1. Mission Profile Aware IC Design - A Case Study -
Goeran Jerke, Robert Bosch GmbH, Automotive Electronics
Andrew B. Kahng, University of California, San Diego
This research project is supported by the German Government, Federal Ministry of Education and Research under the grant number 16M3195C

2. Overview Introduction Design Challenges Mission Profile Aware Design
Case Study – Electromigration Aware IC Design
Summary and Conclusion
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

3. Introduction Tier 2 Tier 1 OEM OEM – Original Equipment Manufacturer
ECUs, mechatronics
sensors
MEMS sensors
Tier 2
Tier 1
Semiconductors
OEM
OEM – Original Equipment Manufacturer
17-Sep-18
17-Sep-18

4. Introduction Electronic Control Unit for ESP 17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

5. Introduction Tier 2 + Tier 1 ECU for Driver Assistance
Acceleration Sensor Module
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

6. Introduction Temperatures Responsibility Parameters
Ambient Temperature (Car)
OEM
Environment
Installation Location (Car)
ECU Housing
Tier 1, OEM
System Design Packaging Constraints
ECU (internal)
Tier 1
Component Pin
Tiers 1 and 2
Foundry
Functional Load
Constraints
Tier 2
Foundry
Device Junction
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

7. Introduction IC Technology Node Evolution 17-Sep-18
Smart-Power
HV-CMOS
CMOS automotive
CMOS leading edge (ITRS)
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

8. Design Challenges Aggressive technology scaling
Time to market  co-design
System partitioning and integration
Robustness
Application requirements:
Origin and cause of requirements  replicability, quality
Impact on application design and technologies
Application use  operating conditions, environmental load
Functional loads  thermal, current, voltage, ...
Reliability  dominant failure mechanisms
Complex, heterogeneous and fragmented design flows
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

9. Design Challenges Aggressive technology scaling
Time to market  co-design
System partitioning and integration
Robustness
Application requirements:
Origin and cause of requirements  replicability, quality
Impact on application design and technologies
Application use  operating conditions, environmental load
Functional loads  thermal, current, voltage, ...
Reliability  dominant failure mechanisms
Complex, heterogeneous and fragmented design flows
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

10. Overview Introduction Design Challenges Mission Profile Aware Design
Case Study – Electromigration Aware IC Design
Summary and Conclusion
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

11. Mission Profile Aware Design
Supply Chain
OEM
Tier 1
Tier 2
...
Tier n
...
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

12. Mission Profile Aware Design
Design Chain
OEM MP MP MP MP
Tier 1 MP MP MP MP
Tier 2
...
Tier n
...
Requirements, Constraints, Functional Loads, Environmental Loads
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

13. Mission Profile Aware Design
Design Chain
OEM MP MP MP MP
Tier 1 MP MP MP MP
Tier 2
...
Tier n
...
NEW: Achieved Robustness, Dominant Failure Mechanisms  RIF
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

14. Mission Profile Aware Design
Design Flow Overview 2 1 5 3 3 4 4
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

15. Mission Profile Aware Design
Consistent consideration of mission profiles (MP) in supply chain
Reduction of design uncertainty
More precise requirements and stress factors
Better understanding of system (failure mechanisms)
Formalized and improved communication
OEM  Tier n and Tier n  OEM
Standardization of structure and content of MPs
Electronic format  MP documents
RMP Framework (Tool-independent platform for mission profile aware design)
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

16. Mission Profile Aware Design
Mission Profile Document
Document header
Operating states definition
Component definition
Property definition
Back-annotation data
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

17. Mission Profile Aware Design
Mission Profile Document
Document header
Author
Timestamp
Document history
Mounting location
Operating states definition
Component definition
Property definition
Back-annotation data
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

18. Mission Profile Aware Design
Mission Profile Document
Document header
Operating states definition
Generic data container for operating states
Manufacturing, assembly, storage, ...
Car: start, acceleration, breaking, stop&go, freeway cruising, ...
IC: power-up, idling, power-down, mode_1, mode_2, ...
Component definition
Property definition
Back-annotation data
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

19. Mission Profile Aware Design
Mission Profile Document
Document header
Operating states definition
Component definition
Type  e.g. ECU, passive component, IC, sensor, ...
Device I/O port definition (*)
Operating state dependent environmental and functional loads
Heat flow
Transient/effective voltages and currents
...
Profiles
Property definition
Back-annotation data
(*) A port is a generic object: thermal port or electrical port
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

20. Mission Profile Aware Design
Source: ZVEI Handbook RV EE Modules 2012
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

21. Mission Profile Aware Design
Mission Profile Document
Document header
Operating states definition
Component definition
Type
Device I/O port definition
Profiles:
Temperature histogram, gradient and cycling
Humidity vs. temperature histogram
Vibration
...
Property definition
Back-annotation data
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

22. Mission Profile Aware Design
Source: ZVEI Handbook RV EE Modules 2012
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

23. Mission Profile Aware Design
Mission Profile Document
Document header
Operating states definition
Component definition
Property definition
Back-annotation data
Reliability: Robustness Indication Figures (RIF) of dominant failure mechanisms
Robustness: Enhanced Worst-Case Distance (WCD)
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

24. Mission Profile Aware Design
Component Properties
Component Parameter
ECU TEEM_Package, TVMLA, TEEM_internal , TComp.Package , ...
Board TBoard , ...
Package TComp.Package, TComp.Pins, Rth, ...
Chip TJunction, ...
Sensor
Discrete device, ...
Source: ZVEI Handbook RV EE Modules 2012
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

25. Overview Introduction Mission Profile Aware Design
Case Study – Electromigration Aware IC Design
Summary and Conclusion
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

26. EM Aware Design – Case Study
Quality of Functional Load Data
Classic Design Flow
Current Aware Design Flow
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

27. EM Aware Design – Case Study
Cell-Level
Current Aware Design Flow
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

28. EM Aware Design – Case Study
Block-Level
Current Aware Design Flow
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

29. EM Aware Design – Case Study
Electromigration (EM)
Quality of Functional Load Data I
I = 1A DC EM
EOS
RPP
Voids
Voids
Hillock
Hillock
AE/QMM
Electrical Overstress (EOS) t
Abnormal peak event
AE/QMM I
Imax = 1A + Duty cycle
Repetitive Power Pulsing (RPP) EM
EOS RPP t
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego
AE/QMM

30. EM Aware Design – Case Study
Current (Density) Aware Routing to prevent EM and EOS
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

31. EM Aware Design – Case Study
Effective Design Parameters
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

32. EM Aware Design – Case Study
Electromigration Aware Design Flow 1 3 2 4
4,5 5
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

33. EM Aware Design – Case Study
Current Density Critical Nets – Automotive IC A
Different Mission Profile
Next technology node
Base node
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

34. EM Aware Design – Case Study
Current Density Critical Nets – Automotive IC B
Next technology node
Different Mission Profile
Base node
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

35. Overview Introduction Design Challenges Mission Profile Aware Design
Case Study – Electromigration Aware IC Design
Summary and Conclusion
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

36. Summary and Conclusion
Consideration of robustness as design target is essential for automotive electronic designs
Consistent consideration of mission profiles within the design chain is required (bi-directional flow)
Current aware design is driven by mission profiles
Mission profile aware design:
Vendor- and EDA tool-independent  focus on design flow
Reduction of design uncertainty
Formalized and improved communication
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego

37. Thank You!
17-Sep-18
Goeran Jerke, Robert Bosch GmbH; Andrew B. Kahng, University of California, San Diego