one central area with MLO and Link stabilization
End points all along the machine (more in injector/booster and in experimental area)
For XFEL assume ~ 20 fiber optic links

4. ADC Slow medium Fast Bandwidth ~ kHz ~20 MHz ~ 1000 MHz Sampling rate
# channels 16 8 4
Resolution/effective
> 16 bit
16/14 bit
14/12 bit ideal
12/10 bit now
Data transfer
n/a
Fast FPGA, RocketIO
Latency
~ 200 ns
Temperature monitoring;
Voltage monitoring
Laser Amplitude monitoring,
BAM; EBPM; fast feedbacks

5. Regulation Board Regulation Bandwidth ~ 500 kHz
Sampling rate of ADC/DAC
~ 50 MHz
# channels
4 ADC/2 DAC or 8 ADC/4 DAC
Resolution
16 bit
DSP/FPGA
Fast enough to support 4 Controllers simultaneously
Appropriate memory
Link stabilization, laser stabilization, optical cross correlator,

6. Laser Diode driver boards
Essential for the optical synchronization system: 1 channel with current driver and Peltier driver for each Amplifier/Laser
4 channel VME carrier
Mezzanine cards with commercial driver modules
Small FPGA for controlling and communication
Developed together with FE
~ 1 FTE

7. Other modules DAC Timing/delay boards Vector modulator
1.3 GHz and 200 MHz
DAC
kHz and MHz versions
Timing/delay boards

8. Wishlist Carrier-mezzanine architecture for ADC/DAC
carrier should be stand-alone capable (Ethernet interface)
Low noise power supplies, good EMI design
Common carrier, so only mezzanine cards need to be redesigned
Monitor/control for crates
Hot-swap capability preferred
Low-cost

9. Number of channels Slow ADC ~200 Medium ADC ~80 Fast ADC ~30 Total DAC
Regulation boards
~60
Laser diode driver
Motor drivers
~120
Piezo drivers

10. FLASH Prototype is VME !
Experience gained at FLASH is instrumental for success of XFEL synchronization system
If new standard – part of FLASH optical synchronization system would need to be in new standard for testing – additional funding needed!
Significant electronics redesign needed
Significant software effort needed
We do not have manpower and funding needed for such redesign
Timescale: long term tests need to be performed with new system -> everything needs to be ready by 2010 for 2011 injector commissioning

11. Conclusion
Optical synchronization system: central node and ~ 20 end stations
~ 300 ADC channels, 30 DAC channels, 60 digital regulation boards
Any change from VME means a potentially significant redesign effort of components, both hardware and software (Laser diode drivers: ~1FTE+30kEUR without software)
We have neither manpower/funds to design new electronics
As long as there is support for software and standard hardware, either xTCA or VME would be ok, but we need additional funding.
timescale – hard and software must be ready for testing well before injector commissioning (2011)

12. Thank you for your attention !!