1. Innovative solutions for high density interconnections

2. Company Objective
To be the reference in ball soldering equipment through R&D and partnership development.
Our logo clearly defines our business: interconnection
18/09/2018

3. Key activity : AMI or Alloy Micro Injection
A revolutionary process for area array package production
The spear-head of our strategy relies on Applied Microtech’s patent for Alloy Micro Injection. This will be the subject of today’s conference
To answer today’s cost needs and tomorrow ’s technological needs

4. Allows dramatic reduction in TCOO – up to 50%
Current technology uses
expensive balls which are
positioned through pick & place
Or stencil print process
Applied Microtech’s AMI
only requires inexpensive
alloy bars which are molten
to form the balls
Indeed now that BGAs are becoming a mature product solutions are being investigated for reducing costs: AMI is the perfect answer
18/09/2018

5. AMI - Alloy Micro Injection
AMI 700 PRODUCTION MODULE
AMI - Alloy Micro Injection
The result is Applied Microtech’s first production module for BGA balls. Soon we will not speak about ball attach but ball formation.
First commercialized module for Micro Injection production

6. Process Steps Current technology A.M.I. technology
Let’s have a look at a comparison of current process versus Apllied Microtech’s process

7. AMI Benefits
The overall benefits are multiple and market driven: economy and ecology. In addition many other beneficial features are appearing: more latitude to handle leadless or high melt alloys; automatic repair; better electrical caracteristics; etc

8. Reduced footprint
18/09/2018

9. Environmentally Friendly
Lower energy consumption
Dramatic reduction in water consumption
No flux or detergents
Savings
Necessary where water is scarce
In line with IC manufacturer’s corporate policies
Our module responds to the corporate policies implemented by some of the biggest IC manufacturers in terms of protection of the environment
18/09/2018

10. A strategic issue
Water will become more and more a strategic issue; hence it needs to be saved and were it is scarce (such as Taiwan, Malta, Morocco, etc) its consumption needs to be reduced
18/09/2018

11. Solder ball formation

12. Mould cavity filled with SnPb

13. Mould cavity filled with lead less solder

14. Temperature profile
Reflow oven

15. A.M.I process for leadless solder
Temperature profile
A.M.I process for leadless solder
Component damage
Process windows

16. Metal corrosion
With leadless solder
Inox 304
18/09/2018

17. ( PBGA 276, 760 µm Ball diameter )
T.C.O.O comparison
( PBGA 276, 760 µm Ball diameter )
Savings can be as high as 50%

18. Looking to a bright future
Applied Microtech’s patented technology is set to be the reference for WLP bumping as well as wafer bumping.
1st level of interconnect of substrates is also an ideal candidate for our technology.
1st level of interconnect of substrates is also an ideal candidate for our technology. Indeed, as we can inject an entire area, our Alloy Micro Injection is the ideal solution for bumping directly the substrates to accommodate the dies, thus greatly reducing costs in flip-chip technology.
18/09/2018

19. R&D High density road map
Alloy Micro Injection
Pitch
0,15
Wafer Bumping
1st level substrate
bumping
0,3
Wafer Level Packaging
0,5
CSP
0,8
BGA
1,0
Q2 2002
Q4 2002
Q2 2003
Q4 2003
Q2 2004

20. Thank you
Questions & Answers