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Chapter 7: Dislocations & Strengthening Mechanisms

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Presentation on theme: "Chapter 7: Dislocations & Strengthening Mechanisms"— Presentation transcript:

1 Chapter 7: Dislocations & Strengthening Mechanisms
ISSUES TO ADDRESS... • Why are dislocations observed primarily in metals and alloys? • How are strength and dislocation motion related? • How do we increase strength? • How can heating change strength and other properties?

2 Dislocations & Materials Classes
• Metals: Disl. mvt easier. -non-directional bonding -close-packed directions for slip. electron cloud ion cores + • Covalent Ceramics (Si, diamond): Movement difficult. -directional (angular) bonding • Ionic Ceramics (NaCl): Movement difficult. -need to avoid ++ and - - neighbors. + -

3 Dislocation Motion Dislocations & plastic deformation
Cubic & hexagonal metals - plastic deformation by plastic shear or slip where one plane of atoms slides over adjacent plane by defect motion (dislocations). So we saw that above the yield stress plastic deformation occurs. But how? In a perfect single crystal for this to occur every bond connecting tow planes would have to break at once! Large energy requirement Now rather than entire plane of bonds needing to be broken at once, only the bonds along dislocation line are broken at once. If dislocations don't move, deformation doesn't occur! Adapted from Fig. 7.1, Callister 7e.

4 Dislocation Motion Dislocation moves along slip plane in slip direction perpendicular to dislocation line Slip direction same direction as Burgers vector Edge dislocation Adapted from Fig. 7.2, Callister 7e. Screw dislocation

5 photomicrograph of a lithium fluoride (LiF) single crystal, the small pyramidal pits represent
those positions at which dislocations intersect the surface. The surface was polished and then chemically treated; these “etch pits” result from localized chemical attack around the dislocations and indicate the distribution of the dislocations. 750X

6 f03_07_pg177 Dislocation Motion f03_07_pg177.jpg

7 Deformation Mechanisms
Slip System Slip plane - plane allowing easiest slippage Wide interplanar spacings - highest planar densities Slip direction - direction of movement - Highest linear densities FCC Slip occurs on {111} planes (close-packed) in <110> directions (close-packed) => total of 12 slip systems in FCC in BCC & HCP other slip systems occur Adapted from Fig. 7.6, Callister 7e.

8 Resolved Shear Stress Resolved shear stress is the shear component of an applied tensile (or compressive) stress resolved along a slip plane that is other than perpendicular or parallel to the stress axis. The critical resolved shear stress is the value of resolved shear stress at which yielding begins; it is a property of the material.

9 Critical Resolved Shear Stress
• Condition for dislocation motion: 10-4 GPa to 10-2 GPa typically • Crystal orientation can make it easy or hard to move dislocation  = 60°  = 35°

10 Single Crystal Slip Adapted from Fig. 7.9, Callister 7e.

11 Slip Motion in Polycrystals
300 mm • Stronger - grain boundaries pin deformations • Slip planes & directions (l, f) change from one crystal to another. • tR will vary from one • The crystal with the largest tR yields first. • Other (less favorably oriented) crystals yield later. Adapted from Fig. 7.10, Callister 7e. (Fig is courtesy of C. Brady, National Bureau of Standards [now the National Institute of Standards and Technology, Gaithersburg, MD].)

12 Anisotropy in sy • Can be induced by rolling a polycrystalline metal
- before rolling - after rolling - anisotropic since rolling affects grain orientation and shape. rolling direction Adapted from Fig. 7.11, Callister 7e. (Fig is from W.G. Moffatt, G.W. Pearsall, and J. Wulff, The Structure and Properties of Materials, Vol. I, Structure, p. 140, John Wiley and Sons, New York, 1964.) 235 mm - isotropic since grains are approx. spherical & randomly oriented.

13 f12_07_pg187 Deformation by Twinning HRTEM Image of Si
f12_07_pg187.jpg HRTEM Image of Si

14 Difference between Slip and Twinning

15 Difference Between Slip and Twinning
Slip occurs in distinct atomic spacing multiples, whereas the atomic displacement for twinning is less than the inter-atomic separation, usually proportional to their distances from the twin plane. for slip, the crystallographic orientation above and below the slip plane is the same both before and after the deformation; for twinning, there will be a reorientation across the twin plane. The amount of bulk plastic deformation from twinning is normally small relative to that resulting from slip; twinning may however place new slip systems in orientations that are favorable relative to the stress axis such that the slip process can now take place.

