1. www.etienne-sicard.fr > Teaching > EMC of ICs
Electromagnetic compatibility of Integrated Circuits
Etienne SICARD
INSA/DGEI
University of Toulouse
31077 Toulouse - France
Alexandre BOYER
INSA/DGEI – LAAS-CNRS
University of Toulouse
31077 Toulouse - France
> Teaching > EMC of ICs
Sept. 2016
September 18

2. Objectives Through lectures (12 H) Through practical training (16 H)
Understand parasitic emission mechanisms
Introduce parasitic emission reduction strategies
Give an overview of emission and susceptibility measurement standards
Power Decoupling Network modelling
Basis of conducted and radiated emission modelling
Basis of immunity modelling
Understand the role of decoupling at printed-circuit-board level
Acquire basic knowledge of design for improved EMC at PCB and IC level
Through practical training (16 H)
Illustrate basic concepts through simulation
IC modeling case study
Evaluation based on report
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3. July 2017, St Petersburg, Russia
References
Books
Freeware
Workshops
July 2017, St Petersburg, Russia
Standards
IEC 61967, 2001, Integrated Circuits Emissions
IEC 62132, 2003, Integrated circuits Immunity
IEC 62433, 2008, Integrated Circuit Model
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4. 1. EMC of ICs An overview

5. Outlines Electronic Market Growth Electromagnetic interference
What is EMC
EMC at IC level
Origin of parasitic emission
Trends towards higher emission
Origin on susceptibility
Emission issues
Susceptibility issues
Standardization issues
Conclusion
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6. Electronic Market Growth
Individuals
30%
Companies 4G
IoT
ADAS
PC at home
Internet
GSM
MP3
DVD
Flat screens
Automotive
HDTV 3G
Society
20%
PC in companies
Audio CD
Defense
Local Energy
Security
Medical 3%
2014 4%
2017
10%
Recession
Bank crash 2%
2013 3%
2015
Recession
-10%
Telecom crash 83 86 89 92 95 98 01 04 07 10 13 16
Year
Adapted from Electronique International Mai 21, 2009
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7. Electronic Market Growth
Vision 2020
Increasing disposable income,
expanding urban population,
growing internet penetration and
availability of strong distribution network
Share of system sales
2020 vs 2015
Smartphones PC TV
Automotive
Tablets
Internet of Things
Game consoles
Medical
Servers
-10%
10%
20%
Growth
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8. Mobile Business
We are here
7.8 billion 4G 3G 2G

9. Internet of Things

10. Automatic Drive 2020 : Injury-free driving
TOWARDS AUTOMATIC DRIVE
2020 : Injury-free driving
2030: Accident-free driving ?
2040: Autonomous driving?

11. Electromagnetic Interference
EMI ISSUES IN WIRELESS DEVICES
Numerous interference cases reported over the ISM band 2400 – MHz.
From Cisco, « 20 Myths of WiFi Interference », White Paper, 2008:
“Interference contributes to 50 % of the problems on the customer’s Wi-Fi network. “
“In a recent survey of 300 of their customers, a major Wi-Fi tools provider reported that “troubleshooting interference won ‘top honors’ as the biggest challenge in managing a Wi-Fi network.””
“67 percent of all residential Wi-Fi problems are linked to interfering devices, such as cordless phones, baby monitors, and microwave ovens.”
“At 8m, a microwave oven degrades data throughput by 64%.”

12. Electromagnetic Interference
EMI ISSUES IN MEDICAL DEVICES
Interference Technology – June 2015
“Pacemakers can mistakenly detect electromagnetic interference (EMI) from smartphones as a cardiac signal, causing them to briefly stop working. This leads to a pause in the cardiac rhythm of the pacing dependent patient and may result in syncope.” Dr. Lennerz
“For implantable cardioverter defibrillators (ICDs) the external signal mimics a life threatening ventricular tachyarrhythmia, leading the ICD to deliver a painful shock” Dr. Lennerz
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13. Electromagnetic Interference
EMI ISSUES IN MEDICAL DEVICES
Interference Technology – March 2014
Electromagnetic radiation from portable suction devices could interfere with some defibrillators, rendering them inoperable in a medical emergency.
Philips HeartStart MRx defibrillators are known to fail without warning during battery power operation if subjected to high electromagnetic interference (EMI).
Laerdal LSU 4000 portable suction units emitted EMI with field strengths up to 180 V/m, put the defibrillators at risk for malfunction.

