1. SPM® 55 Module for Home Appliances
Motion Control System Team
June 2014

2. In taking receipt of this Material, recipient acknowledges
and agrees to maintain its confidentiality and use the
material for the sole purpose of business endeavors with
Fairchild.  Sharing with 3rd parties is prohibited.

3. SPM 55 Series Key features
Leading Edge IGBT /Diode
*SC rated FieldStop Trench IGBT
Interlock / Shoot Through Protect
*Arm Short protection fn. in 6-in-1 HVIC
Outstanding ruggedness
*SCWT > /
mfg. Convenience
*One side full circle locking hole
Thermal detecting fn.
*TSU/TSD function in LVIC
Application optimized product lineup
*Low VCE_SAT ver. / Low EOFF ver.

4. Introduction Circuit Diagram & Product Lineup Key Features
Advanced FieldStop Trench IGBT
Low Conduction Loss: Vce_sat 1.55 V typ.(normal ver.), 2.0 V typ.(fast ver.)
Low Switching Loss: Eoff <30 μJ/A(normal ver.), <15 μJ/A(fast ver.)
Superior Ruggedness: SCWT >15 >5
Protection Functions
Under-Voltage Lock Out for high-side & low-side
Over-current & Short-circuit current protection
Shoot-through protection(Interlock) function
Thermal monitoring: TSU(Thermal Sensing Unit) function & TSD
External Shutdown input function
Better Reliability
New 6-in-1 Gate Drive IC design for higher Noise, Surge immunity
Meet ESD rating requirement: HBM 2 kV, CDM 500 V
Design Convenience
One side full circle screw mounting hole
No side dummy pin for easier heatsink design
Rating
fSW > 10 KHz
fSW < 10 KHz
600 V/ 5 A
FNB50560T1
FNA50560T1
600 V/ 10 A
FNB51060T1
FNA51060T3
600 V/ 15 A
FNB51560T1
FNA51560T3

5. Package Design Two lead length option for different applications
Package Size : 37.0 mm x 21.0 mm x 3.5 mm, Lead Count : 20 Leads
Lead to Heat Sink Distance : 1.55 mm
Zig-zag signal pin lay-out : to prevent lead short(solder bridge) during wave soldering process
VS.
Half circle
Short Lead Option 9.50 mm
Long Lead Option
14.00 mm
One side closed locking hole : to make easy screw joining on mounting process

6. Interlock Function Shoot-through Protection
[Timing Chart for inter-lock]
Note 1 : LS-FIFO mode is the complementary operation of HS-FIFO mode.
Note 2 : HS-noise mode is the complementary operation of LS-noise mode.

7. Fault-out pin function #17 Bi-directional multi-function Pin
[Gate Drive IC Internal Block Diagram]
Thermal Sensing Unit in 6-in-1 HVIC
System fault out (FO) : OCP, TSD
System Shutdown input from MCU
System Shutdown
MCU
System fault out (FO)
Thermal information
Multi fn. Pin ; VF(#17)

8. Fault-out pin function Operating behavior
Normal mode & TSD
*Thermal Sensing
Fault Out by false
*Under Voltage
Over current
System Shut-down
*Signal from MCU
Stop operation
by ‘0’ V input from external MCU
Motor Out
Return to driv
Driving
Triggering IC temp.
Touch TSD level
False Operation *UV,OC,IL
Return to normal
[V]
FO pin
Threshold 1.4 V typ.
Release 2.0 V typ.
Releasing IC temp.

9. Pseudo NTC function [ Fig.1 THVIC vs. VF as pull-up voltage
VF [V]
THVIC [ºC]
THVIC [ºC]
THVIC [ºC]
[ Fig.1 THVIC vs. VF as pull-up voltage
@ 4.7 kΩ of pull up resistor]
[ Fig.2 THVIC vs. VF as pull-up resistor
@ 5 V of pull up voltage]
[ Fig.3 THVIC vs. VF as pull-up resistor
@ 3.3 V of pull up voltage]
Pseudo NTC is connected with shut-down input and pull-up resistance should be selected considering of HVIC temperature, because threshold voltage of shut-down input is tpy. 1.4 V. Therefore the recommended pull-up resistance is 4.7 kohm for 5 V pull-up and 3.3 kohm for 3.3 V pull-up voltage.