16 4 Strategies for Strengthening: 1: Reduce Grain Size
• Grain boundaries are barriers to slip. • Barrier "strength" increases with Increasing angle of misorientation. • Smaller grain size: more barriers to slip. • Hall-Petch Equation: Adapted from Fig. 7.14, Callister 7e. (Fig is from A Textbook of Materials Technology, by Van Vlack, Pearson Education, Inc., Upper Saddle River, NJ.)

17 4 Strategies for Strengthening: 2: Solid Solutions
• Impurity atoms distort the lattice & generate stress. • Stress can produce a barrier to dislocation motion. • Smaller substitutional impurity Impurity generates local stress at A and B that opposes dislocation motion to the right. A B • Larger substitutional impurity Impurity generates local stress at C and D that opposes dislocation motion to the right. C D

18 Stress Concentration at Dislocations
Don’t move past one another – hardens material Adapted from Fig. 7.4, Callister 7e.

19 Strengthening by Alloying
small impurities tend to concentrate at dislocations reduce mobility of dislocation  increase strength Adapted from Fig. 7.17, Callister 7e.

20 Strengthening by alloying
large impurities concentrate at dislocations on low density side Adapted from Fig. 7.18, Callister 7e.

21 Ex: Solid Solution Strengthening in Copper
• Tensile strength & yield strength increase with wt% Ni. Tensile strength (MPa) wt.% Ni, (Concentration C) 200 300 400 10 20 30 40 50 Yield strength (MPa) wt.%Ni, (Concentration C) 60 120 180 10 20 30 40 50 Adapted from Fig (a) and (b), Callister 7e. • Empirical relation: • Alloying increases sy and TS.

22 4 Strategies for Strengthening: 3: Precipitation Strengthening
• Hard precipitates are difficult to shear. Ex: Ceramics in metals (SiC in Iron or Aluminum). Side View precipitate Top View Slipped part of slip plane Unslipped part of slip plane S spacing Large shear stress needed to move dislocation toward precipitate and shear it. Dislocation “advances” but precipitates act as “pinning” sites with spacing S . • Result:

23 Application: Precipitation Strengthening
• Internal wing structure on Boeing 767 Adapted from chapter-opening photograph, Chapter 11, Callister 5e. (courtesy of G.H. Narayanan and A.G. Miller, Boeing Commercial Airplane Company.) • Aluminum is strengthened with precipitates formed by alloying. 1.5mm Adapted from Fig , Callister 7e. (Fig is courtesy of G.H. Narayanan and A.G. Miller, Boeing Commercial Airplane Company.)

24 4 Strategies for Strengthening: 4: Cold Work (%CW)
• Room temperature deformation. • Common forming operations change the cross sectional area: Adapted from Fig. 11.8, Callister 7e. -Forging A o d force die blank -Rolling roll A o d -Drawing tensile force A o d die -Extrusion ram billet container force die holder die A o d extrusion

25 Dislocations During Cold Work
• Ti alloy after cold working: 0.9 mm • Dislocations entangle with one another during cold work. • Dislocation motion becomes more difficult. Adapted from Fig. 4.6, Callister 7e. (Fig. 4.6 is courtesy of M.R. Plichta, Michigan Technological University.)

26 Result of Cold Work total dislocation length Dislocation density =
unit volume Dislocation density = Carefully grown single crystal  ca. 103 mm-2 Deforming sample increases density  mm-2 Heat treatment reduces density  mm-2 Again it propagates through til reaches the edge large hardening small hardening s e y0 y1 • Yield stress increases as rd increases:

27 Impact of Cold Work As cold work is increased
• Yield strength (sy) increases. • Tensile strength (TS) increases. • Ductility (%EL or %AR) decreases. Adapted from Fig. 7.20, Callister 7e.

28 Cold Work Analysis Cu Cu Cu • What is the tensile strength &
=12.2mm Copper • What is the tensile strength & ductility after cold working? D o =15.2mm % Cold Work 100 300 500 700 Cu 20 40 60 yield strength (MPa) % Cold Work tensile strength (MPa) 200 Cu 400 600 800 20 40 60 ductility (%EL) % Cold Work 20 40 60 Cu s y = 300MPa 300MPa 340MPa TS = 340MPa 7% %EL = 7% Adapted from Fig. 7.19, Callister 7e. (Fig is adapted from Metals Handbook: Properties and Selection: Iron and Steels, Vol. 1, 9th ed., B. Bardes (Ed.), American Society for Metals, 1978, p. 226; and Metals Handbook: Properties and Selection: Nonferrous Alloys and Pure Metals, Vol. 2, 9th ed., H. Baker (Managing Ed.), American Society for Metals, 1979, p. 276 and 327.)