14. Electromagnetic Interference
EMI ISSUES IN AUTOMOTIVE
Interference Technology – March 2014
The National Highway Traffic Safety Administration (NHTSA) said in documents filed on June 2 that it had opened a query into a 2012 recall for 744,822 Jeep Liberty SUVs [..] the air bag squib filter circuitry inside the vehicle’s Occupant Restraint Control (ORC) module is susceptible to degradation. ORC degradation can result in an inadvertent air bag deployment (IABD) while the vehicle is in operation, potentially leading to injuries such as burns, cuts and bruises…

15. Electromagnetic Interference
EMI ISSUES IN AUTOMOTIVE
ADAS - Advanced Driver Assistance Systems
Autonomous driving in 2030
Much more sensors, cameras, embedded calculators & security

16. Electromagnetic Interference
EMI ISSUES IN AVIATION
Interference Technology – January 2013
FAA said Wi-Fi systems may interfere with the Honeywell phase 3 display units aboard 157 Boeing airplanes in use by various U.S. airlines. These display units are critical for flight safety, providing crewmembers with information such as airspeed, altitude, heading, and pitch and roll [..] the issue was discovered two years ago during testing to certify a Wi-Fi system for use on Boeing 737 Next Generation.

17. Electromagnetic Interference
EMI ISSUES IN AVIATION
News
Wind Turbines Could Cause EMI; Pose Danger to Vermont Airspace
11/24/2015
“According to a Notice of Presumed Hazard posted on the FAA’s website, the 499-foot-tall wind turbines proposed for Rocky Ridge in Swanton would have ‘an adverse physical or electromagnetic interference effect upon navigable airspace or air navigation facilities’” Vermont Watchdog.org reported.
“The blades of the turbines would degrade radar used by Boston Center to regulate air traffic across New England states, New York and part of Pennsylvania,” Vermont Watchdog.org added.

18. What is EMC
DEFINITION
« The ability of a component, equipment or system to operate satisfyingly in a given electromagnetic environment, without introducing any harmful electromagnetic disturbances to all systems placed in this environment. »
Essential constraint to ensure functional safety of electronic or electrical applications
Guarantee the simultaneous operation of every electrical or electronic equipment in a given electromagnetic environment
Reduce both the parasitic electromagnetic emission and the sensitivity or susceptibility to electromagnetic interferences.

19. EMC at IC level
ZOOM AT DEVICES
10 mm
100 mm
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20. 1 V 100 µA Integrated Circuits… 10µm 1mm 100 nm 1 µm © Intel Xeon
September 18

21. EMC at IC level WHY EMC OF IC ?
Until mid 90’s, IC designers had no consideration about EMC problems in their design..
Starting 1996, automotive customers started to select ICs on EMC criteria
Starting 2005, mobile industry required EMC in System in package
Massive 3D integration will require careful EMC design
September 18

22. Crypto, sensor, position processor
EMC at IC Level
14nm
2016
4G+
Today
Octa Core
Multi DSP
3D 4K Image Proc
Crypto, sensor, position processor
Agregated RF
2 Gb Memories
15G
5nm
150 G
2020 ? 5G
Technology
130nm
90nm
45nm
28nm
Complexity
250M
500M 2G 7G
Packaging
Mobile generation 3G
3G+ 4G
2004
2007
2010
2013
Core DSPs
10 Mb Mem
Dual core
Dual DSP RF
Graphic Process.
100 Mb Mem
Sensors
Quad Core
Quad DSP
3D Image Proc
Crypto processor
Reconf FPGA,
Multi RF
1 Gb Memories
Multi-sensors
Embedded blocks

