1. Motion SPM™ Introduction
Advanced Information
Motion SPM™ Introduction
22st, Oct., 2007
Motion Control System Team
HV Functional Power Group

2. Motion SPM Portfolio SPIM (CI) SPIM (Inv) SPM2 SPM3 SPM4 SPM5 SPM6
Basic Structure
SPIM
(CI)
< 10kW
( 600V 75A
1200V 50A )
6-IGBT/FRD for inverter + Gate Driver with Protection(SC, UV) + Thermistor + 3-phase Rectifier
SPIM
(Inv)
< 10kW
( 600V 100A
1200V 75A )
6-IGBT/FRD for inverter + Gate Driver with Protection(SC,
UV) + Thermistor
SPM2
< 5kW
(600V 75A)
6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor + TSD function (from V4)
SPM3
< 2.2kW
(600V 30A)
6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Built-in Bootstrap diode & TSD function (from V4)
SPM4
< 1kW
(600V 15A)
6-IGBT / FRD for inverter + Gate driver with Protection (SC, UV, Soft Shut down) + Thermistor
SPM5
< 0.1kW
(500V 3A)-MOSFET
6-MOSFET for inverter + Gate driver with Protection
( UV) + OT,OC, FO function + Bootstrap diode (from V2)
SPM6
< 0.5kW
(500V 9A, 75V 75A) - MOSFET
2-MOSFET for inverter + Gate driver with Protection
( OC, OT, UV) + Bootstrap diode

3. External View SPIM Series SPM2 Series SPM3 Series SPM5 Series
SPM4 SIP1 Series
SPM4 SIP2 Series

4. with Ceramic substrate
Line-up of SPM2 and SPM3
60x31
44x26.8
PKG
SPM2 PKG with Ceramic
substrate
SPM2 PKG with DBC
SPM3 PKG
with Ceramic substrate
SPM3
Full-pack PKG
With DBC
Developed
SPM2 V1
600V-10/15/20/30A
FSAM10SH(M)60A
FSAM15SH(M)60A
FSAM20SH(M)60A
FSAM30SH(M)60A
600V-50A/75A
FSAM50SM60A
FSAM75SM60A
SPM3 V2
600V-3/5/10/15A
FSBS3/5/10/15CH60
SPM3 MOSFET
500V-5/6A
FCBS0550
FCBS0650
SPM3 V4
(P6, ’07 code S)
FSBF3CH60B
FSBF5CH60B(T)
FSBF10CH60B(T)
FSBF15CH60BT
600V-15/20/30A
FSBB15/20/30CH60
SRM 1phase-SPM3 : 600V-50A
FCAS50SN60
PSCM-SPM3 : 600V-20A
FSAB20PH60
PFCM-SPM3 : 600V-20/30/50A
FPDB20PH60,FPD(A)B30/50PH60
SPM3 V4 (P7,’07 code S)
FSBB15CH60B(T)
FSBB20CH60B(T)
FSBB30CH60B
Boost PFCM-SPM3 (P6,’07 code S) :
600V-30A FPAB30BH60
Developing
SPM2 V4
(P10,’08 code S)
600V-15/20/30/5075A
FSAM15CH60C
FSAM20CH60C
FSAM30CH60C
FSAM50CH60C
FSAM75CH60C
SPM3 V5
(P10, ’08 code S)
FSBF3CH60C
FSBF5CH60C
FSBF10CH60C
FSBF15CH60C
FSBB15CH60C
FSBB20CH60C
FSBB30CH60C

5. < Inner Bonding >
SPM2 V1
Line-up :
- 600V/10A, 15A, 20A, 30A – with Ceramic Substrate,
(Inner Bonding)
- 600V/50A, 75A – with DBC Substrate
(Out Bonding)
Major Applications : Consumer appliance inverters (Air conditioner, Treadmill) Low power industrial inverters
Feature :
- Built-in thermistor (NTC)
- Active Low
- Inner bonding/Out bonding
- Short-circuit protection with soft shut- down
control using sense-IGBTs
- Good thermal resistance and isolation capacity
with ceramic/DBC substrate
- 3 N-terminals for low-cost current sensing
< Inner Bonding >
< Out Bonding >