29 s- e Behavior vs. Temperature
• Results for polycrystalline iron: -200C -100C 25C 800 600 400 200 Strain Stress (MPa) 0.1 0.2 0.3 0.4 0.5 Adapted from Fig. 6.14, Callister 7e. • sy and TS decrease with increasing test temperature. • %EL increases with increasing test temperature. • Why? Vacancies help dislocations move past obstacles. 3 . disl. glides past obstacle 2. vacancies replace atoms on the disl. half plane 1. disl. trapped by obstacle obstacle

30 Effect of Heating After %CW
• 1 hour treatment at Tanneal... decreases TS and increases %EL. • Effects of cold work are reversed! tensile strength (MPa) ductility (%EL) tensile strength ductility Recovery Recrystallization Grain Growth 600 300 400 500 60 50 40 30 20 annealing temperature (ºC) 200 100 700 • 3 Annealing stages to discuss... Adapted from Fig. 7.22, Callister 7e. (Fig. 7.22 is adapted from G. Sachs and K.R. van Horn, Practical Metallurgy, Applied Metallurgy, and the Industrial Processing of Ferrous and Nonferrous Metals and Alloys, American Society for Metals, 1940, p. 139.)

31 Recovery & Dislocation Movement
Adapted from Fig. 7.5, Callister 7e.

32 Recovery tR Annihilation reduces dislocation density. • Scenario 1
Results from diffusion extra half-plane of atoms Dislocations annihilate and form a perfect atomic plane. atoms diffuse to regions of tension • Scenario 2 tR 1. dislocation blocked; can’t move to the right Obstacle dislocation 3 . “Climbed” disl. can now move on new slip plane 2 . grey atoms leave by vacancy diffusion allowing disl. to “climb” 4. opposite dislocations meet and annihilate

33 f08_04_pg94 f08_04_pg94.jpg

34 Recrystallization • New grains are formed that:
-- have a small dislocation density -- are small -- consume cold-worked grains. 33% cold worked brass 0.6 mm Adapted from Fig (a),(b), Callister 7e. (Fig (a),(b) are courtesy of J.E. Burke, General Electric Company.) New crystals nucleate after 3 sec. at 580C. 0.6 mm

35 Further Recrystallization
• All cold-worked grains are consumed. After 4 seconds After 8 0.6 mm Adapted from Fig (c),(d), Callister 7e. (Fig (c),(d) are courtesy of J.E. Burke, General Electric Company.)

36 Grain Growth • At longer times, larger grains consume smaller ones.
• Why? Grain boundary area (and therefore energy) is reduced. After 8 s, 580ºC After 15 min, 0.6 mm Adapted from Fig (d),(e), Callister 7e. (Fig (d),(e) are courtesy of J.E. Burke, General Electric Company.) • Empirical Relation: elapsed time coefficient dependent on material and T. grain diam. at time t. exponent typ. ~ 2 Ostwald Ripening

37 Grain Growth Occurs by grain boundary migration.
Large grains grow at the expense of smaller grains. Grain Boundary movement occurs by short range diffusion of atoms from one side of the boundary to the other.

38 Grain Growth Atoms and Grain Boundaries move in opposite directions!!!

39 TR = recrystallization temperature
TR TR = recrystallization temperature Adapted from Fig. 7.22, Callister 7e.

40 Recrystallization Temperature, TR
TR = Recrystallization temperature = point of highest rate of property change Tm => TR  Tm (K) Due to diffusion  annealing time TR = f(t) shorter annealing time => higher TR Pure metals lower TR due to dislocation movements easier to move in pure metals => lower TR Cold work  below TR Hot work  above TR

41 Recrystallization Temperature for Metals

42 Summary • Dislocations are observed primarily in metals and alloys.
• Strength is increased by making dislocation movement difficult. • Particular ways to increase strength are to: --decrease grain size --solid solution strengthening --precipitation strengthening --cold work • Heating (annealing) can reduce dislocation density and increase grain size. This decreases the strength.


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