23. EMC at IC level INCREASED COMPLEXITY
Technology
1st year of produc.
External Supply (V)
Internal supply (V)
Max. Current (A)
Gate density (K/mm2)
SRAM area (µm2)
Gate current (mA)
Gate capa (fF)
Typ gate delay (ps)
0.8 µm
1990 5
<1 15
80.0
0.9 40
180
0.5 µm
1993 3 28
40.0
0.75 30
130
0.35 µm
1995
3.3 12 50
20.0
0.6 25
100
0.25 µm
1997
2.5 90
10.0
0.4 20 75
0.18 µm
1999
1.8
160
5.0
0.3
0.12 µm
2001
1.2
150
240
2.4
0.2 10 35
90 nm
2004
1.0
186
480
1.4
0.1 7
65 nm
2006
236
900
0.07 22
45 nm
2008
283
2 000
0.35
0.05 18
32 nm
2010
290
3 500
0.20
0.04 14
28 nm
2012
1.5
300
4 800
0.15
0.03 2
20 nm
2014
0.8
8 000
0.10
0.02 8
14 nm
2016
350
15 000
0.015 6
10 nm
2018
30 000
0.011 4
7 nm
2020
0.5
50 000
0.008
Adapted from M. Ramdani E. Sicard, “The Electromagnetic Compatibility of Integrated Circuits—Past, Present, and Future”, IEEE Trans. EMC, VOL. 51, N. 1, Feb. 2009
September 18

24. EMC at IC Level TOWARDS 100 GIGA DEVICES 100,000,000,000
8-core µP = 2 GT
Dual core µP+ cache = 100MT
32 bit µP :1MT
16 bit µP = 100 KT
8bit µP : 10 KT
2020

25. EMC at IC Level
IMPORTANCE OF MEMORY
50%
20%
55%
35%

26. EMC at IC level TWO MAIN CONCEPTS Susceptibility to EM waves
Emission of EM waves
Carbon airplane
Personnal entrainments
Safety systems
interferences
Equipements
Boards
Susceptibility to radio frequency interference is illustrate in the case of a very high radar wave illuminating an airplane. This situation is very common at the proximity of airports. A Giga-watt pulse is received by the the plane, which captures some energy which may flow to the equipment, the board and finally to the component.
On the other hand, the parasitic emission due to the integrated circuit inside a car may jeopardize the correct behavior of personal devices such as mobile phones, and RF links. In some case, the parasitic energy may be high enough to parasite the safety systems of the car.
Radar
Components
Hardware fault
Software failure
Function Loss
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27. EMC at IC Level Radiation Coupling Emission Susceptibility
THE ROLE OF ICS AS PERTURBATION SOURCE AND VICTIM
Integrated circuits are the origin of parasitic emission and susceptibility to RF disturbances in electronic systems
Emission
Radiation
Chip
Components
PCB
System
Noisy IC
Interferences
Sensitive IC
Coupling
Chip
Components
PCB
System
Susceptibility
September 18

