1. University of Wisconsin-Madison / SSEC
Iseg Board Layout Examination
N. Kitamura
University of Wisconsin-Madison / SSEC
September 4, 2003

2. Top View
The SMT components are located very close to the PMT mounting holes.
Toroid underside
Isolation AMP
RG180 output
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3. Coaxial Cable Attachment
Insufficient shield-to-ground isolation.
No board wash after manual soldering.
Exposed and twisted center conductor for signal output.
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4. Stacked SMT Capacitors
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5. Corona Point Near the Highest-Voltage Traces
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6. Bottom View
Numerous corona points near the PMT pins (only some of them are marked.)
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