6. < Inner Bonding >
SPM2 V4
(under development)
Line-up :
- 600V/15A, 20A, 30A, 50A, 75A with DBC Substrate
Major Applications : Consumer appliance inverters (Air conditioner, Treadmill) Low power industrial inverters
Feature :
- Built-in thermistor (NTC)
- Active Low
- Inner bonding
- Built-in TSD(Thermal Shut Down) function
- Short-circuit protection with soft shut- down control
- High efficiency & robust NPT IGBT adopted
- Good thermal resistance and isolation capacity with
ceramic/DBC substrate
- 3 N-terminals for low-cost current sensing
< Inner Bonding >

7. SPM3 V2 < Out Bonding >
COM
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL) N U
(21) V
(22) W
(23)
U (24)
V (25)
W (26)
P (27)
(20) V
S(W)
(19) V
B(W)
(16) V
S(V)
(15) V
B(V)
(8) C SC
(7) C
FOD
(6) V FO
(5) IN
(WL)
(4) IN
(VL)
(3) IN
(UL)
(2) COM
(1) V CC
(L) VB
OUT VS IN
(18) V
CC(WH)
(17) IN
(WH)
(14) V
CC(VH)
(13) IN
(VH)
(12) V
S(U)
(11) V
B(U)
(10) V
CC(UH)
(9) IN
(UH) SL
Line-up : V/3A, 5A, 10A, 15A – with Ceramic Substrate
- 600V/15A, 20A, 30A – with DBC Substrate
Major Applications : Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, etc)
- Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing machine
Door Controller, etc)
Feature :
- Good thermal resistance
- Active High
- Out bonding
- Small size & Large pin-to-pin spacing
with zigzag package structure
- 3 N-terminals for low-cost current sensing
< Out Bonding >

8. < Inner Bonding >
SPM3 V4
Line-up :
- 600V/3A, 5A, 10A, 15A – with Full-pack PKG
- 600V/15A, 20A, 30A – with DBC Substrate
Major Applications : Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, etc)
- Low power industrial inverters
(Industrial inverter, Water pump, Treadmill, Sewing machine
Door Controller, etc)
Feature :
- Good thermal resistance
- Active High
- Inner bonding
- Small size & Large pin-to-pin spacing
with zigzag package structure
- Built-in Boot strap diodes
- Built-in TSD (Thermal Shut Down) function
- High efficiency & robust NPT IGBT adopted
- 3 N-terminals for low-cost current sensing
< Inner Bonding >

9. SPM3 MOSFET Line-up : - 500V/ 5A (1.35(typ.)), 6A (1.15(typ))
COM
VCC
IN(UL)
IN(VL)
IN(WL)
VFO
C(FOD)
C(SC)
OUT(UL)
OUT(VL)
OUT(WL) N U
(21) V
(22) W
(23)
U (24)
V (25)
W (26)
P (27)
(20) V
S(W)
(19) V
B(W)
(16) V
S(V)
(15) V
B(V)
(8) C SC
(7) C
FOD
(6) V FO
(5) IN
(WL)
(4) IN
(VL)
(3) IN
(UL)
(2) COM
(1) V CC
(L) VB
OUT VS IN
(18) V
CC(WH)
(17) IN
(WH)
(14) V
CC(VH)
(13) IN
(VH)
(12) V
S(U)
(11) V
B(U)
(10) V
CC(UH)
(9) IN
(UH) SL
Line-up : V/ 5A (1.35(typ.)), 6A (1.15(typ))
Major Applications : Low power consumer appliance inverters (Refrigerator, Fan)
Feature :
- 3-phase MOSFET inverter with driver IC
- Good thermal resistance
- Small size & Large pin-to-pin spacing
with zigzag package structure
- 3 N-terminals for low-cost current sensing
Chap. 2
SPM Introduction

