1. Electronics Interconnection at NPL
Training
Consultancy
Investigations
and validation
Underpinning research
Collaborative or
single client work
Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018

2. Areas of Interest ~ what we do
Micromechanical Testing Instruments
Prognostics
Smart textiles
Coatings
PCB reliability
Circular economy
Sintered Interconnects
Plastic Electronics ~ inks
Advanced Conductive Adhesives
Carbon Nanotube Interconnects
SnPb & Pb-Free
Moisture Diffusion
Tin Whiskers
Thermal properties
SIR, SAM, XRF, … + access to many more facilities in NPL

3. Drivers & Metrology Drivers for electronics are:
Miniaturisation (Moore's Law)
Robustness (use in harsh conditions)
Materials (legislation)
New areas (wearable electronics)
Supporting Industry (Aerospace, Automotive, Space, Health, and more)
NPL is developing metrology for interconnect materials
Tools to validate performance across a number of areas
Combining electrical, mechanical, chemical, & thermal properties in mixed material systems and environments
Tin whisker cause unpredictable shorts that have caused satellites to fail and nuclear power stations to shutdown.

4. Sector Impact of NPL EI work
Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018

5. Capability and interests in characterising interconnects
Mechanical properties characterisation of interconnects
Purpose designed equipment
Time dependent properties
Microstructural evolution in fatigue
Polymer degradation
Electrical effects
Thermal effects
Electrochemical characterisation
Thin films at the surface and subsurface
Material systems
Smart textiles
Solders, adhesives
Substrate
Coatings
Plastic electronics & end-of-life
High temperature performance
Nano-carbon interconnect
Sintered interconnects
Substrates
Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018Wednesday, 07 November 2018

6. Tutorials (webinar based)
Electronic assembly performance
Environmental Robustness: Measuring Performance Coatings and High Temperature Interconnects
BGA Reliability - The Effects of Solder Joint Voiding and Uneven Stand-Off Height
Tin Whiskers Evaluation Techniques & Benefits of Conformal Coating
Assessment of Re-terminated RoHS Components for SnPb Applications
Practical Applications for Printed Electronics
Analytical techniques
How to Test and Qualify Packages with Scanning Acoustic Microscopy
Cleanliness Assessment Using Solvent Extract and Ionic Extraction to Improve Reliability
Using Mechanical Testing to Diagnose Design, Product & Process Failures
Characterisation of Solder Joints, Test Methods & Typical Failure Modes
Using Surface Insulation Resistance (SIR) to Qualify Production Processes & Materials
Solderability Assessment - Testing, Ageing & Practical Impact on Assembly Yield
X-Ray Fluorescence Testing Results with Laboratory & Handheld Systems

7. Tutorials (webinar based)
PCB issues
Effectiveness of Baking to Remove Moisture from Between PCB Ground Planes
CAF Conductive Anodic Filaments - How To Avoid Failure
Process tools
Guide to Temperature Profiling for Wave, Reflow and Selective Soldering
Benefits of Using Nitrogen During Soldering and Determining PPM Levels
Impact of Copper Dissolution in Lead-Free Manufacture with Different Alloys
Novel systems
Functionalisation and Applications of Nanomaterials for Electronic Applications
Reuse of Electronic Products
Practical Applications for Nano Electronics

8. Training & Practical Workshops
Cleaning Printed Circuit Assemblies, Design & Process Control
Package on Package (PoP), STACK Assembly, Rework and Inspection
BMC (Bottom Mounted Component) LGA (Land Grid Array) QFN (Quad Flat No-lead) Design,
Printed Circuit Board Inspection and Quality Control
Practical Failure Analysis & How to Do it in Printed Board Assembly
Counterfeit Component Workshop- Causes and Cures
Troubleshooting Your Lead Free Assembly Yields - On Site or Offshore
Lead-Free Selective Soldering, Design, Quality Control
Vapour Phase & Convection Reflow – Selecting a Reflow Process
Conformal Coating Application and Inspection Workshop
BGA, CSP and Flip Chip PCB Design and Assembly
Flexible Circuit Board Design and Assembly with Lead-Free Alloys
PCB Microsectioning and Analysis of Failure Quality Standards
Component Design, Assembly and Inspection
Basic Printed Circuit Board Manufacture and Process Defects
Double Sided Reflow Design and Assembly
Ball Grid Array Technology Design, Assembly and Inspection
Practical X-Ray Inspection of BGA and Quality Standards
Printed Board Design for Manufacture and Assembly in Lead Free
Pin in Hole/Intrusive Reflow Design and Assembly
Wire Preparation and Crimping Workshop
Lead-Free Assembly and Soldering
Hand Soldering and De-Soldering
Hands On Solder Paste and Stencil Printing
Quality Control of Surface Mount Assemblies
Hands On Wave Soldering
Static Control in Electronic Assembly
Design and Assembly of SMT Boards
Rework and Repair of Surface Mount and BGA
A-Z of Modern Electronic Assembly of PCBs
Reflow Soldering and Temperature Profiling
Selecting Solderable Finishes for BGA and Fine Pitch Assembly
PCB Microsectioning and Analysis of Failure Quality Standards