1. FPC1011F
Introduction of a new sensor package

2. FPC1011F Summary: FPC has invested + 1 000 KUSD High quality design
Electrically compatible with FPC1011C
Available as solderable component
New high quality supplier chain
Production start June 2008

3. FPC1011F Product improvements: BT substrate + High quality FR4
+ No silver migration or oxide
- May need mechanical support from underneath

4. FPC1011F Product improvements: BT substrate Film Assisted Moulding
+ Standard mould method
+ Embedded passives
+ Protects silicon edges

5. FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact
+ Custom design of flex film (length etc.)
- Sourced by customer

6. FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact
Available for soldering with BGA
+ Enables automated assembly process
+ Low cost

7. FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact
Available for soldering with BGA
New hard coating
+ Mass production process, applied on wafer
+ Not sensitive to scratches,
- May give ESD footprint under extreme conditions

8. FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact
Available for soldering with BGA
New hard coating
- May give ESD footprint under extreme conditions:
Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers.
Disappears over time (typically by 30% after 3 days)
Conditions for possible appearance:
Low humidity, typically northern China (may bring high voltage ESD discharges),
High humidity, typically southern China (may bring wet skin properties),
Electrode approach from top & discharge via sensor surface.
Not observed by live finger discharge.

9. FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact
Available for soldering with BGA
New hard coating
Metal frame
+ More robust versus plastic frame in FPC1011C
+ Available in different forms
+ Colour and surface conditions (default Satine finish metal colour)
- Needs minimum order quantity

10. FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact
Available for soldering with BGA
New hard coating
Metal frame available in different forms

11. New Supplier chain Production improvements: Assembly managed by Amkor
+ No. one package supplier world wide
Full automated production process
+ High volume capacity
+ Repeatable high quality process
Well defined qualification process
+ High product quality
- Longer product change time

12. New Supplier chain
Production process:
Silicon production

13. New Supplier chain Production process: Spin coating process
Silicon production
Coating
Spin coating process

14. New Supplier chain Production process: Silicon production Coating
Packaging
Wafer dicing
Die attach
Wire bonding
Passives
FIM mould
Frame assembly
Flex contact assembly
Test & outgoing inspection

15. FPC1011F Customer feedback: Thank you for your attention ! Questions?
Acceptable product?
Thank you for your attention !