10. New FieldStop Trench IGBT Performance
PT Planar
Gate
Emitter N+
P-base
P-collector
Collector
P-base N+
Gate
Emitter
P-collector
Collector
NPT Planar
Trench
FS Trench
*SPM3 V2 Series
*SPM45 V1 Series / SPM3 V4 Series
NPT Trench (~75 um)
*SPM45 V3 Series / SPM 55 Series
NPT Planar(~97 um)
[IGBT Trade-off Curve]

11. New FieldStop Trench IGBT Short Circuit Ruggedness
Test conditions : Vdc=450 V, Vcc=20 V, Tj=150degC
Result : min. 6.4 us
[FNB51060T Short Circuit Withstanding Time result]
No.
VDC[V]
VDD[V]
FNB51060T
Imax [A]
Imin [A]
tsc [us] #1
300 15
36.4
26.4
16.2
16.4 #2
400
38.0
27.2
10.6
10.8 #3
16.5
46.4
35.6
7.8
25.6
8.0
Tsc=6.4 us
[Fairchild SPM® 55 module Worst case]

12. Comparison data Overview SPM 55 Module vs. Competitor A
Item
SPM 55 Module
FNB51060T (10 A fast ver.)
Competitor A
Sxxxxx10K60A (10 A)
Note
Size/Pin count
21 x 37 / 20pin
22 x 44.4 / 25pin
VCE_SAT [V]
@Ic 10 A, Tj 25℃
2.0 V
2.7 V
EOFF [uJ]
15 μJ /A
30 μJ /A
Total Power Loss
One module Arms
20.0 W
22.7 W
VDC=300 V, VCC=15 V, FSW=16 kHz, MI=0.8, PF=0.9, SVPWM, Tj=125℃
SCWT
(Short-Circuit Withstand time)
>15
>7
5.5 4
Normal: VDC 300 V, VDD 15 V
Worst: VDC 400 V, VDD 16.5 V
Interlock function O
Substrate /
(Thermal resistance)
Full mold /
(*5.0℃/W)
DBC
(3.8℃/W)
Thermal Sensing
Pseudo NTC
on Gate Drive IC
NTC
on Inner PCB

13. Comparison data Real Load Test SPM 55 Module vs. S-company
Test Bench
Condition
IOUT waveform
SPM55(FNB51060T)
S-company(Sxxxxx10K60A)
IOUT=3.0 Arms
VDC=300 V, VCC=15 V, FSW=16 kHz,
Tdead=1.5 μs
IOUT=3.2 Arms
VDC=300 V, VCC=15 V, FSW=16 kHz, Tdead=1.5 μs
Heat-sink & DUT
IOUT [Arms]
FNB51060T
Sxxxxx10K60A
3.0 Arms
TA [℃]
28.1
28.2
TH [℃]
86.5 90
ΔT [℃]
58.4
61.8
3.2 Arms
27.3
26.1
90.9
93.3
63.6
67.2

14. Schedule Sample Plan & Target Release Schedule
Sample & Code S Release Plan
FSID
Description
Q2 2014
Q3 2014
Q4 2014 P4 P5 P6 P7 P8 P9
P10
P11
P12
FNB50560T1
5 A Fast ER CS
Code S
FNA50560T1
5 A Normal
FNA50560T3K
5 A High Performance
FNB51060T1
10 A Fast
FNB51560T1
15 A Fast
Code S　
FNA51060T3
10 A Normal
FNA51560T3
15 A Normal vehicle product

15. THANK YOU