10. PSCM - SPM3 Package PSC-SPM (Partial switching PFC)
Line-up : V/20A - SPM3 package with DBC
- 600V/30A - SPM3 package with DBC
(under development)
Major Applications :
- Low/Medium power consumer
appliances such as Room air conditioner
Feature :
- Good thermal resistance
- Same package as SPM3
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP

11. PFCM - SPM3 Package PFC-SPM (Full switching PFC)
Line-up : V/20A, 30A, 50A - SPM3 package with DBC
Major Applications : Medium/high power consumer appliance
such as Package/System air conditioner
Feature :
- Good thermal resistance
- Built-in shunt resistor (Optional)
- Same package as SPM3
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
- Tj = -20 ~ 150deg

12. Boost PFCM - SPM3 Package
Line-up :
- 600V/30A – SPM3 package with DBC
Major Applications : AC 85V ~ 264V single-phase front-end rectifier
- Mid-power application especially for an air conditioners
Feature :
- Low thermal resistance due to Al2O3-DBC substrate
- Active High
- Single-phase rectifier diode
- single-phase IGBT PWM semi-converter including a drive IC
for gate driving and protection
- Typical switching frequency of 20kHz
- Built-in thermistor for temperature sensing
- LVIC with UVP, OCP
- Tj = -20 ~ 150deg

13. SRM 1Phase - SPM3 Package Line-up : - 600V/50A - SPM3 package with DBC
Major Applications : Single-phase SRM drives (Vacuum cleaner)
Feature :
- Good thermal resistance
- Built-in thermistor (NTC)
- Small size & Large pin-to-pin spacing
with zigzag package structure
- Divided N-terminals for low-cost current sensing
Chap. 2
SPM Introduction

14. Line-up of SPM4, SPM5 and SPIM
* Gray color: Not fixed development plan
54x29.5
45x28
29x12
95x55
PKG
SPM4-SIP1 PKG
SPM4-SIP2 PKG
SPM5 PKG
SPIM PKG
Developed
SPM5 V1 DIP/SMD
500V - 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3(typ))
FSB50250(T/S),
FSB50450(T/S), FSB50550(T/S)
250V - 3A(1.4(typ))
FSB50325(T/S)
Developing
SPM4-SIP1
(P11, ’07 code S)
600V-10/16A
FDAU1060A
FDAU1660A
(Q2, ’08 code S)
600V-20/30A
FDAU2060A
FDAU3060A
SPM4-SIP2
(P6, ’08 code S)
600V-10/15A
FSAU10/15CH60
SRM 2phase-SIP2
(P10, ’07 code S)
600V- 10/20/30A
FCAS20/30DN60B
SPM5 V2 DIP/SMD
(P5, ’08 code S)
500V- 2/4/5A, 250V - 3A
FSB50250A(T/S), FSB50450A(T/S), FSB50550A(T/S), FSB50325A(T/S)
MV SPM5 DIP/SMD
60V- 20A( 48m (typ))
FSB52006(S)
SPIM 1200V
1200V- 30/45A(CI) (P9,’08 code S)
FSSR30/45CH120
1200V- 45A (Inv.) (P6,’08 code S)
FSSN45CH120
1200V- 30/60A (Inv.) (P9,’08 code S)
FSSN30CH120
FSSN60CH120
SPIM 600V
600V- 50/75A (CI) (Q2,’08 code S )
FSSR75CH60
600V- 50/75/100A (Inv.) (P10,’07 code S )
FSSN50CH60

15. SPM4 - SIP1 Package (under development)
Line-up : V/10A, 16A, 20A, 30A
Major Applications : Consumer appliance inverters (Air conditioner, Washing machine,
Refrigerator, Water pump, etc) Low power industrial inverters
(Fan Motor, Industrial Inverter, etc)
Feature :
- Large pin spacing and signal/power pins separation
- Single-In-Line package
- Active High
- 3 N-terminals for low-cost current sensing
- Built-in thermistor
- High efficiency & robust NPT IGBT adopted