28. Origin of Parasitic Emission
BASIC MECHANISMS FOR CURRENT SWITCHING
VDD
Switching current
IDD
Vin
Voltage
Time
Output capa
VSS
ISS
Time
One of the major source of perturbation is the current flowing inside each elementary gate of the integrated circuit. Let us consider the CMOS inverter, supplied by a high voltage VDD (2V in 0.18µm) and ground VSS (0V). When the input falls to 0 (i.e logic level “0”), a current (around 0.5mA) charges the capacitance through the pull up device.
When the input rises to 2V, that is a logic level “1”, a similar current flows through the pull down device and discharges the capacitance.
CMOS inverter exemple
Question: waveform, amplitude?
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29. Origin of Parasitic Emission
CMOS INVERTER IN IC-EMC
Waveforms strongly depend on load
Switching current
Voltage
Time
Time
Basic > interconnects > GateSwitching.sch
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30. Origin of Parasitic Emission
STRONGER SWITCHING CURRENT:
i(t)
Time
50ps
i(t)
Time
Vdd
i(t)
Vss
Internal switching current
Switching gates
Very large Simultaneous Switching Current
Main transient current sources:
Clock-driven blocks, synchronized logic
Memory read/write/refresh
I/O switching
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31. Origin of Parasitic Emission
EXAMPLE: EVALUATION OF SWITCHING CURRENT
____ VDD, ___ technology
____ mA / gate in ____ ps
____ % is gate
____ gates in ____ Bit Micro => ____ A
____ % switching activity => ____ A
____ % current peak spread (non synchronous switching)
____ in ____ ps
____
Current (A)
____ ns
time
Vdd
Vss
i(t)
Current / gate
Current (A)
____ ns
time
Current / Ic
____
0.1 ma/gate in 100 ps, 10 million (base band), 10 K(8bits), 100K (16 bits), 1M (32 bits). % switching activity = 10 %, /10 because spread current = 1 A peak sur 1 ns. 16 bits : 100 mA sur 1 ns, 32 bits = 1A 500 ps…
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32. Origin of Parasitic Emission
Wires act as antennas
V(t)
Time
Vss
Vdd
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33. Origin of Parasitic Emission
WIRES+CURRENT = NOISE
DSPIC33F noise measurement with active probe on X10
Activation of the core by a 40 MHz internal PLL
Synchronous ADDR0..15 bus switching 0x0000, 0xFFFF
DSPIC_VDD_VofT.tran
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34. Origin of Parasitic Emission
WIRES RADIATE
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35. Increase parasitic noise
Emission issues
WHY TECHNOLOGY SCALE DOWN MAKES THINGS WORSE ?
Time
New process
Volt
Old process
Current level keeps almost constant but:
Faster current switching
Stronger di/dt
Increase parasitic noise
Current
di/dt
Old process
Reduc Voltage swing => less E field
With the technology scale down, the supply voltage is reduced and the signals switch faster within interconnects (From voltage to scaled voltage). In 0.18µm technology, the switching is about 100ps (Pico-second or second), with a 2V swing. Concerning currents, the amplitude of elementary peaks appearing on supply lines of each elementary gates are sharper, but their amplitude remains constant (0.5mA in 100ps, per gate). Consequently, stronger di/dt are observed, leading to increased emission problems.
New process
Time
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36. Susceptibility Issues
DECREASED NOISE MARGIN IN ICS
3.3 V inside, 5V outside
____
noise margin
Supply (V)
5.0
1V inside, 1.2V outside
____
noise margin
3.3
I/O supply
2.5
Core supply
1.8
1.2
Tension cœur: réduire la puissance consommée, fragilité des oxyde
Tension I/O: reduction => aller + vite de 0 à VDD, mais – rapide pour des raison de compatibilité entre techno
1.0
0.35µ
0.18µ
130n
90n
65n
45n
32n
20n
14n
10n 7n
Technology
September 18

37. Susceptibility Issues
UNINTENTIONAL ELECTROMAGNETIC SOURCES
Power HF
VHF
UHF
SHF
xHF
THF
1GW
Weather Radar
Radars
Fields radiated by electronic devices
Continuous waves & pulsed waves
1MW
Thunderstorm impact
TV UHF
1KW
TV VHF
2-4G BS 1W 4G 2G 3G
1mW
Frequency
3 MHz
30 MHz
300 MHz
3 GHz
30 GHz
300 GHz
25m
25mm
0.25m
2.5mm
2.5m
/4 (ideal antenna)
0.25mm

38. Susceptibility Issues
SYSTEM-ON-CHIP, 3D STACKING: DANGER
EMC Level (dB)
Susceptibility level 50
High risk of interference 40 30
Safe interference margin 20
Unsafe margin 10
-10
-20
Sum of perturbations
-30
-40 1 10
100
1000
Frequency (MHz)
September 18

39. Conclusion EMI reported in all kinds of devices
IC involved in many EMI problems
IC technology evolution towards higher complexity
On-chip switching currents in the A range
ICs are good antennas in the GHz range
Increased switching noise
Increased emission issues
Reduced noise margins
System-on-chips, systems-in-package rise new EMC issues
September 18