16. SPM4 - SIP2 Package (under development) Line-up : - 600V/ 10A, 15A
Major Applications : Consumer appliance inverters (Air conditioner, Washing machine, Refrigerator, Water pump, etc) Low power industrial inverters
(Fan Motor, Industrial Inverter, etc)
Feature :
- Cross-Conduction Prevention Logic
- Single-In-Line package
- Active High
- 3 N-terminals for low-cost current sensing
- Built-in thermistor
- High efficiency & robust NPT IGBT adopted

17. SRM 2phase - SIP2 Package (under development)
Line-up :
- 600V/ 10A, 20A, 30A
Major Applications : phase SRM drives (Vacuum cleaner)
Feature :
- 2-phase asymmetric bridge converter
- Active High
- Single-In-Line package
- Built-in bootstrap diode
- Built-in thermistor (NTC)
- Low saturation voltage
- Large pin spacing and signal/power pins separation
- High efficiency & robust NPT IGBT adopted
Gray color : Not fixed development plan

18. SPM5 V1 Line-up : - V1 SPM5 DIP:
500V/2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))
& 250V/3A(1.4 (typ))
- V1 SPM5 SMD: 500V/2A, 4A, 5A & 250V/3A
- MV SPM5 DIP and SMD : 60V/20A( 48m(typ) )
(Under development)
- Transfer-molded full-pack package
Major Applications : Fan motor, water pump, etc Small motor applications up to 150W
Feature :
- High power density compared to small package Ruggedness (Switching and short-circuit) Low conducted and radiated EMI (Slow dV/dt & dI/dt)
- HVIC with UVP

19. SPM5 V2 (under development) DIP SMD Double DIP Line-up :
- V2 SPM5 DIP:
500V/ 2A(3.3(typ)), 4A(1.9(typ)), 5A(1.3 (typ))
& 250V/ 3A(1.4 (typ))
- V2 SPM5 SMD: 500V/ 2A, 4A, 5A & 250V - 3A
- Transfer-molded full-pack package
Major Applications : Fan motor, water pump, etc Small motor applications up to 150W
Feature :
- High power density compared to small package Ruggedness (Switching and short-circuit) Low conducted and radiated EMI (Slow dV/dt & dI/dt)
- HVIC with UVP
- Built-in bootstrap diode
- No external REH connection
- Multi-function I/O, FO

20. SPIM-CI (under development) < 1200V > < 600V >
Line-up : V/ 30A, 45A
- 600V/ 50A, 75A
- Transfer-molded DBC package
Major Applications : Industrial Inverter, System A/C
Feature :
- High power density in a small package phase Rectifier and IGBT inverter
- Built-in Thermistor for temperature sensing
- Good thermal resistance
- 3 N-terminals for low-cost current sensing
< 1200V >
< 600V >
Gray color : Not fixed development plan

21. SPIM-INV (under development) < 1200V > < 600V >
Line-up : V/ 30A, 45A, 60A
- 600V/ 50A, 75A, 100A
- Transfer-molded DBC package
Major Applications : Industrial Inverter, System A/C
Feature :
- High power density in a small package
- 3-phase IGBT inverter
- Built-in Thermistor for temperature sensing
- Good thermal resistance
- 3 N-terminals for low-cost current sensing
< 1200V >
< 600V >
Gray color : Not fixed development plan

22. SPM6 (under development) Not fixed 10.5x26 Line-up : (Q2, ’08 code S)
- 500V/ 9A, 13A MOSFET (UNIFET)
- 600V/ 3A, 5A, 8A IGBT (NPT IGBT)
- 75V/ 75A MOSFET (ULTRAFET, PT3 MOSFET)
Major Applications : Consumer appliance inverters (Washing machine, Refrigerator, etc) E-Bike, Power Tools (B&D)
Feature :
- Single-In-Line 9-SIP compact package
- Built-in fault-out and external shut-down functions
- Built-in Bootstrap diode
- OC, OT, UV protection Function
- FO function(not fixed)
- Thermal Shut-down(not fixed)
- Two kinds of Form Package(9-SIP-Y or 9-SIP-L)
Not fixed

23. Thank You.